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公开(公告)号：US08382522B2
公开(公告)日：2013-02-26
申请号：US13191695
申请日：2011-07-27
IPC分类号： H01R13/648
CPC分类号： H01R12/585 , H01R12/725 , H01R13/6471 , H01R13/6587
摘要： A substrate is disclosed that is configured to receive an electrical component. The substrate comprises a plurality of first vias and a plurality of second vias. The plurality of first vias is arranges in the substrate in a matrix of rows and columns and is configured to provide mounting of the electric component, each first via associated with one of its closest neighbor first via to form a pair. The plurality of second vias is capable of being electrically commoned to one another and is positioned amongst the plurality of first vias such that there is at least one second via positioned directly between each first via and any of the closest non-pair first via neighbors.
摘要翻译： 公开了一种被配置为接收电气部件的基板。 衬底包括多个第一通孔和多个第二通孔。 多个第一通孔以行和列的矩阵形式布置在基板中，并且被配置为提供电气部件的安装，每个第一通孔与其最近邻近的第一通孔相关联地形成一对。 多个第二通孔能够彼此电气共用并且位于多个第一通孔之间，使得存在至少一个第二通孔，其直接位于每个第一通路和任何最接近的非对第一通孔邻近件之间。
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公开(公告)号：US20100144201A1
公开(公告)日：2010-06-10
申请号：US12474587
申请日：2009-05-29
申请人： George R. Defibaugh , James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan C. Wickes
发明人： George R. Defibaugh , James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan C. Wickes
IPC分类号： H01R13/648
CPC分类号： H01R13/514 , H01R12/58 , H01R13/6471 , H01R13/6586 , H01R13/6587
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
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公开(公告)号：US20100144167A1
公开(公告)日：2010-06-10
申请号：US12474568
申请日：2009-05-29
申请人： James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan Charles Wickes
发明人： James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan Charles Wickes
CPC分类号： H01R13/514 , H01R12/585 , H01R12/725 , H01R13/6477 , H01R13/6587 , H01R13/6599
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
摘要翻译： 公开了用于安装能够以高达至少25Gbps的速度运行的基板的高速背板连接器系统，而在一些实施方式中还提供了每英寸至少50对电连接器的销密度。 高速连接器系统的实现可以提供接地屏蔽和/或接地结构，其基本上封装整个背板占用面积，背板连接器和子卡内部的三维方式的可能是差分电连接器对的电连接器对 脚印。 当高速背板连接器系统在高达至少30GHz的频率下工作时，这些封装接地屏蔽和/或接地结构防止非横向，纵向和高阶模式的不期望的传播。
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公开(公告)号：US20100144168A1
公开(公告)日：2010-06-10
申请号：US12474626
申请日：2009-05-29
IPC分类号： H01R12/00
CPC分类号： H01R12/585 , H01R13/6587
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
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5.发明申请ELECTRICAL CONNECTOR HAVING IMPROVED DENSITY AND ROUTING CHARACTERISTICS AND RELATED METHODS 有权具有改善密度和路由特性的电连接器及相关方法公开(公告)号：US20080182460A1
公开(公告)日：2008-07-31
申请号：US12020345
申请日：2008-01-25
申请人： James L. Fedder , Douglas W. Glover , David W. Helster , Chad W. Morgan , Brent Rothermel , Alex M. Sharf , Attalee S. Taylor , David A. Trout
发明人： James L. Fedder , Douglas W. Glover , David W. Helster , Chad W. Morgan , Brent Rothermel , Alex M. Sharf , Attalee S. Taylor , David A. Trout
IPC分类号： H01R4/48
CPC分类号： H01R12/585 , H01R12/7064 , H01R13/6471 , H01R13/6477 , H01R13/6587
摘要： An electrical terminal of the type to be inserted into an aperture of an electrical panel member is provided. The electrical terminal may include a base, an insertion portion extending from the base to a first end, a slit formed through the insertion portion and defining a compliant portion having a first leg and a second leg. A segment of the first leg may be deformed in one direction, while a segment of the second leg may deformed in the opposite direction. Midpoints of each or both legs may be offset from the midpoint of the slit to achieve improved mechanical and electrical performance within a connector. Also provided is an electrical terminal having a tip that facilitates alignment with a panel member aperture and provides tactile feedback to a user, as well as an electrical terminal having a mounting end that is substantially smaller than its mating end, and connectors containing such terminals. Methods of routing electrical traces between adjacent electrical terminals are also provided.
摘要翻译： 设置插入电气面板部件的孔的类型的电气端子。 电端子可以包括基部，从基部延伸到第一端的插入部分，穿过插入部分形成的狭缝并且限定具有第一腿部和第二腿部的柔顺部分。 第一支腿的一段可以在一个方向上变形，而第二支腿的一段可能沿相反的方向变形。 每个腿或两个腿的中点可以从狭缝的中点偏移，以实现连接器内的改善的机械和电气性能。 还提供一种具有尖端的电端子，其有助于与面板构件孔对准并且向用户提供触觉反馈，以及具有基本上小于其配合端的安装端的电端子和包含这种端子的连接器。 还提供了在相邻电端子之间布置电迹线的方法。
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公开(公告)号：US20080182438A1
公开(公告)日：2008-07-31
申请号：US12020066
申请日：2008-01-25
申请人： James L. Fedder , Douglas W. Glover , David W. Helster , Chad W. Morgan , Brent Rothermel , Alex M. Sharf , Attalee S. Taylor , David A. Trout
发明人： James L. Fedder , Douglas W. Glover , David W. Helster , Chad W. Morgan , Brent Rothermel , Alex M. Sharf , Attalee S. Taylor , David A. Trout
IPC分类号： H01R13/648
CPC分类号： H01R12/585 , H01R12/52 , H01R12/7064 , H01R12/724 , H01R13/6471 , H01R13/6477 , H01R13/6587
摘要： An electrical terminal of the type to be inserted into an aperture of an electrical panel member is provided. The electrical terminal may include a base, an insertion portion extending from the base to a first end, a slit formed through the insertion portion and defining a compliant portion having a first leg and a second leg. A segment of the first leg may be deformed in one direction, while a segment of the second leg may deformed in the opposite direction. Midpoints of each or both legs may be offset from the midpoint of the slit to achieve improved mechanical and electrical performance within a connector. Also provided is an electrical terminal having a tip that facilitates alignment with a panel member aperture and provides tactile feedback to a user, as well as an electrical terminal having a mounting end that is substantially smaller than its mating end, and connectors containing such terminals. Methods of routing electrical traces between adjacent electrical terminals are also provided.
摘要翻译： 设置插入电气面板部件的孔的类型的电气端子。 电端子可以包括基部，从基部延伸到第一端的插入部分，穿过插入部分形成的狭缝并且限定具有第一腿部和第二腿部的柔顺部分。 第一支腿的一段可以在一个方向上变形，而第二支腿的一段可能沿相反的方向变形。 每个腿或两个腿的中点可以从狭缝的中点偏移，以实现连接器内的改善的机械和电气性能。 还提供一种具有尖端的电端子，其有助于与面板构件孔对准并且向用户提供触觉反馈，以及具有基本上小于其配合端的安装端的电端子和包含这种端子的连接器。 还提供了在相邻电端子之间布置电迹线的方法。
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公开(公告)号：US06824391B2
公开(公告)日：2004-11-30
申请号：US09498268
申请日：2000-02-03
IPC分类号： H01R13648
CPC分类号： H01R13/6658 , H01R12/724 , H01R13/514 , H01R13/6471 , H01R13/6477 , H01R13/6586 , H05K1/0218 , H05K1/0286 , H05K1/144
摘要： An electrical connector includes a housing (12) and circuit boards (13) carried by the housing. The circuit boards extend parallel to each other in spaced-apart relationship. The circuit boards include signal tracks (14) that provide electrical paths through the connector. The electrical paths extend from a mating interface (16) at one end of the connector to a mounting interface (17) at another end of the connector. The circuit boards include a first type (1) and a second type (2), the first type having circuitry arranged in a first pattern, and the second type having circuitry arranged in a second pattern which is different than the first pattern.
摘要翻译： 电连接器包括壳体（12）和由壳体承载的电路板（13）。 电路板以间隔的关系彼此平行地延伸。 电路板包括提供通过连接器的电路径的信号轨道（14）。 电气路径从连接器一端的配合接口（16）延伸到连接器另一端的安装接口（17）。 电路板包括第一类型（1）和第二类型（2），第一类型具有以第一图案布置的电路，并且第二类型具有以与第一图案不同的第二图案布置的电路。
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公开(公告)号：US08221139B2
公开(公告)日：2012-07-17
申请号：US12880411
申请日：2010-09-13
申请人： Jie Qin , Steven J. Millard , David W. Helster
发明人： Jie Qin , Steven J. Millard , David W. Helster
IPC分类号： H01R4/66
CPC分类号： H01R13/6471 , H01R12/724 , H01R12/732 , H01R31/08
摘要： An electrical connector includes a housing having a front and a rear opposite the housing with a rear wall at the rear. The housing has a slot open through the front that receives a mating connector therein. The housing has contact openings through the rear wall and a ground clip channel in the rear wall open at the rear. Signal contacts are held in the housing and arranged in pairs. The signal contacts are received in corresponding contact openings and are arranged within the slot to mate with the mating connector. Ground contacts are held in the housing and are arranged between corresponding signal contacts. The ground contacts are received in corresponding contact openings and are arranged within the slot to mate with the mating connector. A ground clip is loaded into the ground clip channel. The ground clip engages the ground contacts to create a ground circuit between the ground contacts engaged by the ground clip.
摘要翻译： 电连接器包括具有与壳体相对的前后相反的后壳的壳体。 壳体具有通过前部开口的槽，其中容纳配合连接器。 壳体通过后壁具有接触开口，后壁上的接地夹通道在后部开口。 信号触点保持在壳体中并成对布置。 信号触点被接收在相应的接触开口中并且布置在槽内以与配合连接器配合。 接地触点保持在壳体中并且布置在相应的信号触点之间。 接地触头被接收在相应的接触开口中并且布置在槽内以与配合连接器配合。 接地夹被加载到接地夹通道中。 接地夹与接地触头接合，以在由接地夹接合的接地触点之间产生接地电路。
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公开(公告)号：US20120064743A1
公开(公告)日：2012-03-15
申请号：US12880411
申请日：2010-09-13
申请人： Jie QIN , Steven J. MILLARD , David W. HELSTER
发明人： Jie QIN , Steven J. MILLARD , David W. HELSTER
IPC分类号： H01R12/02
CPC分类号： H01R13/6471 , H01R12/724 , H01R12/732 , H01R31/08
摘要： An electrical connector includes a housing having a front and a rear opposite the housing with a rear wall at the rear. The housing has a slot open through the front that receives a mating connector therein. The housing has contact openings through the rear wall and a ground clip channel in the rear wall open at the rear. Signal contacts are held in the housing and arranged in pairs. The signal contacts are received in corresponding contact openings and are arranged within the slot to mate with the mating connector. Ground contacts are held in the housing and are arranged between corresponding signal contacts. The ground contacts are received in corresponding contact openings and are arranged within the slot to mate with the mating connector. A ground clip is loaded into the ground clip channel. The ground clip engages the ground contacts to create a ground circuit between the ground contacts engaged by the ground clip.
摘要翻译： 电连接器包括具有与壳体相对的前后相反的后壳的壳体。 壳体具有通过前部开口的槽，其中容纳配合连接器。 壳体通过后壁具有接触开口，后壁上的接地夹通道在后部开口。 信号触点保持在壳体中并成对布置。 信号触点被接收在相应的接触开口中并且布置在槽内以与配合连接器配合。 接地触点保持在壳体中并且布置在相应的信号触点之间。 接地触头被接收在相应的接触开口中并且布置在槽内以与配合连接器配合。 接地夹被加载到接地夹通道中。 接地夹与接地触头接合，以在由接地夹接合的接地触点之间产生接地电路。
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公开(公告)号：US20110278057A1
公开(公告)日：2011-11-17
申请号：US13191695
申请日：2011-07-27
IPC分类号： H05K1/02
CPC分类号： H01R12/585 , H01R12/725 , H01R13/6471 , H01R13/6587
摘要： A substrate is disclosed that is configured to receive an electrical component. The substrate comprises a plurality of first vias and a plurality of second vias. The plurality of first vias is arranges in the substrate in a matrix of rows and columns and is configured to provide mounting of the electric component, each first via associated with one of its closest neighbor first via to form a pair. The plurality of second vias is capable of being electrically commoned to one another and is positioned amongst the plurality of first vias such that there is at least one second via positioned directly between each first via and any of the closest non-pair first via neighbors.
摘要翻译： 公开了一种被配置为接收电气部件的基板。 衬底包括多个第一通孔和多个第二通孔。 多个第一通孔以行和列的矩阵形式布置在基板中，并且被配置为提供电气部件的安装，每个第一通孔与其最近邻近的第一通孔相关联地形成一对。 多个第二通孔能够彼此电气共用并且位于多个第一通孔之间，使得存在至少一个第二通孔，其直接位于每个第一通路和任何最接近的非对第一通孔邻近件之间。
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