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公开(公告)号：US08890004B2
公开(公告)日：2014-11-18
申请号：US13355905
申请日：2012-01-23
IPC分类号： H05K9/00 , H01R13/648 , H01R13/6583
CPC分类号： H01R13/6583 , H05K9/0009
摘要： An electrical connector assembly includes a cage having an upper wall, a lower wall, and side walls that extend from the upper wall to the lower wall. The side walls have exterior sides. The cage includes an interior cavity and a divider that extends between the side walls and divides the interior cavity into at least two internal compartments. The cage includes a front end that is open to the internal compartments. The side walls have front edges at the front end. The internal compartments are configured to receive pluggable modules therein through the front end. An electromagnetic interference (EMI) cover is mounted to the divider such that the EMI cover is engaged with and electrically connected to the divider. The EMI cover includes a flap that wraps around the front edge of a corresponding side wall. The flap overlaps and engages the exterior side of the corresponding side wall.
摘要翻译： 电连接器组件包括具有上壁，下壁和从上壁延伸到下壁的侧壁的保持架。 侧壁有外侧。 保持架包括内部空腔和在侧壁之间延伸的分隔件，并将内部空腔分成至少两个内部隔间。 笼子包括对内部隔间开放的前端。 侧壁在前端具有前边缘。 内部隔间被配置为通过前端接收可插拔模块。 电磁干扰（EMI）盖安装在分隔器上，使得EMI盖与分隔器接合并电连接。 EMI盖包括围绕相应侧壁的前边缘卷绕的翼片。 翼片与相应侧壁的外侧重叠并接合。
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公开(公告)号：US20130186681A1
公开(公告)日：2013-07-25
申请号：US13355905
申请日：2012-01-23
IPC分类号： H05K9/00
CPC分类号： H01R13/6583 , H05K9/0009
摘要： An electrical connector assembly includes a cage having an upper wall, a lower wall, and side walls that extend from the upper wall to the lower wall. The side walls have exterior sides. The cage includes an interior cavity and a divider that extends between the side walls and divides the interior cavity into at least two internal compartments. The cage includes a front end that is open to the internal compartments. The side walls have front edges at the front end. The internal compartments are configured to receive pluggable modules therein through the front end. An electromagnetic interference (EMI) cover is mounted to the divider such that the EMI cover is engaged with and electrically connected to the divider. The EMI cover includes a flap that wraps around the front edge of a corresponding side wall. The flap overlaps and engages the exterior side of the corresponding side wall.
摘要翻译： 电连接器组件包括具有上壁，下壁和从上壁延伸到下壁的侧壁的保持架。 侧壁有外侧。 保持架包括内部空腔和在侧壁之间延伸的分隔件，并将内部空腔分成至少两个内部隔间。 笼子包括对内部隔间开放的前端。 侧壁在前端具有前边缘。 内部隔间被配置为通过前端接收可插拔模块。 电磁干扰（EMI）盖安装在分隔器上，使得EMI盖与分隔器接合并电连接。 EMI盖包括围绕相应侧壁的前边缘卷绕的翼片。 翼片与相应侧壁的外侧重叠并接合。
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公开(公告)号：US08597056B2
公开(公告)日：2013-12-03
申请号：US13173949
申请日：2011-06-30
申请人： Michael Allen Blanchfield , Steven Lee Flickinger , Benjamin Howard Mosser , Evan Charles Wickes
发明人： Michael Allen Blanchfield , Steven Lee Flickinger , Benjamin Howard Mosser , Evan Charles Wickes
IPC分类号： H01R24/00
CPC分类号： H01R12/721 , H01R12/722 , H01R12/732 , H01R13/6461 , H05K1/117 , H05K2201/09709
摘要： A card edge connector is provided for mounting to a printed circuit board (PCB). The card edge connector includes a housing having a mating side, a mounting side, and a card slot that extends into the mating side. The card edge connector also includes first and second contacts held by the housing. The first and second contacts include mounting segments that extend outwardly from the mounting side of the housing. The mounting segments include mounting interfaces. The mounting segments of the first and second contacts are configured to be electrically connected to corresponding contact pads on the PCB at the mounting interfaces. The mounting interface of the first contact is offset from the mounting interface of the second contact in a direction generally away from mounting side of the housing.
摘要翻译： 提供一个卡缘连接器用于安装到印刷电路板（PCB）。 卡缘连接器包括具有配合侧的壳体，安装侧和延伸到配合侧的卡槽。 卡边缘连接器还包括由壳体保持的第一和第二触点。 第一和第二触点包括从壳体的安装侧向外延伸的安装段。 安装段包括安装接口。 第一和第二触点的安装段被构造成电连接到安装界面处的PCB上相应的接触焊盘。 第一接触件的安装界面在大体上远离壳体的安装侧的方向上偏离第二接触件的安装界面。
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4.发明授权公开(公告)号：US09022666B2
公开(公告)日：2015-05-05
申请号：US13297360
申请日：2011-11-16
CPC分类号： G02B6/4249 , G02B6/3821 , G02B6/3879 , G02B6/3885 , G02B6/4292
摘要： An optical communication connector having a connector housing that includes opposite mating and loading sides and a housing cavity that extends therebetween. The optical communication connector also includes an optical module that is positioned within the housing cavity and a biasing element that is positioned between the optical module and the loading side in the housing cavity. The biasing element has a module end, a back end, and a resilient spring portion that extends between the module and back ends. The spring portion includes an elongated body having a plurality of flexible bend segments that wrap back-and-forth within a spring plane. The spring portion is compressible between first and second states during a mating operation between the optical module and an optical connector.
摘要翻译： 一种具有连接器壳体的光通信连接器，该连接器壳体包括相对的配合和装载侧面以及在它们之间延伸的壳体空腔。 光通信连接器还包括位于壳体空腔内的光学模块和位于壳体空腔内的光学模块与装载侧之间的偏置元件。 偏置元件具有模块端部，后端和在模块和后端之间延伸的弹性弹簧部分。 弹簧部分包括细长主体，该主体具有在弹簧平面内来回缠绕的多个柔性弯曲部分。 在光学模块和光学连接器之间的配合操作期间，弹簧部分在第一和第二状态之间是可压缩的。
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公开(公告)号：US20100144167A1
公开(公告)日：2010-06-10
申请号：US12474568
申请日：2009-05-29
申请人： James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan Charles Wickes
发明人： James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan Charles Wickes
CPC分类号： H01R13/514 , H01R12/585 , H01R12/725 , H01R13/6477 , H01R13/6587 , H01R13/6599
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
摘要翻译： 公开了用于安装能够以高达至少25Gbps的速度运行的基板的高速背板连接器系统，而在一些实施方式中还提供了每英寸至少50对电连接器的销密度。 高速连接器系统的实现可以提供接地屏蔽和/或接地结构，其基本上封装整个背板占用面积，背板连接器和子卡内部的三维方式的可能是差分电连接器对的电连接器对 脚印。 当高速背板连接器系统在高达至少30GHz的频率下工作时，这些封装接地屏蔽和/或接地结构防止非横向，纵向和高阶模式的不期望的传播。
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公开(公告)号：US20130005190A1
公开(公告)日：2013-01-03
申请号：US13173949
申请日：2011-06-30
申请人： Michael Allen Blanchfield , Steven Lee Flickinger , Benjamin Howard Mosser, III , Evan Charles Wickes
发明人： Michael Allen Blanchfield , Steven Lee Flickinger , Benjamin Howard Mosser, III , Evan Charles Wickes
IPC分类号： H01R24/00
CPC分类号： H01R12/721 , H01R12/722 , H01R12/732 , H01R13/6461 , H05K1/117 , H05K2201/09709
摘要： A card edge connector is provided for mounting to a printed circuit board (PCB). The card edge connector includes a housing having a mating side, a mounting side, and a card slot that extends into the mating side. The card edge connector also includes first and second contacts held by the housing. The first and second contacts include mounting segments that extend outwardly from the mounting side of the housing. The mounting segments include mounting interfaces. The mounting segments of the first and second contacts are configured to be electrically connected to corresponding contact pads on the PCB at the mounting interfaces. The mounting interface of the first contact is offset from the mounting interface of the second contact in a direction generally away from mounting side of the housing.
摘要翻译： 提供一个卡缘连接器用于安装到印刷电路板（PCB）。 卡缘连接器包括具有配合侧的壳体，安装侧和延伸到配合侧的卡槽。 卡边缘连接器还包括由壳体保持的第一和第二触点。 第一和第二触点包括从壳体的安装侧向外延伸的安装段。 安装段包括安装接口。 第一和第二触点的安装段被构造成电连接到安装界面处的PCB上相应的接触焊盘。 第一接触件的安装界面在大体上远离壳体的安装侧的方向上偏离第二接触件的安装界面。
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公开(公告)号：US07976318B2
公开(公告)日：2011-07-12
申请号：US12474568
申请日：2009-05-29
申请人： James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan Charles Wickes
发明人： James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan Charles Wickes
IPC分类号： H01R12/00
CPC分类号： H01R13/514 , H01R12/585 , H01R12/725 , H01R13/6477 , H01R13/6587 , H01R13/6599
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
摘要翻译： 公开了用于安装能够以高达至少25Gbps的速度运行的基板的高速背板连接器系统，而在一些实施方式中还提供了每英寸至少50对电连接器的销密度。 高速连接器系统的实现可以提供接地屏蔽和/或接地结构，其基本上封装整个背板占用面积，背板连接器和子卡内部的三维方式的可能是差分电连接器对的电连接器对 脚印。 当高速背板连接器系统在高达至少30GHz的频率下工作时，这些封装接地屏蔽和/或接地结构防止非横向，纵向和高阶模式的不期望的传播。
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