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    Method of forming a printed thermistor on a metal sheet
    1.
    发明授权
    Method of forming a printed thermistor on a metal sheet 失效
    在金属片上形成印刷热敏电阻的方法

    公开(公告)号：US3574930A

    公开(公告)日：1971-04-13

    申请号：US3574930D

    申请日：1968-10-04

    Applicant: GEN MOTORS CORP

    Inventor： RIDDEL JOHN W ,  SCHWYN RAYMOND E

    IPC: H01C7/04

    CPC classification number: H01C7/041 ,  Y10T29/49085 ,  Y10T29/49099 ,  Y10T29/49101

    Abstract: This disclosure relates to thermistor assemblies, and more particularly to a nickel substrate having a thermistor film thereon and a method of making the same. The thermistor assembly is formed by coating a nickel substrate with a film of thermistor material and subsequently heating the coated nickel substrate until a thin, adherent insulative layer of nickel oxide is formed. The nickel oxide layer insulates the nickel substrate electrically from the thermistor material and it bonds the thermistor material to the nickel substrate. After the coated nickel substrate has cooled, two electrical contacts in spaced relationship to each other are printed on top of the thermistor film. This thermistor assembly as a fast temperature response, high heat dissipation characteristics which permit the thermistor to be operated at power levels above and below one watt, and provides a sturdy construction which is not readily broken.

    Thick film resistor paste containing tantala glass
    4.
    发明授权
    Thick film resistor paste containing tantala glass 失效
    厚膜电阻膏含有钽铁玻璃

    公开(公告)号：US3928243A

    公开(公告)日：1975-12-23

    申请号：US48533774

    申请日：1974-07-03

    Applicant: GEN MOTORS CORP

    Inventor： KUDZA THOMAS M ,  SCHWYN RAYMOND E ,  BERG MORRIS

    IPC: H01C7/06 ,  H01C17/065 ,  H01B1/02

    CPC classification number: H01C17/0654 ,  C03C3/072 ,  C03C8/10 ,  C03C8/14 ,  C03C8/18 ,  H01C7/06

    Abstract: Resistor compositions yielding smooth surface resistor films of up to about 25,000 ohms per square per mil thickness which is little affected by humidity and exposure to peak firing temperature and has low TCR values, comprising relatively small amounts of ruthenia, antimony or bismuth trioxides and tantala, and relatively large amounts of silver, lead-borosilicate glass and conducting tantala glass.

    Abstract translation: 电阻组合物产生高达约25,000欧姆/平方密耳厚度的平滑表面电阻膜，其几乎不受湿度影响并暴露于峰值烧结温度，并且具有低TCR值，其包含相对少量的钌，锑或三氧化铋和钽铁， 和相对大量的银，铅 - 硼硅酸盐玻璃和导电钽铁玻璃。

    Metallizing process for glass-free ceramics bodies
    9.
    发明授权
    Metallizing process for glass-free ceramics bodies 失效
    无玻璃陶瓷机构的金属化工艺

    公开(公告)号：US3637435A

    公开(公告)日：1972-01-25

    申请号：US3637435D

    申请日：1969-07-08

    Applicant: GEN MOTORS CORP

    Inventor： SCHWYN RAYMOND E ,  BERG MORRIS

    IPC: C04B41/51 ,  C04B41/88 ,  C04B41/14

    CPC classification number: C04B41/009 ,  C04B41/51 ,  C04B41/5133 ,  C04B41/5138 ,  C04B41/88

    Abstract: This invention relates to sintered, substantially glass-free, ceramic bodies, and more particularly to an improved method of producing a metallized surface on such ceramic bodies. The method includes coating a sintered ceramic body with a metallizing ink composition containing a metal from the group molybdenum, tungsten, and mixtures of each of such metals with manganese, and subsequently firing the coated ceramic body in a wet reducing atmosphere to oxidize the metal from said first-mentioned group to yield a metallic layer which is tightly bonded to the surface of the ceramic body. The oxide of the metal from said firstmentioned group bonds directly to the ceramic body which in turn mechanically adheres the metal layer, from said second-mentioned group, to the ceramic body.

    Abstract translation: 本发明涉及烧结的，基本上无玻璃的陶瓷体，更具体地说，涉及在这种陶瓷体上制造金属化表面的改进方法。 该方法包括用含有钼，钨的金属和这些金属与锰的混合物的金属化油墨组合物涂覆烧结陶瓷体，随后在湿还原气氛中焙烧涂覆的陶瓷体以将金属氧化为 所述第一提及的组产生紧密结合到陶瓷体表面的金属层。 来自所述第一组的金属的氧化物直接结合到陶瓷体，陶瓷体又将金属层从所述第二提到的组织机械地粘附到陶瓷体。

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