公开(公告)号：US20230193028A1

公开(公告)日：2023-06-22

申请号：US17911622

申请日：2020-03-16

Applicant: DOW SILICONES CORPORATION

Inventor： Chong XING ,  Dorab Edul BHAGWAGAR ,  Qiang HUANG ,  Lu ZOU ,  Rui YANG ,  Junmin ZHU

IPC: C08L83/04 ,  C08K3/22

CPC classification number: C08L83/04 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2201/005 ,  C08K2201/001

Abstract: A thermal conductive silicone composition is provided. The composition comprises: (A) an organopolysiloxane having at least two silicon atom-bonded alkenyl groups with 2 to 12 carbon atoms per molecule; (B) an organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per molecule; (C) an organopolysiloxane having at most two silicon atom-bonded hydrogen atoms per molecule; (D) an aluminum hydroxide powder, such as a mixture of an aluminum hydroxide powder having an average particle size of at least 0.1 μm and less than 5 μm and an aluminum hydroxide powder having an average particle size of 5 μm to 50 μm; and (E) a hydrosilylation reaction catalyst. The composition cures to form a thermal conductive soft material. The material generally has little to no change in hardness even if the composition is cured after long-term storage.

公开(公告)号：US20200308404A1

公开(公告)日：2020-10-01

申请号：US16629162

申请日：2017-09-29

Applicant: DOW SILICONES CORPORATION

Inventor： Zhihua LIU ,  Peng WEI ,  Hexiang YAN ,  Yi ZHAO ,  Qi CHEN ,  Junmin ZHU

IPC: C08L83/04 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08K3/36 ,  C08K3/013 ,  C08G77/00

Abstract: Provided are a composition, a cured polymer material formed from said composition, a method for forming a thermally conductive material on an article and an article having a thermally conductive material. Said thermally conductive material can be formed on an electronic device, and can be peeled off from said electronic device.