公开(公告)号：US20230002641A1

公开(公告)日：2023-01-05

申请号：US17846929

申请日：2022-06-22

Applicant: ENTEGRIS, INC.

Inventor： Rajiv K. Singh ,  Sunny De ,  Akshay Rajopadhye ,  Aditya D. Verma

IPC: C09G1/02 ,  H01L21/321

Abstract: The invention provides compositions useful in the polishing of transition metal-containing surfaces typically found on microelectronic devices. In one aspect, the invention provides a composition comprising: a liquid carrier; titania abrasive particles, wherein the particles are at least partially coated with alumina or amorphous silica to provide coated titania abrasive particles; wherein the coated titania abrasive particles have an average diameter of about 50 nm to about 250 nm; and a corrosion inhibitor. The invention, the compositions are advantageously utilized to polish microelectronic device substrates having transition metal-containing surfaces thereon. In certain embodiments, the surfaces are chosen from molybdenum and ruthenium-containing films and show markedly improved selectivity relative to thermal oxide.