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1.发明授权Semiconductor package substrate and method, in particular for MEMS devices 有权半导体封装衬底和方法，特别是用于MEMS器件公开(公告)号：US07616451B2
公开(公告)日：2009-11-10
申请号：US11581216
申请日：2006-10-13
CPC分类号： H05K1/0271 , B81B7/0048 , B81B2207/07 , H01L23/3121 , H01L23/49838 , H01L23/562 , H01L2924/0002 , H01L2924/1433 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.
摘要翻译： 一种适用于支撑损伤敏感器件的半导体封装衬底，包括具有第一和相对表面的衬底芯; 覆盖封装衬底芯的第一和相对表面的至少一对金属层，其限定第一和相对的金属层组，所述层组中的至少一个包括至少一个金属支撑区; 一对焊接掩模层，覆盖至少一对金属层的最外层金属层; 和多条路线; 其中所述至少一个金属支撑区域被形成为使得其位于所述损伤敏感装置的所述基部的至少一侧的下方，并且占据所述损伤敏感装置下方的所述区域的大部分，所述损伤敏感装置没有所述 路线; 还描述了制造这种基板的方法。
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公开(公告)号：US08411457B2
公开(公告)日：2013-04-02
申请号：US12615921
申请日：2009-11-10
CPC分类号： H05K1/0271 , B81B7/0048 , B81B2207/07 , H01L23/3121 , H01L23/49838 , H01L23/562 , H01L2924/0002 , H01L2924/1433 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.
摘要翻译： 一种适用于支撑损伤敏感器件的半导体封装衬底，包括具有第一和相对表面的衬底芯; 覆盖封装衬底芯的第一和相对表面的至少一对金属层，其限定第一和相对的金属层组，所述层组中的至少一个包括至少一个金属支撑区; 一对焊接掩模层，覆盖至少一对金属层的最外层金属层; 和多条路线; 其中所述至少一个金属支撑区域被形成为使得其位于所述损伤敏感装置的所述基部的至少一侧的下方，并且占据所述损伤敏感装置下方的所述区域的大部分，所述损伤敏感装置没有所述 路线; 还描述了制造这种基板的方法。
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3.发明申请Semiconductor package substrate and method, in particular for MEMS devices 有权半导体封装衬底和方法，特别是用于MEMS器件公开(公告)号：US20080087997A1
公开(公告)日：2008-04-17
申请号：US11581216
申请日：2006-10-13
IPC分类号： H01L23/02
CPC分类号： H05K1/0271 , B81B7/0048 , B81B2207/07 , H01L23/3121 , H01L23/49838 , H01L23/562 , H01L2924/0002 , H01L2924/1433 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.
摘要翻译： 一种适用于支撑损伤敏感器件的半导体封装衬底，包括具有第一和相对表面的衬底芯; 覆盖封装衬底芯的第一和相对表面的至少一对金属层，其限定第一和相对的金属层组，所述层组中的至少一个包括至少一个金属支撑区; 一对焊接掩模层，覆盖至少一对金属层的最外层金属层; 和多条路线; 其中所述至少一个金属支撑区域被形成为使得其位于所述损伤敏感装置的所述基部的至少一侧的下方，并且占据所述损伤敏感装置下方的所述区域的大部分，所述损伤敏感装置没有所述 路线; 还描述了制造这种基板的方法。
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