公开(公告)号：US20250088110A1

公开(公告)日：2025-03-13

申请号：US18961423

申请日：2024-11-26

Applicant: Delta Electronics, Inc.

Inventor： Shouyu Hong ,  Qingdong Chen ,  Kai Lu ,  Pengkai Ji ,  Xiaoni Xin ,  Min Zhou ,  Yu Zhang ,  Jianhong Zeng

IPC: H02M3/158 ,  G06F1/16 ,  G06F1/3234 ,  H01F27/28 ,  H01F41/12 ,  H01L25/00 ,  H02M3/155

Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

公开(公告)号：US11503731B2

公开(公告)日：2022-11-15

申请号：US17004194

申请日：2020-08-27

Applicant: Delta Electronics,Inc.

Inventor： Haoyi Ye ,  Jianhong Zeng ,  Yu Zhang ,  Peiqing Hu ,  Ziying Zhou

IPC: H05K7/02 ,  H05K7/10 ,  H05K1/14 ,  H05K1/02 ,  G06F1/20 ,  G06F1/18 ,  H05K1/18 ,  H05K7/20 ,  H05K3/36 ,  H01L25/16

Abstract: The present disclosure provides an assembly structure for providing power for a chip and an electronic device using the same. The assembly structure includes: a circuit board, configured to provide a first electrical energy; a chip; a power converting module, configured to electrically connect the circuit board and the chip, convert the first electrical energy to a second electrical energy, and supply the second electrical energy to the chip, wherein the chip, the circuit board and the power converting module are stacked; and a connection component, configured to electrically connect the circuit board and the power converting module. The present disclosure assembles a power converting module with a circuit board and a chip in a stacking manner, which may shorten a current path between the power converting module and the chip, reduce current transmission losses, improve efficiency of a system, reduce space occupancy and save system resource.

公开(公告)号：US12232288B2

公开(公告)日：2025-02-18

申请号：US18045180

申请日：2022-10-10

Applicant: Delta Electronics, Inc.

Inventor： Haoyi Ye ,  Jianhong Zeng ,  Yu Zhang ,  Peiqing Hu ,  Ziying Zhou

IPC: H05K7/02 ,  G06F1/18 ,  G06F1/20 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K7/10 ,  H05K7/20 ,  H01L25/16

Abstract: The present disclosure provides an assembly structure for providing power for a chip. The assembly structure includes a circuit board configured to provide a first electrical energy; a chip provided with at least one electrical energy input terminal; and a first power converting module provided with at least one power output terminal. The first power converting module is electrically connected to the circuit board and the chip, converts the first electrical energy to a second electrical energy, and supplies the second electrical energy to the chip. The circuit board, the chip and the first power converting module are stacked; and a projection of the at least one electrical energy input terminal of the chip on the circuit board and a projection of the at least one the power output terminal of the first power converting module on the circuit board, are at least partially overlapped.

公开(公告)号：US20220149738A1

公开(公告)日：2022-05-12

申请号：US17584926

申请日：2022-01-26

Applicant: Delta Electronics, Inc.

Inventor： Shouyu Hong ,  Qingdong Chen ,  Kai Lu ,  Pengkai Ji ,  Xiaoni Xin ,  Min Zhou ,  Yu Zhang ,  Jianhong Zeng

IPC: H02M3/158 ,  G06F1/3234 ,  H01F27/28 ,  H01L25/00 ,  G06F1/16 ,  H01F41/12

Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

公开(公告)号：US20190013736A1

公开(公告)日：2019-01-10

申请号：US16130850

申请日：2018-09-13

Applicant: Delta Electronics, Inc.

Inventor： Shouyu Hong ,  Qingdong Chen ,  Kai Lu ,  Pengkai Ji ,  Xiaoni Xin ,  Min Zhou ,  Yu Zhang ,  Jianhong Zeng

IPC: H02M3/158 ,  G06F1/32 ,  H01F27/28

Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

公开(公告)号：US11277067B2

公开(公告)日：2022-03-15

申请号：US16130850

申请日：2018-09-13

Applicant: Delta Electronics, Inc.

Inventor： Shouyu Hong ,  Qingdong Chen ,  Kai Lu ,  Pengkai Ji ,  Xiaoni Xin ,  Min Zhou ,  Yu Zhang ,  Jianhong Zeng

IPC: H01F27/28 ,  H02M3/158 ,  G06F1/3234 ,  H01L25/00 ,  G06F1/16 ,  H01F41/12 ,  H02M3/155

Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

公开(公告)号：US10685769B2

公开(公告)日：2020-06-16

申请号：US15092629

申请日：2016-04-07

Applicant: DELTA ELECTRONICS, INC.

Inventor： Rui Wu ,  Jin-Ping Zhou ,  Yu Zhang ,  Jian-Hong Zeng ,  Min Zhou

IPC: H01F3/10 ,  H01F37/00

Abstract: An integrated inductor apparatus integrated to be a plurality of inductors is provided. The integrated inductor apparatus includes inductor windings to form inductors and includes at least two windows each having at least one of the inductor windings disposed therein and magnetic core units, each having a closed geometrical structure to form one of the at least two windows, wherein two of the neighboring magnetic core units have a shared magnetic core part. The magnetic core units comprise at least two kinds of material having different magnetic permeability corresponding to different sections of the magnetic core units, wherein the reluctance of the shared magnetic core part is smaller than the reluctance of a non-shared magnetic core part of the magnetic core units.

公开(公告)号：US10763028B2

公开(公告)日：2020-09-01

申请号：US15464326

申请日：2017-03-20

Applicant: DELTA ELECTRONICS, INC.

Inventor： Jin-Ping Zhou ,  Rui Wu ,  Jian-Hong Zeng ,  Yu Zhang ,  Min Zhou

IPC: H01F27/24 ,  H01F3/14 ,  H01F27/28 ,  H01F27/00 ,  H01F37/00 ,  H01F3/10

Abstract: A magnetic core is provided. The magnetic core includes a plurality of magnetic core units each having at least one non-shared magnetic core part that is not shared with the neighboring magnetic core unit, wherein a reluctance of the shared magnetic core part is smaller than the reluctance of a non-shared magnetic core part of the magnetic core units, and directions of a direct current magnetic flux in the shared magnetic core part of the neighboring two magnetic core units are opposite.