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    Power module and manufacturing method thereof
    1.
    发明授权
    Power module and manufacturing method thereof 有权

    公开(公告)号：US10886200B2

    公开(公告)日：2021-01-05

    申请号：US16258747

    申请日：2019-01-28

    Applicant: Delta Electronics,Inc.

    Inventor： Shouyu Hong ,  Haibin Xu ,  Wei Cheng ,  Tao Wang ,  Zhenqing Zhao

    IPC: H01L23/48 ,  H01L23/495 ,  H01L21/48 ,  H01L25/07 ,  H01L25/00 ,  H01L25/18

    Abstract: The present disclosure relates to a power module and a manufacturing method thereof. The power module includes: a group of switch elements, a molding part and a connector. The group of switch elements includes at least one pair of switch elements. The molding part molds the group of switch elements. The connector includes a signal terminal and a power terminal respectively electrically connected to the signal end and power end of the group of switch elements, and both fanned out from the molding part. The power terminal includes a positive power terminal, a negative power terminal and an output power terminal. The positive power terminal and the negative power terminal are respectively a first metal layer and a second metal layer which are at least partially stacked, and an insulating layer is disposed between the first metal layer and the second metal layer.

    Power module
    2.
    发明授权
    Power module 有权

    公开(公告)号：US10136545B2

    公开(公告)日：2018-11-20

    申请号：US15486591

    申请日：2017-04-13

    Applicant: DELTA ELECTRONICS, INC.

    Inventor： Tao Wang ,  Kai Lu ,  Zhenqing Zhao ,  Shouyu Hong ,  Wei Cheng

    IPC: H05K7/14 ,  H05K1/18 ,  H05K5/03 ,  H01L23/04 ,  H01L25/07

    Abstract: The present invention provides a power module including a substrate and a modular housing structure. The substrate includes an electronic element disposed thereon. The modular housing structure is disposed on the substrate and located around the electronic element. The modular housing structure includes a plurality of sidewalls configured to connect with each other detachably. Each sidewall includes two connecting elements disposed on two opposite ends thereof respectively. The two connecting elements of any one of the sidewalls are connected to two corresponding connecting elements of two adjacent sidewalls respectively. Consequently, the numbers and connections of the sidewalls are adjustable and varied according to the size of the substrate so as to avoid the waste of space and enhance the power density.

    Power circuit module
    4.
    发明授权
    Power circuit module 有权

    公开(公告)号：US10104813B2

    公开(公告)日：2018-10-16

    申请号：US15165273

    申请日：2016-05-26

    Applicant: DELTA ELECTRONICS, INC.

    Inventor： Wei Cheng ,  Shouyu Hong ,  Zhenqing Zhao ,  Tao Wang

    IPC: H05K7/20 ,  H01L23/373 ,  H01L23/40 ,  H01L23/498 ,  H05K1/02 ,  H01L23/053 ,  H01L23/473 ,  H01L23/24

    Abstract: A power circuit module is provided. The encapsulated power circuit module comprises: a pressure plate comprising a protrusion body; a frame; and a substrate bearing a power circuit, the power circuit comprising at least a power switching device; the frame is provided between the substrate and the pressure plate, the frame supports the pressure plate, and a substantially closed space is formed by the substrate, the pressure plate and the frame; and when an external force is applied on the pressure plate, the protrusion body press against the substrate and is in insulation contact with the substrate, and the external force is transmitted evenly on the substrate.

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