公开(公告)号：US20190013736A1

公开(公告)日：2019-01-10

申请号：US16130850

申请日：2018-09-13

Applicant: Delta Electronics, Inc.

Inventor： Shouyu Hong ,  Qingdong Chen ,  Kai Lu ,  Pengkai Ji ,  Xiaoni Xin ,  Min Zhou ,  Yu Zhang ,  Jianhong Zeng

IPC: H02M3/158 ,  G06F1/32 ,  H01F27/28

Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

公开(公告)号：US20250088110A1

公开(公告)日：2025-03-13

申请号：US18961423

申请日：2024-11-26

Applicant: Delta Electronics, Inc.

Inventor： Shouyu Hong ,  Qingdong Chen ,  Kai Lu ,  Pengkai Ji ,  Xiaoni Xin ,  Min Zhou ,  Yu Zhang ,  Jianhong Zeng

IPC: H02M3/158 ,  G06F1/16 ,  G06F1/3234 ,  H01F27/28 ,  H01F41/12 ,  H01L25/00 ,  H02M3/155

Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

公开(公告)号：US20220149738A1

公开(公告)日：2022-05-12

申请号：US17584926

申请日：2022-01-26

Applicant: Delta Electronics, Inc.

Inventor： Shouyu Hong ,  Qingdong Chen ,  Kai Lu ,  Pengkai Ji ,  Xiaoni Xin ,  Min Zhou ,  Yu Zhang ,  Jianhong Zeng

IPC: H02M3/158 ,  G06F1/3234 ,  H01F27/28 ,  H01L25/00 ,  G06F1/16 ,  H01F41/12

Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

公开(公告)号：US11277067B2

公开(公告)日：2022-03-15

申请号：US16130850

申请日：2018-09-13

Applicant: Delta Electronics, Inc.

Inventor： Shouyu Hong ,  Qingdong Chen ,  Kai Lu ,  Pengkai Ji ,  Xiaoni Xin ,  Min Zhou ,  Yu Zhang ,  Jianhong Zeng

IPC: H01F27/28 ,  H02M3/158 ,  G06F1/3234 ,  H01L25/00 ,  G06F1/16 ,  H01F41/12 ,  H02M3/155

Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.