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公开(公告)号:US20070027937A1
公开(公告)日:2007-02-01
申请号:US11331615
申请日:2006-01-13
申请人: Emma McGrattan , Stephen Ball , Sami Moucaddem , Jean-Francois Rivet , Chin Kuo , Frank Yang
发明人: Emma McGrattan , Stephen Ball , Sami Moucaddem , Jean-Francois Rivet , Chin Kuo , Frank Yang
IPC分类号: G06F17/30
CPC分类号: G06F11/1451 , G06F11/1456 , G06F11/1458 , G06F11/1469 , G06F2201/80 , G06F2201/83 , G06F2201/835
摘要: Methods and apparatuses for backing up data to a database are provided. A specified data set to be backed up is broken down into a plurality of data blocks, each data block is associated with a data block digest, and the data blocks and associated data block digests are stored in the database. When one or more data blocks are subsequently changed, an update to the backup may be performed by adding to the backup data only the data blocks that have changed since the initial backup. Methods and apparatuses for restoring backup data from a database are also provided. Timestamp information associated with the data blocks in the database is used to select the data blocks to be restored.
摘要翻译: 提供了将数据备份到数据库的方法和设备。 要备份的指定数据集被分解成多个数据块,每个数据块与数据块摘要相关联,并且数据块和相关联的数据块摘要存储在数据库中。 当随后更改一个或多个数据块时,可以通过将备份数据仅添加自初始备份以来已更改的数据块来执行对备份的更新。 还提供了用于从数据库恢复备份数据的方法和装置。 与数据库中的数据块相关联的时间戳信息用于选择要恢复的数据块。
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公开(公告)号:US20060189062A1
公开(公告)日:2006-08-24
申请号:US11064452
申请日:2005-02-23
申请人: Jack Deng , Chin Kuo , Fu-Tien Weng , Chih-Kung Chang , Bii-Junq Chang
发明人: Jack Deng , Chin Kuo , Fu-Tien Weng , Chih-Kung Chang , Bii-Junq Chang
IPC分类号: H01L21/00 , H01L21/8238 , H01L27/14
CPC分类号: G02B3/0018 , B29D11/00278 , H01L27/14627 , H01L27/14685
摘要: A method of manufacturing a plurality of microlenses on a substrate comprises forming a grid having raised ridges defining a plurality of openings on the substrate and forming a plurality of patterned photoresist features each disposed within one of the plurality of openings. The plurality of patterned photoresist features can then be reflowed inside the grid.
摘要翻译: 在衬底上制造多个微透镜的方法包括在衬底上形成具有限定多个开口的凸脊的栅格,并且形成多个图案化的光刻胶特征,每个设置在多个开口中的一个开口内。 然后,多个图案化的光致抗蚀剂特征可以在网格内回流。
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公开(公告)号:US20050212713A1
公开(公告)日:2005-09-29
申请号:US11025814
申请日:2004-12-28
申请人: Hsin Dai , Yun Ke , Lung-Sheng Tai , Mu Lin , Chin Kuo
发明人: Hsin Dai , Yun Ke , Lung-Sheng Tai , Mu Lin , Chin Kuo
摘要: A dual-band antenna (1) includes a first antenna (2) and a second antenna (3). The first antenna includes a first dipole half (11) and a second dipole half (12). The first dipole half is disposed above the second dipole half with a space therebetween and the two dipole halves are corresponding to each other in a lengthwise direction. The second antenna includes a coaxial cable (4) including an inner conductor feeding the first antenna and comprising an exposed extending section (40) acting as a radiating portion of the second antenna, and a ground patch (5) electrically connected with the second dipole half.
摘要翻译: 双频天线(1)包括第一天线(2)和第二天线(3)。 第一天线包括第一偶极半(11)和第二偶极半(12)。 第一偶极半部设置在第二偶极子半部之上,其间具有空间,并且两个偶极半部在长度方向上彼此对应。 第二天线包括同轴电缆(4),其包括馈送第一天线的内导体,并且包括用作第二天线的辐射部分的暴露的延伸部分(40)和与第二偶极子电连接的接地片 半。
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公开(公告)号:US20050243007A1
公开(公告)日:2005-11-03
申请号:US11026637
申请日:2004-12-30
申请人: Yun Ke , Hsin Dai , Lung-Sheng Tai , Chin Kuo
发明人: Yun Ke , Hsin Dai , Lung-Sheng Tai , Chin Kuo
摘要: A dual-band antenna (1) includes a first antenna (2) and a second antenna (3). The first antenna includes a u-shaped first dipole half (11) and an n-shaped second dipole half (12). The first dipole half is disposed above the second dipole half with a space therebetween and the two dipole halves are mirror imaged. The second antenna includes a u-shaped third dipole half (21) and an n-shaped fourth dipole half (22). The first and the third dipole halves are crossly connected with each other at bottom. The second and the fourth dipole halves are crossly connected with each other at top.
摘要翻译: 双频天线(1)包括第一天线(2)和第二天线(3)。 第一天线包括u形第一偶极子半部(11)和n形第二偶极子半部(12)。 第一偶极半部设置在第二偶极子半部之上,其间具有空间,并且两个偶极半部被镜像成像。 第二天线包括u形第三偶极半部(21)和n形第四偶极半部(22)。 第一和第三偶极半部在底部彼此交叉连接。 第二和第四偶极半部在顶部彼此交叉连接。
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公开(公告)号:US20050052422A1
公开(公告)日:2005-03-10
申请号:US10836230
申请日:2004-05-03
申请人: Chin Kuo
发明人: Chin Kuo
CPC分类号: H01H3/125
摘要: A linkage mechanism of a keyswitch has a first rack and a second rack. The first rack has a pair of pivotal pins which respectively project from middles of two sides thereof, and the second rack has a pair of pivotal hole portions which are respectively formed in middles of two sides thereof. Each pivotal hole portion defines a piercing hole and a through hole which communicates with the piercing hole. Furthermore, the pivotal pins of the first rack pass through the piercing holes in a predetermined direction, and then are inserted into the through holes of the second rack, so that the pivotal pins of the first rack are inseparable in an enforced direction during operation.
摘要翻译: 键开关的联动机构具有第一机架和第二机架。 第一齿条具有分别从两侧的中间突出的一对枢轴销,第二齿条具有分别形成在其两侧的中间的一对枢转孔部。 每个枢转孔部分限定穿孔和与穿孔连通的通孔。 此外,第一机架的枢转销沿预定方向穿过穿孔,然后插入第二机架的通孔中,使得第一机架的枢转销在操作期间在强制方向上是不可分离的。
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公开(公告)号:US20060131710A1
公开(公告)日:2006-06-22
申请号:US11020041
申请日:2004-12-21
申请人: Chin Kuo , Jack Deng , Fu-Tien Weng , Chih-Kung Chang , Bii-Jung Chang
发明人: Chin Kuo , Jack Deng , Fu-Tien Weng , Chih-Kung Chang , Bii-Jung Chang
CPC分类号: H01L27/14685 , H01L27/14618 , H01L27/14621 , H01L2924/0002 , H01L2924/00
摘要: The present invention provides an advanced cavity structure for optically sensitive devices in wafer level chip scale package and methods of manufacturing thereof. Image sensor or light detection integrated circuits are formed on substrate. Substantially absorptive bleached cavity walls are formed about the image sensor or light detection integrated circuits. Upon attaching a transparent layer to the bleached cavity walls and above the image sensor or light detection integrated circuits, open chambers are formed thereby permitting the image sensor or light detection integrated circuits to receive and manipulate signals without decreasing or decaying the optical sensitivity of the incident light. Furthermore, individual image sensor or light detection integrated circuits may be separated from each other to comprise wafer level chip scale packages of at least one image sensor or light detection integrated circuits, at least one transparent layer, and at least one open chamber.
摘要翻译: 本发明提供了一种用于晶片级芯片级封装中的光敏器件的高级腔结构及其制造方法。 图像传感器或光检测集成电路形成在基板上。 围绕图像传感器或光检测集成电路形成基本吸收漂白的空腔壁。 当将透明层附着到漂白的空腔壁和图像传感器或光检测集成电路上方时,形成开放室,从而允许图像传感器或光检测集成电路接收和操纵信号而不会降低或衰减事件的光学灵敏度 光。 此外,各个图像传感器或光检测集成电路可以彼此分离,以包括至少一个图像传感器或光检测集成电路,至少一个透明层和至少一个开放室的晶片级芯片级封装。
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公开(公告)号:US20050199412A1
公开(公告)日:2005-09-15
申请号:US11025186
申请日:2004-12-28
IPC分类号: H01B7/29
CPC分类号: H01B7/1855 , H01B11/20 , H01B13/262
摘要: A cable includes a number of conductive wires arranged loosely from one another and an elongate protecting sheet surrounding the number of conductive wires such that the conductive wires are free to move with respect to each other when the cable are bent. The protecting sheet has at least an adhesive strip along the sheet. When the protecting sheet is helically wrapped along the conductive wires, the conductive wires are untouched by the adhesive strip.
摘要翻译: 电缆包括彼此松散地布置的多个导线,以及围绕多个导线的细长保护片,使得当电缆弯曲时,导线相对于彼此自由移动。 保护片至少具有沿片材的粘合带。 当保护片沿着导电线螺旋缠绕时,导电线不被粘合带条接触。
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公开(公告)号:US20070090513A1
公开(公告)日:2007-04-26
申请号:US11371562
申请日:2006-03-09
IPC分类号: H01L23/053
CPC分类号: H01L23/49568 , H01L23/49531 , H01L23/49551 , H01L2924/0002 , H05K3/0061 , H05K3/284 , H05K3/3405 , H05K2201/1034 , H05K2201/10924 , H05K2203/1316 , H01L2924/00
摘要: A power module fabrication method and structure thereof is disclosed. The method includes steps of: providing a metal plate and defining a pattern on the metal plate; cutting the metal plate according to the pattern to form a plurality of pins and the heat-conducting plate, wherein the pin is coupled to each other or to the metal plate via a connection part and the heat-conducting plate is coupled to the connection part via a fixing part; bending a first end of the pin to form an extension part and bending the fixing part to dispose the heat-conducting plate and the metal plate at different levels; providing a circuit board with a plurality of via holes and inserting the extension part into the via hole correspondingly and fixing the pin on the circuit board; forming a housing to encapsulate the circuit board therein, wherein the heat-conducting plate is inlaid on the housing and a second end of the pin is extended out of the housing; and cutting the connection part and the fixing part to separate the pin from each other and from the metal plate and isolate the pin and the heat-conducting plate.
摘要翻译: 公开了一种功率模块的制造方法及其结构。 该方法包括以下步骤:提供金属板并在金属板上限定图案; 根据图案切割金属板以形成多个销和导热板,其中销通过连接部彼此连接或连接到金属板,并且导热板联接到连接部分 通过固定部分; 弯曲销的第一端以形成延伸部分并弯曲固定部分以将导热板和金属板设置在不同的水平; 提供具有多个通孔的电路板,并将所述延伸部分相应地插入所述通孔中并将所述销固定在所述电路板上; 形成壳体以将电路板封装在其中,其中导热板镶嵌在壳体上,并且销的第二端延伸出壳体; 以及切割连接部分和固定部分,以将销彼此分开并与金属板分离,并使引脚和导热板隔离。
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