公开(公告)号：US20150167201A1

公开(公告)日：2015-06-18

申请号：US14413457

申请日：2013-07-03

Applicant: Dow Global Technologies LLC

Inventor： Bryan E. Barton ,  Zenon Lysenko ,  Mark T. Bernius ,  Eric J. Hukkanen

IPC: D01F9/21

CPC classification number: D01F9/21 ,  D01F9/14 ,  D01F9/20

Abstract: Disclosed herein are processes for preparing carbonized polymers, such as carbon fibers, comprising: sulfonating a polymer with a sulfonating agent that comprises SO3 gas to form a sulfonated polymer; treating the sulfonated polymer with a heated solvent, wherein the temperature of said solvent is at least 95° C.; and carbonizing the resulting product by heating it to a temperature of 500-3000° C.

Abstract translation: 本文公开了制备碳化聚合物如碳纤维的方法，其包括：用包含SO 3气体的磺化剂磺化聚合物以形成磺化聚合物; 用加热的溶剂处理磺化聚合物，其中所述溶剂的温度为至少95℃。 并将所得产物加热至500-3000℃的温度进行碳化。

公开(公告)号：US20160096950A1

公开(公告)日：2016-04-07

申请号：US14787378

申请日：2014-06-17

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： Vivek Tomer ,  Timothy J. Person ,  Dean M. Welsh ,  Mark T. Bernius

IPC: C08K5/12 ,  H01B3/44 ,  H01B3/42 ,  C08K5/101

CPC classification number: C08K5/12 ,  C08K5/10 ,  C08K5/101 ,  H01B3/421 ,  H01B3/441 ,  C08L23/0815

Abstract: Disclosed are polymeric compositions with improved electrical breakdown strength. The polymeric compositions contain a poly-α-olefin and a voltage-stabilizing agent, which comprises an organic carboxylic ester comprising at least one aromatic ring and from 1 to 2 carboxylic alkyl ester substituents. Alternatively, the voltage-stabilizing agent can comprise trioctyl trimellitate. The present polymeric compositions exhibit improved electrical breakdown strength when applied as an insulating and/or shielding layer for power cables.

Abstract translation: 公开了具有改善的电击穿强度的聚合物组合物。 聚合物组合物含有聚-α-烯烃和电压稳定剂，其包含含有至少一个芳环和1至2个羧酸烷基酯取代基的有机羧酸酯。 或者，电压稳定剂可以包含偏苯三酸三辛酯。 当用作电力电缆的绝缘和/或屏蔽层时，本发明的聚合物组合物表现出改善的电击穿强度。

公开(公告)号：US20130118583A1

公开(公告)日：2013-05-16

申请号：US13667744

申请日：2012-11-02

Applicant: Dow Global Technologies LLC

Inventor： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John A. Naumovitz

IPC: H01L31/048 ,  H01L31/18

CPC classification number: H01L31/0481 ,  B32B17/10018 ,  B32B17/10678 ,  B32B2457/12 ,  C08L51/06 ,  H01L31/18 ,  Y02E10/50 ,  C08L2666/02 ,  C08L2666/04

Abstract: An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an ∀-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/∀-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

Abstract translation: 一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合物材料，所述聚合材料包含（1）聚烯烃共聚物， （a）小于约0.90g / cc的密度，（b）通过ASTM D-882-02测量的小于约150兆帕（mPa）的2％割线模量中的至少一个），（c） 熔点小于约95℃，（d）基于聚合物的重量，至少约15至小于约50重量％的烯烃含量，（e）小于约-35℃的Tg， 和（f）至少约50的SCBDI，（2）任选的自由基引发剂，例如过氧化物或偶氮化合物，或光引发剂，例如二苯甲酮，和（3）任选的助剂。 通常，聚烯烃共聚物是乙烯/∀-烯烃共聚物。 任选地，聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂，并且共聚物可保持未交联或交联。

公开(公告)号：US20180148525A1

公开(公告)日：2018-05-31

申请号：US15874492

申请日：2018-01-18

Applicant: Dow Global Technologies LLC

Inventor： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John Naumovitz

IPC: C08F210/02 ,  H01L31/048 ,  B32B17/10

CPC classification number: C08F210/02 ,  B32B17/10018 ,  B32B17/10678 ,  B32B17/10697 ,  H01L31/048 ,  H01L31/0481 ,  Y02E10/50

Abstract: An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.

公开(公告)号：US20130112270A1

公开(公告)日：2013-05-09

申请号：US13667722

申请日：2012-11-02

Applicant: Dow Global Technologies LLC

Inventor： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John A. Naumovitz

IPC: C08F210/02 ,  H01L31/048

CPC classification number: C08F210/02 ,  B32B17/10018 ,  B32B17/10678 ,  B32B17/10697 ,  H01L31/048 ,  H01L31/0481 ,  Y02E10/50

Abstract: An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.

Abstract translation: 电子设备模块包括：A.至少一个电子设备，例如太阳能电池和B.与电子设备的至少一个表面紧密接触的聚合材料，聚合物材料包含乙烯多嵌段共聚物。 通常，聚烯烃材料是密度小于约0.90克/立方厘米（g / cc）的乙烯多嵌段共聚物。 聚合物材料可以完全封装电子器件，或者它可以层压到器件的一个表面。 任选地，聚合物材料还可以包含焦烧抑制剂，并且该共聚物可以保持未交联或可以交联。

公开(公告)号：US09228276B2

公开(公告)日：2016-01-05

申请号：US14413457

申请日：2013-07-03

Applicant: Dow Global Technologies LLC

Inventor： Bryan E. Barton ,  Zenon Lysenko ,  Mark T. Bernius ,  Eric J. Hukkanen

IPC: D01F9/21 ,  D01F9/14 ,  D01F9/20

CPC classification number: D01F9/21 ,  D01F9/14 ,  D01F9/20

Abstract: Disclosed herein are processes for preparing carbonized polymers, such as carbon fibers, comprising: sulfonating a polymer with a sulfonating agent that comprises SO3 gas to form a sulfonated polymer; treating the sulfonated polymer with a heated solvent, wherein the temperature of said solvent is at least 95° C.; and carbonizing the resulting product by heating it to a temperature of 500-3000° C.

Abstract translation: 本文公开了制备碳化聚合物如碳纤维的方法，其包括：用包含SO 3气体的磺化剂磺化聚合物以形成磺化聚合物; 用加热的溶剂处理磺化聚合物，其中所述溶剂的温度为至少95℃。 并将所得产物加热至500-3000℃的温度进行碳化。

公开(公告)号：US09222201B2

公开(公告)日：2015-12-29

申请号：US14413456

申请日：2013-07-03

Applicant: Dow Global Technologies LLC

Inventor： Jasson T. Patton ,  Bryan E. Barton ,  Mark T. Bernius ,  Xiaoyun Chen ,  Eric J. Hukkanen ,  Christina A. Rhoton ,  Zenon Lysenko

IPC: D01F9/21 ,  D06M11/55 ,  D01F9/14 ,  D06M101/20

CPC classification number: D01F9/21 ,  D01F9/14 ,  D06M11/55 ,  D06M2101/20

Abstract: Disclosed here are processes for preparing carbonized polymers (preferably carbon fibers), comprising sulfonating a polymer with a sulfonating agent that comprises SO3 dissolved in a solvent to form a sulfonated polymer; treating the sulfonated polymer with a heated solvent, wherein the temperature of the solvent is at least 95° C.; and carbonizing the resulting product by heating it to a temperature of 500-3000° C. Carbon fibers made according to these methods are also disclosed herein.

Abstract translation: 这里公开了制备碳化聚合物（优选碳纤维）的方法，包括用包含溶解在溶剂中的SO 3的磺化剂磺化聚合物以形成磺化聚合物; 用加热的溶剂处理磺化聚合物，其中溶剂的温度为至少95℃。 并将所得产物加热至500-3000℃的温度进行碳化。本文还公开了根据这些方法制备的碳纤维。

公开(公告)号：US08592679B2

公开(公告)日：2013-11-26

申请号：US13667744

申请日：2012-11-02

Applicant: Dow Global Technologies LLC

Inventor： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John A. Naumovitz

IPC: H01L31/042 ,  H02N6/00 ,  H01L31/00

CPC classification number: H01L31/0481 ,  B32B17/10018 ,  B32B17/10678 ,  B32B2457/12 ,  C08L51/06 ,  H01L31/18 ,  Y02E10/50 ,  C08L2666/02 ,  C08L2666/04

Abstract: An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an ∀-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/∀-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

Abstract translation: 一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料，所述聚合材料包含（1）聚烯烃共聚物， （a）小于约0.90g / cc的密度，（b）通过ASTM D-882-02测量的小于约150兆帕（mPa）的2％割线模量中的至少一个），（c） 熔点小于约95℃，（d）基于聚合物的重量，至少约15至小于约50重量％的烯烃含量，（e）小于约-35℃的Tg， 和（f）至少约50的SCBDI，（2）任选的自由基引发剂，例如过氧化物或偶氮化合物，或光引发剂，例如二苯甲酮，和（3）任选的助剂。 通常，聚烯烃共聚物是乙烯/∀-烯烃共聚物。 任选地，聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂，并且共聚物可保持未交联或交联。

公开(公告)号：US09816207B2

公开(公告)日：2017-11-14

申请号：US14413454

申请日：2013-07-03

Applicant: Dow Global Technologies LLC

Inventor： Bryan E. Barton ,  Jasson T. Patton ,  Eric J. Hukkanen ,  Mark T. Bernius

IPC: C01B31/02 ,  D01F9/21 ,  C01B32/05 ,  D01F9/14 ,  D06M11/55 ,  D01F11/16 ,  D06M101/20

CPC classification number: D01F9/21 ,  C01B32/05 ,  D01F9/14 ,  D01F11/16 ,  D06M11/55 ,  D06M2101/20

Abstract: Disclosed herein are processes for preparing carbon fibers, comprising: sulfonating a polymer fiber with a sulfonating agent that is fuming sulfuric acid, sulfuric acid, chlorosulfonic acid, or a combination thereof; treating the sulfonated polymer with a heated solvent, wherein the temperature of the heated solvent is at least 95° C.; and carbonizing the resulting product by heating it to a temperature of 501-3000° C. Carbon fibers prepared according to these methods are also disclosed herein.

公开(公告)号：US09169340B2

公开(公告)日：2015-10-27

申请号：US13667722

申请日：2012-11-02

Applicant: Dow Global Technologies LLC

Inventor： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John A. Naumovitz

IPC: C08F210/02 ,  H01L31/048 ,  B32B17/10

CPC classification number: C08F210/02 ,  B32B17/10018 ,  B32B17/10678 ,  B32B17/10697 ,  H01L31/048 ,  H01L31/0481 ,  Y02E10/50

Abstract: An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.

Abstract translation: 电子设备模块包括：A.至少一个电子设备，例如太阳能电池和B.与电子设备的至少一个表面紧密接触的聚合材料，聚合物材料包含乙烯多嵌段共聚物。 通常，聚烯烃材料是密度小于约0.90克/立方厘米（g / cc）的乙烯多嵌段共聚物。 聚合物材料可以完全封装电子器件，或者它可以层压到器件的一个表面。 任选地，聚合物材料还可以包含焦烧抑制剂，并且该共聚物可以保持未交联或可以交联。