公开(公告)号：US20100216667A1

公开(公告)日：2010-08-26

申请号：US12640481

申请日：2009-12-17

Applicant: Brian K. Meyer ,  Leonardo R. Allain ,  David Geer ,  Rajiv Mahajan ,  David R. Walker ,  Marc J. Kirchmeier

Inventor： Brian K. Meyer ,  Leonardo R. Allain ,  David Geer ,  Rajiv Mahajan ,  David R. Walker ,  Marc J. Kirchmeier

IPC: C40B30/10 ,  G01N27/26 ,  G01N30/02 ,  H01J49/26 ,  G01R33/44 ,  G01N21/47

CPC classification number: G01R33/44 ,  G01N24/08 ,  G01N24/085 ,  G01N33/15 ,  G01N2030/8827 ,  G01N2030/8831

Abstract: Disclosed is a system or matrix approach for determining compatibility of a pharmaceutically active substance, such as small molecule drug candidate, therapeutic proteins, peptides, vaccines or RNAi, with materials used in the research and development of pharmaceuticals, including plastics, polymers, resins, rubbers, elastomers, glass and steel.

Abstract translation: 公开了用于确定药物活性物质如小分子候选药物，治疗性蛋白质，肽，疫苗或RNAi的相容性的系统或基质方法与用于研究和开发药物的材料，包括塑料，聚合物，树脂， 橡胶，弹性体，玻璃和钢。

公开(公告)号：US07312690B1

公开(公告)日：2007-12-25

申请号：US11614243

申请日：2006-12-21

Applicant: David Geer

Inventor： David Geer

IPC: H01C7/10 ,  H01C7/13

CPC classification number: G01K1/12 ,  G01K7/22 ,  G01K2205/04

Abstract: A temperature sensor includes a probe section for insertion into a hot zone. The probe section includes a thermistor, a first lengthy pin terminating at the thermistor, and a second lengthy pin also terminating at the thermistor. A housing section is on one end of the probe section and outside of the hot zone. The housing section includes a first spring which biases the first pin into contact with the thermistor, a second spring which biases the second pin into contact with the thermistor, a first electrical contact engaged with the first spring, and a second electrical contact engaged with the second spring.

Abstract translation: 温度传感器包括用于插入热区的探针部分。 探针部分包括热敏电阻，终止于热敏电阻的第一冗长的引脚，以及也终止于热敏电阻的第二长度的引脚。 壳体部分位于探头部分的一端和热区外部。 壳体部分包括第一弹簧，其将第一销偏压到与热敏电阻接触;第二弹簧，其将第二销偏压到与热敏电阻接触;第一电触点，与第一弹簧接合;以及第二电触点， 第二春

公开(公告)号：US20070126548A1

公开(公告)日：2007-06-07

申请号：US11648919

申请日：2007-01-03

Applicant: Aaron Knobloch ,  Jeffrey Fortin ,  David Geer

Inventor： Aaron Knobloch ,  Jeffrey Fortin ,  David Geer

IPC: H01C7/13

CPC classification number: H01C7/008 ,  H01C17/08 ,  Y10T29/49082 ,  Y10T29/49083

Abstract: According to some embodiments, a first layer of doped material may be provided to form a resistor. A second layer of undoped material may then be formed on the first layer. The first layer might comprise, for example, a layer of doped silicon carbide while the second layer comprises a layer of undoped silicon carbide. The resistance of the resistor may then be measured to determine a temperature.

Abstract translation: 根据一些实施例，可以提供第一掺杂材料层以形成电阻器。 然后可以在第一层上形成第二层未掺杂的材料。 第一层可以包括例如掺杂碳化硅层，而第二层包括未掺杂的碳化硅层。 然后可以测量电阻器的电阻以确定温度。