公开(公告)号：US10136226B2

公开(公告)日：2018-11-20

申请号：US14653820

申请日：2012-12-18

Applicant: EPCOS AG

Inventor： Jan Tue Ravnkilde ,  Marcel Giesen ,  Kurt Rasmussen ,  Morten Ginnerup ,  Pirmin Hermann Otto Rombach ,  Wolfgang Pahl ,  Anton Leidl ,  Armin Schober ,  Jürgen Portmann

IPC: H04R19/00 ,  H04R1/04 ,  H04R31/00 ,  H04R19/04 ,  B81B7/00

Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.

公开(公告)号：US09278854B2

公开(公告)日：2016-03-08

申请号：US14378363

申请日：2013-02-08

Applicant: Epcos AG

Inventor： Wolfgang Pahl ,  Anton Leidl ,  Jürgen Portmann ,  Robert Eichinger ,  Christian Siegel ,  Karl Nicolaus ,  Thomas Wassner ,  Thomas Sedlmeier

IPC: B81C1/00 ,  B81C99/00 ,  H01L21/66 ,  H04R31/00

CPC classification number: B81C1/00333 ,  B81C99/0045 ,  H01L22/12 ,  H01L2224/16225 ,  H01L2924/1461 ,  H04R31/006 ,  H01L2924/00

Abstract: The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.

Abstract translation: 传感器（SEN）的制造方法技术领域本发明涉及传感器（SEN）的制造方法，其特征在于，包括以下步骤：在传感器元件（SE）上配置传感器元件（SE） 元件（SE）被封闭在盖（AF）和载体（TR）之间，将载体膜（TF）粘合到盖（AF）上，并在载体膜（TF）中产生开口（SO） 盖（AF），其中载体膜（TF）和盖（AF）中的开口（SO）至少部分重叠。

公开(公告)号：US20150326979A1

公开(公告)日：2015-11-12

申请号：US14653820

申请日：2012-12-18

Applicant: EPCOS AG

Inventor： Jan Tue Ravnkilde ,  Marcel Giesen ,  Kurt Rasmussen ,  Morten Ginnerup ,  Pirmin Hermann Otto Rombach ,  Wolfgang Pahl ,  Anton Leidl ,  Armin Schober ,  Jürgen Portmann

IPC: H04R19/04 ,  H04R1/04 ,  H04R31/00 ,  H04R19/00

CPC classification number: H04R19/005 ,  B81B7/0016 ,  B81B2207/115 ,  H04R1/04 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003

Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.

Abstract translation: 顶端MEMS麦克风具有上侧和底侧。 麦克风包括在上侧具有单片连接的保护元件的MEMS芯片，背板和膜。 麦克风还包括在上侧的声音入口和在底侧的机械或电气连接。

公开(公告)号：US20150056725A1

公开(公告)日：2015-02-26

申请号：US14378363

申请日：2013-02-08

Applicant: Epcos AG

Inventor： Wolfgang Pahl ,  Anton Leidl ,  Jürgen Portmann ,  Robert Eichinger ,  Christian Siegel ,  Karl Nicolaus ,  Thomas Wassner ,  Thomas Sedlmeier

IPC: B81C1/00 ,  H01L21/66 ,  H04R31/00

CPC classification number: B81C1/00333 ,  B81C99/0045 ,  H01L22/12 ,  H01L2224/16225 ,  H01L2924/1461 ,  H04R31/006 ,  H01L2924/00

Abstract: The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.

Abstract translation: 传感器（SEN）的制造方法技术领域本发明涉及传感器（SEN）的制造方法，其特征在于，包括以下步骤：在传感器元件（SE）上配置传感器元件（SE） 元件（SE）被封闭在盖（AF）和载体（TR）之间，将载体膜（TF）粘合到盖（AF）上，并在载体膜（TF）中产生开口（SO） 盖（AF），其中载体膜（TF）和盖（AF）中的开口（SO）至少部分重叠。

公开(公告)号：US20150325780A1

公开(公告)日：2015-11-12

申请号：US14650538

申请日：2013-10-14

Applicant: EPCOS AG

Inventor： Hans Krüger ,  Alois Stelzl ,  Christian Bauer ,  Jürgen Portmann ,  Wolfgang Pahl

IPC: H01L41/23 ,  H01L41/293 ,  H01L41/053 ,  H01L41/27 ,  H01L41/113 ,  H01L41/083

CPC classification number: H01L41/23 ,  B81B7/007 ,  B81B2207/095 ,  H01L24/97 ,  H01L41/053 ,  H01L41/083 ,  H01L41/1132 ,  H01L41/27 ,  H01L41/293 ,  H01L2224/11 ,  H01L2224/16225

Abstract: A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.

Abstract translation: MEMS部件在基板上包括部件结构，连接到部件结构的接触区域，安置在接触区域上的金属柱结构以及围绕部件结构的金属框架结构。 固化的抗蚀剂层位于框架结构和柱结构上，使得空腔被封装在基板，框架结构和抗蚀剂层之间。 直接在抗蚀剂层上或位于抗蚀剂层上的载体层上提供结构化的金属化。 结构化金属化包括至少该部件的外部触点并且与导电连接的金属结构和部件结构的接触区域。