公开(公告)号：US07209011B2

公开(公告)日：2007-04-24

申请号：US11146337

申请日：2005-06-06

申请人： David R. Welland ,  John B. Pavelka ,  Edmund G. Healy

发明人： David R. Welland ,  John B. Pavelka ,  Edmund G. Healy

IPC分类号： H01L21/60

CPC分类号： H03L7/10 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H03L7/099 ,  H03L7/18 ,  H03L7/199 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A semiconductor package includes a package substrate and an integrated circuit. The package substrate has a first surface. The integrated circuit couples electrically to the first surface of the package substrate. The integrated circuit and the package substrate together form the semiconductor package. The semiconductor package also includes a first inductance circuit and a second inductance circuit, both formed within the semiconductor package. The first and second inductance circuits couple to each other in parallel. The first and second inductance circuits have substantially symmetrical geometric characteristics.

摘要翻译： 半导体封装包括封装基板和集成电路。 封装基板具有第一表面。 集成电路电耦合到封装衬底的第一表面。 集成电路和封装衬底一起形成半导体封装。 半导体封装还包括形成在半导体封装内的第一电感电路和第二电感电路。 第一和第二电感电路并联耦合。 第一和第二电感电路具有基本上对称的几何特征。

公开(公告)号：US06903617B2

公开(公告)日：2005-06-07

申请号：US10081730

申请日：2002-02-22

申请人： Lysander Lim ,  David R. Welland ,  John B. Pavelka ,  Edmund G. Healy

发明人： Lysander Lim ,  David R. Welland ,  John B. Pavelka ,  Edmund G. Healy

IPC分类号： H01L23/66 ,  H03B5/00 ,  H03L7/099 ,  H03L7/10 ,  H03L7/18 ,  H03L7/199 ,  H03K3/02

CPC分类号： H03L7/10 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H03L7/099 ,  H03L7/18 ,  H03L7/199 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A semiconductor package includes a package substrate and an integrated circuit. The package substrate has a first surface. The integrated circuit couples electrically to the first surface of the package substrate. The integrated circuit and the package substrate together form the semiconductor package. The semiconductor package also includes a first inductance circuit and a second inductance circuit, both formed within the semiconductor package. The first and second inductance circuits couple to each other in parallel. The first and second inductance circuits have substantially symmetrical geometric characteristics.

公开(公告)号：US06323735B1

公开(公告)日：2001-11-27

申请号：US09579151

申请日：2000-05-25

申请人： David R. Welland ,  John B. Pavelka ,  Edmund G. Healy

发明人： David R. Welland ,  John B. Pavelka ,  Edmund G. Healy

IPC分类号： H01L2160

CPC分类号： H03L7/099 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H03L7/199 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method and apparatus for synthesizing high-frequency signals that overcomes integration problems while meeting demanding phase noise and other impurity requirements. In one embodiment, on-package oscillator circuit inductors are provided for band selection purposes, with no external package connection to connect off-package or external inductors to on-package inductance circuits. Multiple package electrical connection points may also be provided on-package to allow for selection of alternate oscillator inductance values during package assembly.

摘要翻译： 一种用于合成高频信号的方法和装置，其克服了集成问题，同时满足苛刻的相位噪声和其他杂质要求。 在一个实施例中，提供了封装振荡器电路电感器用于频带选择目的，而没有外部封装连接以将封装外部电感器或外部电感器连接到封装电感电路。 也可以在封装上提供多封装电连接点，以允许在封装组装期间选择替代振荡器电感值。