公开(公告)号：US20190001434A1

公开(公告)日：2019-01-03

申请号：US16067711

申请日：2017-03-17

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Yuan Liu ,  Honghua Hu ,  Jim Brookhyser ,  Guangyu Li ,  Brandon Bilyeu ,  Kurt Eaton

IPC: B23K26/03 ,  B23K26/06 ,  B23K26/073 ,  B23K26/082 ,  B23K26/384

Abstract: Disclosed is a method and an apparatus to process a workpiece including producing a first beam of laser energy characterized by a first spatial intensity distribution. A first workpiece is processed using the first beam of laser energy to form a plurality of features at a first distance between the scan lens and the first workpiece and forming a second features at a second distance. The method includes determining which of the plurality of features has a shape that most closely resembles the shape of the first spatial intensity distribution and setting a process distance as the distance that produced that feature. Using this process distance, a surface of a second workpiece is processed using second beam of laser energy with a second spatial intensity distribution.

公开(公告)号：US20210276125A1

公开(公告)日：2021-09-09

申请号：US16499511

申请日：2018-04-30

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Guang LU ,  Brian Johansen ,  Mark Kosmowski ,  Ho Wai Lo ,  Guangyu Li

IPC: B23K26/08 ,  B23K26/082 ,  B23K26/12

Abstract: Varied embodiments of a laser-based machine tool, and techniques for controlling the same are provided. Some embodiments relate to techniques to facilitate uniform and reproducible processing of workpieces. Other embodiments relate to a zoom lens having a quickly-variable focal length. Still other embodiments relate to various features of a laser-based multi-axis machine tool that can facilitate efficient delivery of laser energy to a scan head, that can address thermomechanical issues that may arise during workpiece processing, etc. Another embodiment relates to techniques for minimizing or preventing undesired accumulation of particulate matter on workpiece surfaces during processing. A number of other embodiments and arrangements are also detailed.