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1.发明申请INTEGRATED INDUCTOR DEVICE WITH HIGH INDUCTANCE, FOR EXAMPLE FOR USE AS AN ANTENNA IN A RADIOFREQUENCY IDENTIFICATION SYSTEM 有权具有高电感的集成电感器器件，用作无线电识别系统中的天线的示例公开(公告)号：US20120249276A1
公开(公告)日：2012-10-04
申请号：US13437843
申请日：2012-04-02
IPC分类号： H01F27/30
CPC分类号： H01F17/0013
摘要： An embodiment of integrated inductor device, comprising a plurality of modules overlaid to each other, each module including at least one coil of conducting material. The directly overlaid pairs of coils are coiled in opposite directions. The directly overlaid modules are mechanically coupled through first adhesive conductive regions and the coils of the directly overlaid modules are electrically coupled to each other through second adhesive conductive regions. The first and the second adhesive conductive regions coupling directly overlaid modules are formed in the same step of the process, are of the same material and are arranged at a same level.
摘要翻译： 集成电感器件的实施例包括彼此重叠的多个模块，每个模块包括至少一个导电材料线圈。 直接重叠的线圈对在相反方向盘绕。 直接覆盖的模块通过第一粘合导电区域机械耦合，并且直接覆盖的模块的线圈通过第二粘合剂导电区域彼此电耦合。 耦合直接重叠的模块的第一和第二粘合剂导电区域在该过程的相同步骤中形成，具有相同的材料并且被布置在相同的水平。
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2.发明授权Semiconductor package substrate and method, in particular for MEMS devices 有权半导体封装衬底和方法，特别是用于MEMS器件公开(公告)号：US07616451B2
公开(公告)日：2009-11-10
申请号：US11581216
申请日：2006-10-13
CPC分类号： H05K1/0271 , B81B7/0048 , B81B2207/07 , H01L23/3121 , H01L23/49838 , H01L23/562 , H01L2924/0002 , H01L2924/1433 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.
摘要翻译： 一种适用于支撑损伤敏感器件的半导体封装衬底，包括具有第一和相对表面的衬底芯; 覆盖封装衬底芯的第一和相对表面的至少一对金属层，其限定第一和相对的金属层组，所述层组中的至少一个包括至少一个金属支撑区; 一对焊接掩模层，覆盖至少一对金属层的最外层金属层; 和多条路线; 其中所述至少一个金属支撑区域被形成为使得其位于所述损伤敏感装置的所述基部的至少一侧的下方，并且占据所述损伤敏感装置下方的所述区域的大部分，所述损伤敏感装置没有所述 路线; 还描述了制造这种基板的方法。
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3.发明授权Integrated inductor device with high inductance in a radiofrequency identification system 有权在射频识别系统中具有高电感的集成电感器件公开(公告)号：US09460841B2
公开(公告)日：2016-10-04
申请号：US13437843
申请日：2012-04-02
CPC分类号： H01F17/0013
摘要： An embodiment of integrated inductor device, comprising a plurality of modules overlaid to each other, each module including at least one coil of conducting material. The directly overlaid pairs of coils are coiled in opposite directions. The directly overlaid modules are mechanically coupled through first adhesive conductive regions and the coils of the directly overlaid modules are electrically coupled to each other through second adhesive conductive regions. The first and the second adhesive conductive regions coupling directly overlaid modules are formed in the same step of the process, are of the same material and are arranged at a same level.
摘要翻译： 集成电感器件的实施例包括彼此重叠的多个模块，每个模块包括至少一个导电材料线圈。 直接重叠的线圈对在相反方向盘绕。 直接覆盖的模块通过第一粘合导电区域机械耦合，并且直接覆盖的模块的线圈通过第二粘合剂导电区域彼此电耦合。 耦合直接重叠的模块的第一和第二粘合剂导电区域在该过程的相同步骤中形成，具有相同的材料并且被布置在相同的水平。
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4.发明授权Semiconductor package substrate and methods for forming same, in particular for MEMS devices 有权半导体封装基板及其形成方法，特别是用于MEMS器件公开(公告)号：US08633583B2
公开(公告)日：2014-01-21
申请号：US11879239
申请日：2007-07-16
申请人： Federico Giovanni Ziglioli , Giovanni Graziosi , Mark Andrew Shaw , Mario Francesco Cortese , Conrad Max Cachia
发明人： Federico Giovanni Ziglioli , Giovanni Graziosi , Mark Andrew Shaw , Mario Francesco Cortese , Conrad Max Cachia
IPC分类号： H01L23/04
CPC分类号： B81B7/007 , B81B7/0048 , B81B2207/096 , B81C2203/0154 , H01L23/49827 , H01L23/49838 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor package substrate suitable for supporting a damage-sensitive device and a package substrate core having an upper and a lower surface. At least one pair of metal layers coats the upper and lower surfaces of the package substrate core. One pair of solder mask layers coats the outer metal layers of the at least one pair of metal layers. A plurality of vias is formed across the package substrate core and the at least one pair of metal layers. Advantageously, the plurality of vias is substantially distributed according to a homogeneous pattern in an area that is to be covered by the damage-sensitive device. A method for the production of such semiconductor package substrate is also described.
摘要翻译： 一种适于支撑损伤敏感器件的半导体封装衬底和具有上表面和下表面的封装衬底芯。 至少一对金属层涂覆封装衬底芯的上表面和下表面。 一对焊接掩模层涂覆至少一对金属层的外金属层。 跨越封装衬底芯和至少一对金属层形成多个通孔。 有利地，多个通孔根据待被损伤敏感装置覆盖的区域中的均匀图案基本上分布。 还描述了制造这种半导体封装基板的方法。
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公开(公告)号：US08411457B2
公开(公告)日：2013-04-02
申请号：US12615921
申请日：2009-11-10
CPC分类号： H05K1/0271 , B81B7/0048 , B81B2207/07 , H01L23/3121 , H01L23/49838 , H01L23/562 , H01L2924/0002 , H01L2924/1433 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.
摘要翻译： 一种适用于支撑损伤敏感器件的半导体封装衬底，包括具有第一和相对表面的衬底芯; 覆盖封装衬底芯的第一和相对表面的至少一对金属层，其限定第一和相对的金属层组，所述层组中的至少一个包括至少一个金属支撑区; 一对焊接掩模层，覆盖至少一对金属层的最外层金属层; 和多条路线; 其中所述至少一个金属支撑区域被形成为使得其位于所述损伤敏感装置的所述基部的至少一侧的下方，并且占据所述损伤敏感装置下方的所述区域的大部分，所述损伤敏感装置没有所述 路线; 还描述了制造这种基板的方法。
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6.发明申请公开(公告)号：US20100052144A1
公开(公告)日：2010-03-04
申请号：US12615921
申请日：2009-11-10
CPC分类号： H05K1/0271 , B81B7/0048 , B81B2207/07 , H01L23/3121 , H01L23/49838 , H01L23/562 , H01L2924/0002 , H01L2924/1433 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.
摘要翻译： 一种适用于支撑损伤敏感器件的半导体封装衬底，包括具有第一和相对表面的衬底芯; 覆盖封装衬底芯的第一和相对表面的至少一对金属层，其限定第一和相对的金属层组，所述层组中的至少一个包括至少一个金属支撑区; 一对焊接掩模层，覆盖至少一对金属层的最外层金属层; 和多条路线; 其中所述至少一个金属支撑区域被形成为使得其位于所述损伤敏感装置的所述基部的至少一侧的下方，并且占据所述损伤敏感装置下方的所述区域的大部分，所述损伤敏感装置没有所述 路线; 还描述了制造这种基板的方法。
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7.发明申请Semiconductor package substrate and methods for forming same, In particular for mems devices 有权半导体封装基板及其形成方法，特别适用于mems器件公开(公告)号：US20080128891A1
公开(公告)日：2008-06-05
申请号：US11879239
申请日：2007-07-16
申请人： Federico Giovanni Ziglioli , Giovanni Graziosi , Mark Andrew Shaw , Mario Francesco Cortese , Conrad Max Cachia
发明人： Federico Giovanni Ziglioli , Giovanni Graziosi , Mark Andrew Shaw , Mario Francesco Cortese , Conrad Max Cachia
IPC分类号： H01L23/055 , H01L21/58
CPC分类号： B81B7/007 , B81B7/0048 , B81B2207/096 , B81C2203/0154 , H01L23/49827 , H01L23/49838 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor package substrate suitable for supporting a damage-sensitive device and a package substrate core having an upper and a lower surface. At least one pair of metal layers coats the upper and lower surfaces of the package substrate core. One pair of solder mask layers coats the outer metal layers of the at least one pair of metal layers. A plurality of vias is formed across the package substrate core and the at least one pair of metal layers. Advantageously, the plurality of vias is substantially distributed according to a homogeneous pattern in an area that is to be covered by the damage-sensitive device. A method for the production of such semiconductor package substrate is also described.
摘要翻译： 一种适于支撑损伤敏感器件的半导体封装衬底和具有上表面和下表面的封装衬底芯。 至少一对金属层涂覆封装衬底芯的上表面和下表面。 一对焊接掩模层涂覆至少一对金属层的外金属层。 跨越封装衬底芯和至少一对金属层形成多个通孔。 有利地，多个通孔根据待被损伤敏感装置覆盖的区域中的均匀图案基本上分布。 还描述了制造这种半导体封装基板的方法。
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8.发明申请Semiconductor package substrate and method, in particular for MEMS devices 有权半导体封装衬底和方法，特别是用于MEMS器件公开(公告)号：US20080087997A1
公开(公告)日：2008-04-17
申请号：US11581216
申请日：2006-10-13
IPC分类号： H01L23/02
CPC分类号： H05K1/0271 , B81B7/0048 , B81B2207/07 , H01L23/3121 , H01L23/49838 , H01L23/562 , H01L2924/0002 , H01L2924/1433 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.
摘要翻译： 一种适用于支撑损伤敏感器件的半导体封装衬底，包括具有第一和相对表面的衬底芯; 覆盖封装衬底芯的第一和相对表面的至少一对金属层，其限定第一和相对的金属层组，所述层组中的至少一个包括至少一个金属支撑区; 一对焊接掩模层，覆盖至少一对金属层的最外层金属层; 和多条路线; 其中所述至少一个金属支撑区域被形成为使得其位于所述损伤敏感装置的所述基部的至少一侧的下方，并且占据所述损伤敏感装置下方的所述区域的大部分，所述损伤敏感装置没有所述 路线; 还描述了制造这种基板的方法。
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