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公开(公告)号：US09854350B2
公开(公告)日：2017-12-26
申请号：US15126863
申请日：2015-02-18
Applicant: Epcos AG
Inventor： Wolfgang Pahl
CPC classification number: H04R1/222 , B81B7/0061 , B81B7/0064 , B81B2201/0257 , B81B2203/0127 , B81B2207/015 , B81C1/00309 , H01L2224/16225 , H01L2924/16151 , H01L2924/16152 , H04R1/04 , H04R1/2807 , H04R19/016 , H04R19/04 , H04R31/006 , H04R2201/003
Abstract: For a microphone having an increased rear volume, a cavity housing is proposed, comprising at least a base plate and a covering, which define and enclose the cavity. On the base plate, a microphone transducer, usually an MEMS component, is mounted alongside a sound guiding element. The microphone transducer and the sound guiding element are sealed off with respect to the base plate by a partition and separate the front volume from a rear volume under the covering. The sound guiding element provides a sound channel, which connects an opening in the covering to the front volume. The sound guiding element finishes right up against the covering and thus seals off the sound channel with respect to the rear volume.
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公开(公告)号：US09676612B2
公开(公告)日：2017-06-13
申请号：US14787551
申请日：2014-03-21
Applicant: EPCOS AG
Inventor： Wolfgang Pahl
IPC: H01L29/84 , B81B7/00 , B81C1/00 , H01L23/00 , H01L25/065 , H01L25/00 , H01L23/552
Abstract: A component which can be produced at wafer level has a first chip and a second chip connected thereto. The connection is (at least partially) established via a first and a second connecting structure and a first and a second contact structure of the second chip. An adaptation structure between the first chip and the first connecting structure equalizes a height difference between the first and the second contact structure.
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公开(公告)号：US09278854B2
公开(公告)日：2016-03-08
申请号：US14378363
申请日：2013-02-08
Applicant: Epcos AG
Inventor： Wolfgang Pahl , Anton Leidl , Jürgen Portmann , Robert Eichinger , Christian Siegel , Karl Nicolaus , Thomas Wassner , Thomas Sedlmeier
CPC classification number: B81C1/00333 , B81C99/0045 , H01L22/12 , H01L2224/16225 , H01L2924/1461 , H04R31/006 , H01L2924/00
Abstract: The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.
Abstract translation: 传感器（SEN）的制造方法技术领域本发明涉及传感器（SEN）的制造方法，其特征在于，包括以下步骤：在传感器元件（SE）上配置传感器元件（SE） 元件（SE）被封闭在盖（AF）和载体（TR）之间，将载体膜（TF）粘合到盖（AF）上，并在载体膜（TF）中产生开口（SO） 盖（AF），其中载体膜（TF）和盖（AF）中的开口（SO）至少部分重叠。
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公开(公告)号：US20150326979A1
公开(公告)日：2015-11-12
申请号：US14653820
申请日：2012-12-18
Applicant: EPCOS AG
Inventor： Jan Tue Ravnkilde , Marcel Giesen , Kurt Rasmussen , Morten Ginnerup , Pirmin Hermann Otto Rombach , Wolfgang Pahl , Anton Leidl , Armin Schober , Jürgen Portmann
CPC classification number: H04R19/005 , B81B7/0016 , B81B2207/115 , H04R1/04 , H04R19/04 , H04R31/00 , H04R31/006 , H04R2201/003
Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.
Abstract translation: 顶端MEMS麦克风具有上侧和底侧。 麦克风包括在上侧具有单片连接的保护元件的MEMS芯片，背板和膜。 麦克风还包括在上侧的声音入口和在底侧的机械或电气连接。
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公开(公告)号：US20150056725A1
公开(公告)日：2015-02-26
申请号：US14378363
申请日：2013-02-08
Applicant: Epcos AG
Inventor： Wolfgang Pahl , Anton Leidl , Jürgen Portmann , Robert Eichinger , Christian Siegel , Karl Nicolaus , Thomas Wassner , Thomas Sedlmeier
CPC classification number: B81C1/00333 , B81C99/0045 , H01L22/12 , H01L2224/16225 , H01L2924/1461 , H04R31/006 , H01L2924/00
Abstract: The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.
Abstract translation: 传感器（SEN）的制造方法技术领域本发明涉及传感器（SEN）的制造方法，其特征在于，包括以下步骤：在传感器元件（SE）上配置传感器元件（SE） 元件（SE）被封闭在盖（AF）和载体（TR）之间，将载体膜（TF）粘合到盖（AF）上，并在载体膜（TF）中产生开口（SO） 盖（AF），其中载体膜（TF）和盖（AF）中的开口（SO）至少部分重叠。
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Patent Agency Ranking
公开(公告)号：US09718673B2
公开(公告)日：2017-08-01
申请号：US14787551
申请日：2014-03-21
Applicant: EPCOS AG
Inventor： Wolfgang Pahl
IPC: H01L29/84 , B81B7/00 , B81C1/00 , H01L23/00 , H01L25/065 , H01L25/00 , H01L23/552
CPC classification number: B81B7/007 , B81B7/0064 , B81B7/008 , B81B2201/0257 , B81C1/00238 , B81C1/00301 , B81C2203/0785 , H01L23/552 , H01L24/06 , H01L24/17 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/06102 , H01L2224/1403 , H01L2224/1703 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2924/1461 , H01L2924/00 , H01L2224/81
Abstract: A component which can be produced at wafer level has a first chip and a second chip connected thereto. The connection is (at least partially) established via a first and a second connecting structure and a first and a second contact structure of the second chip. An adaptation structure between the first chip and the first connecting structure equalizes a height difference between the first and the second contact structure.
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7.发明授权Encapsulated component comprising a MEMS component and method for the production thereof 有权包含MEMS组件的封装组件及其制造方法公开(公告)号：US09481565B2
公开(公告)日：2016-11-01
申请号：US14759602
申请日：2013-10-23
Applicant: Epcos AG
Inventor： Wolfgang Pahl
CPC classification number: B81B7/0058 , B81B7/0054 , B81B7/0061 , B81B7/007 , B81B2201/0257 , B81B2201/0264 , B81B2207/012 , B81C1/0023 , B81C1/00301 , B81C3/001 , B81C2201/034 , B81C2203/0154 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48471 , H01L2224/48472 , H01L2924/1461 , H01L2924/19107 , H04R23/00 , H04R2201/003 , H01L2924/00014 , H01L2924/00
Abstract: A component comprising a carrier, a chip component and a MEMS component is proposed, wherein the mechanically sensitive MEMS component is mounted below a half-shell on the carrier. The component is encapsulated with a molding compound in a transfer molding process.
Abstract translation: 提出了包括载体，芯片部件和MEMS部件的部件，其中机械敏感的MEMS部件安装在载体上的半壳下方。 该组分在传递模塑过程中用模塑料封装。
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公开(公告)号：US20160297676A1
公开(公告)日：2016-10-13
申请号：US14970749
申请日：2014-05-12
Applicant: EPCOS AG
Inventor： Wolfgang Pahl
CPC classification number: B81C1/00825 , B81B7/0058 , B81B2201/0257 , B81B2203/0127 , B81B2207/012 , B81B2207/115 , B81C2201/053 , B81C2203/0785 , H01L2224/16225 , H01L2224/48137 , H01L2224/73257 , H01L2924/16151 , H01L2924/16152
Abstract: For producing a structured coating, or for carefully lifting off a coating over a sensitive region, it is proposed that a release film be applied and structured under the coating in the region which is not to be coated. In a release step, the release film is reduced in the adhesion in the region which is not to be coated and is subsequently lifted off together with the coating applied over it.
Abstract translation: 为了生产结构化涂层，或者在敏感区域小心地提起涂层，建议在未涂覆区域的涂层下施用和结构化脱模膜。 在释放步骤中，释放膜在未被涂覆的区域中的粘附性降低，随后与施加在其上的涂层一起被剥离。
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公开(公告)号：US20150325780A1
公开(公告)日：2015-11-12
申请号：US14650538
申请日：2013-10-14
Applicant: EPCOS AG
Inventor： Hans Krüger , Alois Stelzl , Christian Bauer , Jürgen Portmann , Wolfgang Pahl
IPC: H01L41/23 , H01L41/293 , H01L41/053 , H01L41/27 , H01L41/113 , H01L41/083
CPC classification number: H01L41/23 , B81B7/007 , B81B2207/095 , H01L24/97 , H01L41/053 , H01L41/083 , H01L41/1132 , H01L41/27 , H01L41/293 , H01L2224/11 , H01L2224/16225
Abstract: A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.
Abstract translation: MEMS部件在基板上包括部件结构，连接到部件结构的接触区域，安置在接触区域上的金属柱结构以及围绕部件结构的金属框架结构。 固化的抗蚀剂层位于框架结构和柱结构上，使得空腔被封装在基板，框架结构和抗蚀剂层之间。 直接在抗蚀剂层上或位于抗蚀剂层上的载体层上提供结构化的金属化。 结构化金属化包括至少该部件的外部触点并且与导电连接的金属结构和部件结构的接触区域。
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公开(公告)号：US09556022B2
公开(公告)日：2017-01-31
申请号：US14970749
申请日：2014-05-12
Applicant: EPCOS AG
Inventor： Wolfgang Pahl
CPC classification number: B81C1/00825 , B81B7/0058 , B81B2201/0257 , B81B2203/0127 , B81B2207/012 , B81B2207/115 , B81C2201/053 , B81C2203/0785 , H01L2224/16225 , H01L2224/48137 , H01L2224/73257 , H01L2924/16151 , H01L2924/16152
Abstract: For producing a structured coating, or for carefully lifting off a coating over a sensitive region, it is proposed that a release film be applied and structured under the coating in the region which is not to be coated. In a release step, the release film is reduced in the adhesion in the region which is not to be coated and is subsequently lifted off together with the coating applied over it.
Abstract translation: 为了生产结构化涂层，或者在敏感区域小心地提起涂层，建议在未涂覆区域的涂层下施用和结构化脱模膜。 在释放步骤中，释放膜在未被涂覆的区域中的粘附性降低，随后与施加在其上的涂层一起被剥离。
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