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公开(公告)号：US20220149738A1
公开(公告)日：2022-05-12
申请号：US17584926
申请日：2022-01-26
Applicant: Delta Electronics, Inc.
Inventor： Shouyu Hong , Qingdong Chen , Kai Lu , Pengkai Ji , Xiaoni Xin , Min Zhou , Yu Zhang , Jianhong Zeng
Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.
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Patent Agency Ranking
公开(公告)号：US11277067B2
公开(公告)日：2022-03-15
申请号：US16130850
申请日：2018-09-13
Applicant: Delta Electronics, Inc.
Inventor： Shouyu Hong , Qingdong Chen , Kai Lu , Pengkai Ji , Xiaoni Xin , Min Zhou , Yu Zhang , Jianhong Zeng
Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.
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公开(公告)号：US11245214B2
公开(公告)日：2022-02-08
申请号：US16934076
申请日：2020-07-21
Applicant: Delta Electronics, Inc.
Inventor： Shouyu Hong , Qingdong Chen , Ganyu Zhou , Pengkai Ji , Yiqing Ye , Zhenqing Zhao
IPC: H01R13/22 , H01R12/71 , H01R43/16 , H01R13/405
Abstract: The present disclosure provides a connector which is a combination of at least one power pin, one plastic member, and one signal pin, wherein the power pin includes a columnar metal block, each plastic member is connected to the columnar metal block at side surface, each signal pin is attached to a side surface of the plastic member, and extends to two bottom surfaces of the plastic member to form contact surfaces with predetermined areas on the two bottom surfaces; wherein, the contact surface on first bottom surface of the plastic member is flush with first bottom surface of the metal block, and the contact surface on second bottom surface of the plastic member is flush with second bottom surface of the metal block.
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公开(公告)号：US10784612B2
公开(公告)日：2020-09-22
申请号：US16234861
申请日：2018-12-28
Applicant: Delta Electronics, Inc.
Inventor： Shouyu Hong , Qingdong Chen , Ganyu Zhou , Pengkai Ji , Yiqing Ye , Zhenqing Zhao
IPC: H01R13/22 , H01R12/71 , H01R43/16 , H01R13/405
Abstract: The present disclosure provides a connector which is a combination of at least one power pin, one plastic member, and one signal pin, wherein the power pin includes a columnar metal block, each plastic member is connected to the columnar metal block at side surface, each signal pin is attached to a side surface of the plastic member, and extends to two bottom surfaces of the plastic member to form contact surfaces with predetermined areas on the two bottom surfaces; wherein, the contact surface on first bottom surface of the plastic member is flush with first bottom surface of the metal block, and the contact surface on second bottom surface of the plastic member is flush with second bottom surface of the metal block.
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公开(公告)号：US20190013736A1
公开(公告)日：2019-01-10
申请号：US16130850
申请日：2018-09-13
Applicant: Delta Electronics, Inc.
Inventor： Shouyu Hong , Qingdong Chen , Kai Lu , Pengkai Ji , Xiaoni Xin , Min Zhou , Yu Zhang , Jianhong Zeng
Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.
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公开(公告)号：US20250088110A1
公开(公告)日：2025-03-13
申请号：US18961423
申请日：2024-11-26
Applicant: Delta Electronics, Inc.
Inventor： Shouyu Hong , Qingdong Chen , Kai Lu , Pengkai Ji , Xiaoni Xin , Min Zhou , Yu Zhang , Jianhong Zeng
Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.
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