公开(公告)号：US20250088110A1

公开(公告)日：2025-03-13

申请号：US18961423

申请日：2024-11-26

Applicant: Delta Electronics, Inc.

Inventor： Shouyu Hong ,  Qingdong Chen ,  Kai Lu ,  Pengkai Ji ,  Xiaoni Xin ,  Min Zhou ,  Yu Zhang ,  Jianhong Zeng

IPC: H02M3/158 ,  G06F1/16 ,  G06F1/3234 ,  H01F27/28 ,  H01F41/12 ,  H01L25/00 ,  H02M3/155

Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

公开(公告)号：US20190393789A1

公开(公告)日：2019-12-26

申请号：US16560820

申请日：2019-09-04

Applicant: Delta Electronics, Inc.

Inventor： Jianhong Zeng ,  Haoyi Ye ,  Peiqing Hu ,  Pengkai Ji

IPC: H02M3/335 ,  H05K1/14 ,  G09G1/00 ,  H02M3/158 ,  H02M7/04 ,  H02M7/49 ,  H02M1/42

Abstract: A power module includes a circuit board and a load group. The load group is installed on the circuit board. The load group includes a first-stage power conversion circuit, a second-stage power conversion circuit and plural loads. The first-stage power conversion circuit converts an input voltage into a transition voltage. The second-stage power conversion circuit converts the transition voltage into a driving voltage. A rated value of the first input voltage is higher than twice a rated value of the transition voltage. A rated value of the driving voltage is lower than a half of the rated value of the transition voltage. The distance between the input terminal of the second-stage power conversion circuit and the output terminal of the first-stage power conversion circuit is smaller than the distance between the input terminal of the first-stage power conversion circuit and each edge of the circuit board.

公开(公告)号：US10784612B2

公开(公告)日：2020-09-22

申请号：US16234861

申请日：2018-12-28

Applicant: Delta Electronics, Inc.

Inventor： Shouyu Hong ,  Qingdong Chen ,  Ganyu Zhou ,  Pengkai Ji ,  Yiqing Ye ,  Zhenqing Zhao

IPC: H01R13/22 ,  H01R12/71 ,  H01R43/16 ,  H01R13/405

Abstract: The present disclosure provides a connector which is a combination of at least one power pin, one plastic member, and one signal pin, wherein the power pin includes a columnar metal block, each plastic member is connected to the columnar metal block at side surface, each signal pin is attached to a side surface of the plastic member, and extends to two bottom surfaces of the plastic member to form contact surfaces with predetermined areas on the two bottom surfaces; wherein, the contact surface on first bottom surface of the plastic member is flush with first bottom surface of the metal block, and the contact surface on second bottom surface of the plastic member is flush with second bottom surface of the metal block.

公开(公告)号：US20190013736A1

公开(公告)日：2019-01-10

申请号：US16130850

申请日：2018-09-13

Applicant: Delta Electronics, Inc.

Inventor： Shouyu Hong ,  Qingdong Chen ,  Kai Lu ,  Pengkai Ji ,  Xiaoni Xin ,  Min Zhou ,  Yu Zhang ,  Jianhong Zeng

IPC: H02M3/158 ,  G06F1/32 ,  H01F27/28

Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

公开(公告)号：US10062499B2

公开(公告)日：2018-08-28

申请号：US15784864

申请日：2017-10-16

Applicant: DELTA ELECTRONICS, INC.

Inventor： Pengkai Ji ,  Jinping Zhou ,  Shouyu Hong ,  Tao Wang ,  Jianhong Zeng ,  Zhangnan Xin

IPC: H01F27/29 ,  H05K1/18 ,  H05K1/11 ,  H01F27/24 ,  H01L27/02

CPC classification number: H01F27/29 ,  H01F27/24 ,  H01F27/2847 ,  H01F27/306 ,  H01L27/02 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/1003

Abstract: A power module including a power device and a magnetic component is provided. The magnetic component is stacked with the power device and a vertical projection of the magnetic component is at least partially overlapping with the power device. The magnetic component includes a magnetic core and a winding set. The magnetic core includes a first surface, a second surface and at least one window. The window is located between the first surface and the second surface, and includes a passing-through axis vertical to a surface of the power device, where at least one leading pin or pad is disposed on the surface of the power device. The winding set includes at least one winding portion. The winding portion passes through the window and electrically connected to the power device. Each winding set and the magnetic core are configured to form an inductor, and the winding set is preformed.

公开(公告)号：US20220149738A1

公开(公告)日：2022-05-12

申请号：US17584926

申请日：2022-01-26

Applicant: Delta Electronics, Inc.

Inventor： Shouyu Hong ,  Qingdong Chen ,  Kai Lu ,  Pengkai Ji ,  Xiaoni Xin ,  Min Zhou ,  Yu Zhang ,  Jianhong Zeng

IPC: H02M3/158 ,  G06F1/3234 ,  H01F27/28 ,  H01L25/00 ,  G06F1/16 ,  H01F41/12

Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

公开(公告)号：US11437910B2

公开(公告)日：2022-09-06

申请号：US16560820

申请日：2019-09-04

Applicant: Delta Electronics, Inc.

Inventor： Jianhong Zeng ,  Haoyi Ye ,  Peiqing Hu ,  Pengkai Ji

IPC: H02M3/00 ,  H02M3/335 ,  H05K1/14 ,  G09G1/00 ,  H02M3/158 ,  H02M7/04 ,  H02M7/49 ,  H02M1/42 ,  G06F1/20 ,  G06F1/26 ,  H05K1/02 ,  H02M1/00

Abstract: A power module includes a circuit board and a load group. The load group is installed on the circuit board. The load group includes a first-stage power conversion circuit, a second-stage power conversion circuit and plural loads. The first-stage power conversion circuit converts an input voltage into a transition voltage. The second-stage power conversion circuit converts the transition voltage into a driving voltage. A rated value of the first input voltage is higher than twice a rated value of the transition voltage. A rated value of the driving voltage is lower than a half of the rated value of the transition voltage. The distance between the input terminal of the second-stage power conversion circuit and the output terminal of the first-stage power conversion circuit is smaller than the distance between the input terminal of the first-stage power conversion circuit and each edge of the circuit board.

公开(公告)号：US10249550B2

公开(公告)日：2019-04-02

申请号：US15720062

申请日：2017-09-29

Applicant: Delta Electronics, Inc.

Inventor： Pengkai Ji ,  Shouyu Hong ,  Zhenqing Zhao ,  Jianhong Zeng

IPC: H05K1/18 ,  H01L23/31 ,  H01L23/492 ,  H01L21/56 ,  H05K1/02 ,  H05K1/11 ,  H05K3/30 ,  H05K3/40

Abstract: The present invention provides a power module and a manufacturing method thereof. The power module includes a carrier board and a lead component stacked relative to the carrier board. The lead component includes an initial plane, plural first pins and plural second pin. The initial plane includes a vertical projection overlapping with the carrier board. The first pins are electrically connected to the carrier board and vertical to the initial plane. The second pins are electrically connected to the carrier board and vertical to the initial plane. An isolation gap is disposed in the initial plane and located between the first pins and the second pins. The initial plane is separated into a first plane and a second plane by the isolation gap, so as to electrically isolate the first pins and the second pins from each other.

公开(公告)号：US11277067B2

公开(公告)日：2022-03-15

申请号：US16130850

申请日：2018-09-13

Applicant: Delta Electronics, Inc.

Inventor： Shouyu Hong ,  Qingdong Chen ,  Kai Lu ,  Pengkai Ji ,  Xiaoni Xin ,  Min Zhou ,  Yu Zhang ,  Jianhong Zeng

IPC: H01F27/28 ,  H02M3/158 ,  G06F1/3234 ,  H01L25/00 ,  G06F1/16 ,  H01F41/12 ,  H02M3/155

Abstract: A power module and a manufacturing method thereof are disclosed. The power module includes a magnetic component, a bare power chip and a conductive set. The magnetic component includes a first surface and a second surface opposite to each other. The bare power chip is disposed on the magnetic component and includes a third surface and a fourth surface opposite to each other. The conductive set is disposed on the magnetic component and electrically connected with the magnetic component and the bare power chip. The third or fourth surface of the bare power chip is at least partially attached on the first or second surface of the magnetic component, and at least partially included in a projected envelopment of the corresponding first or second surface of the magnetic component, so as to facilitate the magnetic component to support the bare power chip.

公开(公告)号：US11245214B2

公开(公告)日：2022-02-08

申请号：US16934076

申请日：2020-07-21

Applicant: Delta Electronics, Inc.

Inventor： Shouyu Hong ,  Qingdong Chen ,  Ganyu Zhou ,  Pengkai Ji ,  Yiqing Ye ,  Zhenqing Zhao

IPC: H01R13/22 ,  H01R12/71 ,  H01R43/16 ,  H01R13/405

Abstract: The present disclosure provides a connector which is a combination of at least one power pin, one plastic member, and one signal pin, wherein the power pin includes a columnar metal block, each plastic member is connected to the columnar metal block at side surface, each signal pin is attached to a side surface of the plastic member, and extends to two bottom surfaces of the plastic member to form contact surfaces with predetermined areas on the two bottom surfaces; wherein, the contact surface on first bottom surface of the plastic member is flush with first bottom surface of the metal block, and the contact surface on second bottom surface of the plastic member is flush with second bottom surface of the metal block.