公开(公告)号：US08807416B2

公开(公告)日：2014-08-19

申请号：US13668988

申请日：2012-11-05

Applicant: Denso Corporation

Inventor： Takuji Sukekawa ,  Hiroyuki Yamada ,  Noriyasu Inomata

IPC: B23K37/00 ,  B23K37/04 ,  B23K31/02 ,  B23K3/08 ,  B23K3/00 ,  B23K3/04 ,  H05K3/34

CPC classification number: B23K3/00 ,  B23K1/0016 ,  B23K1/008 ,  B23K3/04 ,  B23K3/08 ,  B23K2101/42 ,  H05K3/3494

Abstract: A reflow soldering system wherein a heating oven is provided with a contact heating unit which has a transport rail and a top heat transfer heater, and with a hot gas blowing heating unit, the transport rail and top heat transfer heater are respectively provided with heaters which heat the outer edge part of the printed circuit board, and the transport rail or top heat transfer heater moves in an up-down direction so that the transport rail and top heat transfer heater clamp and heat the outer edge part of the printed circuit board.

Abstract translation: 一种回流焊接系统，其中加热炉设置有具有输送轨道和顶部传热加热器的接触加热单元，并且具有热气体吹送加热单元，输送轨道和顶部传热加热器分别设有加热器， 加热印刷电路板的外边缘部分，并且输送轨道或顶部传热加热器沿上下方向移动，使得输送轨道和顶部传热加热器夹紧并加热印刷电路板的外边缘部分。