公开(公告)号：US20230193028A1

公开(公告)日：2023-06-22

申请号：US17911622

申请日：2020-03-16

Applicant: DOW SILICONES CORPORATION

Inventor： Chong XING ,  Dorab Edul BHAGWAGAR ,  Qiang HUANG ,  Lu ZOU ,  Rui YANG ,  Junmin ZHU

IPC: C08L83/04 ,  C08K3/22

CPC classification number: C08L83/04 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2201/005 ,  C08K2201/001

Abstract: A thermal conductive silicone composition is provided. The composition comprises: (A) an organopolysiloxane having at least two silicon atom-bonded alkenyl groups with 2 to 12 carbon atoms per molecule; (B) an organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per molecule; (C) an organopolysiloxane having at most two silicon atom-bonded hydrogen atoms per molecule; (D) an aluminum hydroxide powder, such as a mixture of an aluminum hydroxide powder having an average particle size of at least 0.1 μm and less than 5 μm and an aluminum hydroxide powder having an average particle size of 5 μm to 50 μm; and (E) a hydrosilylation reaction catalyst. The composition cures to form a thermal conductive soft material. The material generally has little to no change in hardness even if the composition is cured after long-term storage.

公开(公告)号：US20210269643A1

公开(公告)日：2021-09-02

申请号：US17253744

申请日：2018-06-27

Applicant: DOW SILICONES CORPORATION

Inventor： Yan ZHENG ,  Zhongwei CAO ,  Qiang HUANG ,  Rui YANG ,  Sandrine TEIXEIRA de CARVALHO ,  Lujing XIE

IPC: C08L83/04 ,  C08K5/00 ,  H01M10/625 ,  H01M10/66

Abstract: A thermally conductive silicone composition is provided. The composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane having an average of two to four silicon-bonded hydrogen atoms in a molecule, wherein an amount of the silicon-bonded hydrogen atoms in component (B) is 0.2 to 5 moles per mole of the alkenyl groups in component (A), and at least two of the silicon-bonded hydrogen atoms are located on the side chains of the molecule; (C) a hydrosilylation reaction catalyst; (D) a thermally conductive filler; (E) an alkoxysilane having an alkyl group containing 6 or more carbon atoms in a molecule; and (F) glass beads. A thermally conductive member is produced from the thermally conductive silicone composition. An electronic device has the thermally conductive member and a manufacturing method of the electronic device includes using the thermally conductive silicone composition.