公开(公告)号：US10793697B2

公开(公告)日：2020-10-06

申请号：US15562743

申请日：2016-03-04

Applicant: ENEOS CORPORATION

Inventor： Keisuke Chino ,  Hiroaki Suzuki ,  Tatsuo Yamaguchi ,  Ryuichi Ueno ,  Tsuyoshi Yamaguchi

IPC: C08K3/34 ,  C08J3/20 ,  C08F8/30 ,  C08F8/46 ,  C08F210/02 ,  C08L101/02 ,  C08L51/06 ,  C08J5/18 ,  C08J3/00 ,  C08K9/04

Abstract: A thermoplastic elastomer composition having at least one elastomer component selected from the group consisting of elastomeric polymers (A) each of which has a side chain (a) containing a hydrogen-bond cross-linkable moiety having a carbonyl-containing group and/or a nitrogen-containing heterocycle and has a glass-transition point of 25° C. or below, and elastomeric polymers (B) each of which contains a hydrogen-bond cross-linkable moiety and a covalent-bond cross-linking moiety in a side chain and has a glass-transition point of 25° C. or below; and a clay, wherein an amount of the clay contained is 20 parts by mass or less relative to 100 parts by mass of the elastomer component.

公开(公告)号：US10995079B2

公开(公告)日：2021-05-04

申请号：US16084375

申请日：2017-03-13

Applicant: ENEOS CORPORATION

Inventor： Atsushi Kameyama ,  Ryuichi Ueno ,  Hisashi Sone ,  Hiroaki Suzuki ,  Shohei Takata ,  Takashi Seki

IPC: C07D303/06 ,  C07D301/14 ,  C08G59/20 ,  C08L63/00 ,  C07D303/04 ,  C08G65/14 ,  C08G65/10 ,  C07D301/12

Abstract: The present invention discloses a monoepoxy compound represented by the following Formula (1), a curable composition containing the same, a cured product therefrom, a method of producing the monoepoxy compound, and a reactive diluent containing the monoepoxy compound. The monoepoxy compound represented by the Formula (1) is useful in that it is capable of reducing the viscosity of a curable composition containing the monoepoxy compound, while preventing a reduction in the heat resistance of the curable composition as well as a reduction in the weight of the curable composition upon curing. (In the Formula (1), R1 to R6 are each independently selected from the group consisting of a hydrogen atom, an alkyl group, and an alkoxy group.)

公开(公告)号：US10961345B2

公开(公告)日：2021-03-30

申请号：US16086101

申请日：2017-03-22

Applicant: ENEOS CORPORATION

Inventor： Atsushi Kameyama ,  Ryuichi Ueno ,  Hisashi Sone ,  Shohei Takata ,  Takashi Seki

IPC: C08F2/46 ,  C08F2/50 ,  C08G61/04 ,  C08G65/26

Abstract: The present invention discloses a curable composition comprising: an epoxy compound represented by the following Formula (1); and one selected from the group consisting of: a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator as well as the cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance. (In the Formula (1), A represents CR17R18; B represents CR19R20; R1 to R20 each independently represents a substituent selected from the group consisting of a hydrogen atom, an alkyl group and an alkoxy group; and n represents 0 or 1, with the proviso that when n is 0, m represents 1, and when n is 1, m represents 0.)