Electronic Devices Comprising Two Encapsulant Films

    公开(公告)号:US20190140122A1

    公开(公告)日:2019-05-09

    申请号:US16222112

    申请日:2018-12-17

    Abstract: An electronic device comprises a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet. The first encapsulating film has a zero shear viscosity greater than that of the second encapsulating film. The back sheet of the electronic device contains fewer bumps than the back sheet of a comparable electronic device having a first encapsulating film with a zero shear viscosity less than or equal to that of the second encapsulating film.

    ELECTRONIC DEVICE MODULE COMPRISING POLYOLEFIN COPOLYMER
    5.
    发明申请
    ELECTRONIC DEVICE MODULE COMPRISING POLYOLEFIN COPOLYMER 有权
    包含聚烯烃共聚物的电子器件模块

    公开(公告)号:US20130118583A1

    公开(公告)日:2013-05-16

    申请号:US13667744

    申请日:2012-11-02

    Abstract: An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an ∀-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/∀-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

    Abstract translation: 一种电子设备模块,包括:A.至少一个电子设备,例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合物材料,所述聚合材料包含(1)聚烯烃共聚物, (a)小于约0.90g / cc的密度,(b)通过ASTM D-882-02测量的小于约150兆帕(mPa)的2%割线模量中的至少一个),(c) 熔点小于约95℃,(d)基于聚合物的重量,至少约15至小于约50重量%的烯烃含量,(e)小于约-35℃的Tg, 和(f)至少约50的SCBDI,(2)任选的自由基引发剂,例如过氧化物或偶氮化合物,或光引发剂,例如二苯甲酮,和(3)任选的助剂。 通常,聚烯烃共聚物是乙烯/∀-烯烃共聚物。 任选地,聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂,并且共聚物可保持未交联或交联。

    VINYLIDENE CHLORIDE POLYMER COMPOSITIONS AND ARTICLES COMPRISING THE SAME

    公开(公告)号:US20200048448A1

    公开(公告)日:2020-02-13

    申请号:US15738866

    申请日:2016-08-17

    Abstract: The present invention relates generally to vinylidene chloride polymer compositions. In one embodiment, a vinylidene chloride polymer composition comprises (a) a vinylidene chloride polymer formed from a monomer mixture comprising from 60 to 99 weight percent vinylidene chloride monomer and from 40 to 1 weight percent of a monoethylenically unsaturated monomer copolymerizable therewith; (b) 0.3 to 5 weight percent of an acrylic polymer based on the total weight of the polymer composition; and (c) 0.2 to 7 weight percent of at least one additive comprising (i) at least one wax in an amount of from 0.01 to 2 weight percent based on the total weight of the polymer composition, (ii) at least one polyethylene having a density greater than 0.940 g/cm3 in an amount of from 0.1 to 5 weight percent based on the total weight of the polymer composition, or combinations thereof.

    SILANE-CONTAINING ETHYLENE INTERPOLYMER FORMULATION INCLUDING FILMS AND ELECTRONIC DEVICE MODULE COMPRISING SAME
    9.
    发明申请
    SILANE-CONTAINING ETHYLENE INTERPOLYMER FORMULATION INCLUDING FILMS AND ELECTRONIC DEVICE MODULE COMPRISING SAME 有权
    含有乙烯的乙烯嵌段共聚物配方包括膜和包含其的电子器件模块

    公开(公告)号:US20150013753A1

    公开(公告)日:2015-01-15

    申请号:US14371136

    申请日:2013-02-01

    Abstract: Disclosed in more detail in this application are ethylene interpolymer films having one or more layers, comprising surface layer comprising: (A) a silane-containing ethylene interpolymer comprising (1) an ethylene interpolymer having a density of less than 0.905 g/cm3, and (2) at least 0.1 percent by weight alkoxysilane; characterized by: (3) having a volume resistivity of greater than 5×1015 ohm-cm as measured at 60 C. In one embodiment, such ethylene interpolymer has a residual boron content of less than 10 ppm and residual aluminum content of less than 100 ppm. Also disclosed are laminated electronic device modules comprising: A. at least one electronic device, and B. one of the ethylene interpolymer films as described above in intimate contact with at least one surface of the electronic device. Such laminated electronic device modules according to the invention have been shown to suffer reduced potential induced degradation (“PID”).

    Abstract translation: 在本申请中更详细地公开的是具有一层或多层的乙烯互聚物膜,其包含表面层,其包含:(A)含硅烷的乙烯互聚物,其包含(1)密度小于0.905g / cm 3的乙烯互聚物,以及 (2)至少0.1重量%的烷氧基硅烷; 其特征在于:(3)在60℃下测量的体积电阻率大于5×1015欧姆 - 厘米。在一个实施方案中,这种乙烯互聚物的残余硼含量小于10ppm,残余铝含量小于100 ppm。 还公开了层压电子器件模块,其包括:A.至少一个电子器件,以及B.如上所述的乙烯互聚物膜之一,与电子器件的至少一个表面紧密接触。 已经示出了根据本发明的这种层压电子器件模块遭受降低的电位诱导退化(“PID”)。

    ELECTRONIC DEVICE MODULE COMPRISING AN ETHYLENE MULTI-BLOCK COPOLYMER
    10.
    发明申请
    ELECTRONIC DEVICE MODULE COMPRISING AN ETHYLENE MULTI-BLOCK COPOLYMER 有权
    包含乙烯多嵌段共聚物的电子器件模块

    公开(公告)号:US20130112270A1

    公开(公告)日:2013-05-09

    申请号:US13667722

    申请日:2012-11-02

    Abstract: An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.

    Abstract translation: 电子设备模块包括:A.至少一个电子设备,例如太阳能电池和B.与电子设备的至少一个表面紧密接触的聚合材料,聚合物材料包含乙烯多嵌段共聚物。 通常,聚烯烃材料是密度小于约0.90克/立方厘米(g / cc)的乙烯多嵌段共聚物。 聚合物材料可以完全封装电子器件,或者它可以层压到器件的一个表面。 任选地,聚合物材料还可以包含焦烧抑制剂,并且该共聚物可以保持未交联或可以交联。

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