公开(公告)号：US20150325780A1

公开(公告)日：2015-11-12

申请号：US14650538

申请日：2013-10-14

Applicant: EPCOS AG

Inventor： Hans Krüger ,  Alois Stelzl ,  Christian Bauer ,  Jürgen Portmann ,  Wolfgang Pahl

IPC: H01L41/23 ,  H01L41/293 ,  H01L41/053 ,  H01L41/27 ,  H01L41/113 ,  H01L41/083

CPC classification number: H01L41/23 ,  B81B7/007 ,  B81B2207/095 ,  H01L24/97 ,  H01L41/053 ,  H01L41/083 ,  H01L41/1132 ,  H01L41/27 ,  H01L41/293 ,  H01L2224/11 ,  H01L2224/16225

Abstract: A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.

Abstract translation: MEMS部件在基板上包括部件结构，连接到部件结构的接触区域，安置在接触区域上的金属柱结构以及围绕部件结构的金属框架结构。 固化的抗蚀剂层位于框架结构和柱结构上，使得空腔被封装在基板，框架结构和抗蚀剂层之间。 直接在抗蚀剂层上或位于抗蚀剂层上的载体层上提供结构化的金属化。 结构化金属化包括至少该部件的外部触点并且与导电连接的金属结构和部件结构的接触区域。