公开(公告)号：US20240391030A1

公开(公告)日：2024-11-28

申请号：US18797580

申请日：2024-08-08

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Hisashi MATSUMOTO ,  Jan KLEINERT ,  Zhibin LIN

IPC: B23K26/382 ,  B23K26/0622 ,  B23K26/402 ,  B23K103/00

Abstract: A method for forming a through-via in a substrate having opposing first and second surfaces can include directing a focused beam of laser pulses through the first surface and through the second surface of the substrate. The focused beam of laser pulses can have a wavelength to which the substrate is at least partially transparent, and an optical intensity less than an optical breakdown intensity of the substrate. The focused beam of laser pulses may have a pulse repetition rate, a peak optical intensity and an average power at the substrate driving a cumulative heating effect to melt a region of the substrate. The pulses may have a pulse width, and wherein the peak optical intensity, pulse repetition rate, average power and pulse width are selected such that the through-via is formed in less than 120 μs.

公开(公告)号：US20220168847A1

公开(公告)日：2022-06-02

申请号：US17599756

申请日：2020-05-29

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Jan KLEINERT ,  Zhibin LIN ,  Joel SCHRAUBEN ,  Mark UNRATH ,  Honghua HU ,  Ruolin CHEN ,  Chuan YANG ,  Geoffrey LOTT ,  Daragh FINN

IPC: B23K26/362 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/06 ,  G02F1/33

Abstract: Numerous embodiments are disclosed. Many of which relate to methods of forming vias in workpieces such as printed circuit boards. Some embodiments relates techniques for indirectly ablating a region of an electrical conductor structure of, for example, a printed circuit board by spatially distributing laser energy throughout the region before the electrical conductor is indirectly ablated. Other embodiments relate to techniques for temporally-dividing laser pulses, modulating the optical power within laser pulses, and the like.