公开(公告)号：US20240001484A1

公开(公告)日：2024-01-04

申请号：US18345053

申请日：2023-06-30

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Mark UNRATH ,  William JORDENS ,  James ISMAIL ,  Hisashi MATSUMOTO ,  Brian LINEBURG

IPC: B23K26/03 ,  B23K26/082 ,  B23K26/06 ,  B23K26/40 ,  B23K26/046 ,  B23K26/08

CPC classification number: B23K26/032 ,  B23K26/082 ,  B23K26/0648 ,  B23K2103/50 ,  B23K26/40 ,  B23K26/046 ,  B23K26/08 ,  B23K26/0665

Abstract: A method includes receiving, during a period of time, a continuous wave laser beam at an acousto-optic deflector (AOD) having a first AOD and a second AOD. A plurality of laser pulses is generated from the received beam using the first acousto-optic deflector (AOD) to the laser beam along a first axis and using the second AOD to deflect the laser beam deflected by the first AOD along a second axis.

公开(公告)号：US20240391030A1

公开(公告)日：2024-11-28

申请号：US18797580

申请日：2024-08-08

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Hisashi MATSUMOTO ,  Jan KLEINERT ,  Zhibin LIN

IPC: B23K26/382 ,  B23K26/0622 ,  B23K26/402 ,  B23K103/00

Abstract: A method for forming a through-via in a substrate having opposing first and second surfaces can include directing a focused beam of laser pulses through the first surface and through the second surface of the substrate. The focused beam of laser pulses can have a wavelength to which the substrate is at least partially transparent, and an optical intensity less than an optical breakdown intensity of the substrate. The focused beam of laser pulses may have a pulse repetition rate, a peak optical intensity and an average power at the substrate driving a cumulative heating effect to melt a region of the substrate. The pulses may have a pulse width, and wherein the peak optical intensity, pulse repetition rate, average power and pulse width are selected such that the through-via is formed in less than 120 μs.

公开(公告)号：US20130224433A1

公开(公告)日：2013-08-29

申请号：US13779183

申请日：2013-02-27

Applicant: Electro Scientific Industries, Inc.

Inventor： Hisashi MATSUMOTO ,  Haibin ZHANG ,  Glenn SIMENSON

IPC: C03B33/09 ,  B32B3/26

CPC classification number: C03B33/091 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/0821 ,  B23K26/083 ,  B23K26/382 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/50 ,  B32B3/266 ,  C03B33/0222 ,  Y10T428/24273

Abstract: Methods and apparatus for machining substrates are disclosed, as are articles formed from the separated substrates. A method of machining a substrate having a first surface and a second surface opposite the first surface can include forming a first recess in the substrate extending from the first surface toward the second surface, forming a second recess in the substrate extending from the second surface toward the first surface, and removing a portion of the substrate extending from the first recess to the second recess to form an opening in the substrate.

Abstract translation: 公开了用于加工衬底的方法和装置，以及由分离的衬底形成的制品。 加工具有与第一表面相对的第一表面和第二表面的基板的方法可以包括在基板上形成从第一表面朝向第二表面延伸的第一凹部，在基板上形成从第二表面延伸的第二凹部朝向 所述第一表面，以及从所述第一凹部移除到所述第二凹部的基板的一部分，以在所述基板中形成开口。