公开(公告)号：US12094646B1

公开(公告)日：2024-09-17

申请号：US18134170

申请日：2023-04-13

Applicant: KING SAUD UNIVERSITY

Inventor： Hadi Rasam Alqahtani ,  Alhanouf Abdullah Alrwais

IPC: H01F41/00 ,  B22F1/054 ,  B22F1/14 ,  B82Y10/00 ,  B82Y25/00 ,  B82Y40/00 ,  C22C19/03 ,  H01F1/147

CPC classification number: H01F41/00 ,  B22F1/0547 ,  B22F1/056 ,  B22F1/14 ,  B82Y10/00 ,  B82Y25/00 ,  B82Y40/00 ,  C22C19/03 ,  H01F1/14708 ,  B22F2202/05 ,  B22F2301/15 ,  B22F2998/10 ,  B22F2999/00 ,  C22C2202/02

Abstract: The method for tuning the magnetic behavior of soft magnetic nanowires includes forming a pair of defects at axially-opposed ends of the nanowire. The defects change the switching field of the nanowire. As demonstrated by Object-Oriented MicroMagnetic Framework (OOMMF) simulation, the switching field value of the nanowire modified by a pair of defects at the two axially-opposed ends of the nanowire is more than the switching field value of a defect-free nanowire. The defect at each end may be a notch or an anti-notch.

公开(公告)号：US20230320000A1

公开(公告)日：2023-10-05

申请号：US18206134

申请日：2023-06-06

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Yoshiharu HIRAKATA ,  Yasuhiro JINBO ,  Shunpei YAMAZAKI

IPC: H05K5/00 ,  H10K50/84 ,  H10K59/121 ,  H10K77/10 ,  G09F9/30 ,  G06F1/16 ,  H01F1/147

CPC classification number: H05K5/0017 ,  H10K50/84 ,  H10K59/1213 ,  H10K77/111 ,  G09F9/301 ,  G06F1/1616 ,  H01F1/14708 ,  H01F1/14791 ,  H05K5/0086 ,  Y02E10/549 ,  H10K50/844

Abstract: A light-emitting device can be folded in such a manner that a flexible light-emitting panel is supported by a plurality of housings which are provided spaced from each other and the light-emitting panel is bent so that surfaces of adjacent housings are in contact with each other. Furthermore, in the light-emitting device, in which part or the whole of the housings have magnetism, the two adjacent housings can be fixed to each other by a magnetic force when the light-emitting device is used in a folded state.

公开(公告)号：US09875839B2

公开(公告)日：2018-01-23

申请号：US15000997

申请日：2016-01-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Youn Kyu Choi ,  Mi Jung Kang ,  Hea Ah Kim ,  Yun Young Yang ,  Jae Yeol Choi

IPC: H01F5/00 ,  H01F17/04 ,  H01F27/24 ,  H01F27/255 ,  H01F27/29 ,  H01F17/00 ,  H01F1/147 ,  H01F1/153

CPC classification number: H01F27/255 ,  H01F1/14708 ,  H01F1/15308 ,  H01F17/0013 ,  H01F27/292

Abstract: A magnetic composition includes: coarse powder containing a non-crystalline iron-based material; medium powder containing a crystalline iron-based material; and fine powder containing nickel. A ratio of the coarse powder and the medium powder is in a range of 65:35 to 80:20, and the amount of the fine powder is in a range of 3 wt % to 7 wt % on the basis of a total weight of the coarse powder and the medium powder.

公开(公告)号：US09735102B2

公开(公告)日：2017-08-15

申请号：US14660955

申请日：2015-03-18

Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.

Inventor： Lulu Peng ,  Donald Ray Disney

IPC: H01L23/52 ,  H01F27/28 ,  H01F1/14 ,  H01F27/24 ,  H01L23/522 ,  H01F1/147 ,  H01L49/02

CPC classification number: H01L23/5227 ,  H01F1/14708 ,  H01F17/0013 ,  H01F17/06 ,  H01F27/24 ,  H01F27/2804 ,  H01F2027/2809 ,  H01L28/10

Abstract: Devices and methods of forming a device are disclosed. The method includes providing a wafer that includes a center insulator layer sandwiched by a top substrate and a bottom substrate. Both sides of the wafer are patterned and etched in sequence to form deep trenches in both substrates. A conductive seed layer is formed on both sides of the wafer in sequence to cover all exposed areas. Both sides of the wafer are electroplated simultaneously to fill both deep trenches with a conductive material. Both sides of the wafer are polished in sequence to form a coplanar surface. A protective layer is deposited on both sides of the wafer in sequence. Selective portions of the protective layer on both sides are patterned and etched in sequence to expose micro bump bonding areas. Micro bumps are formed on both sides of the wafer in sequence to facilitate electrical connection.

公开(公告)号：US20170178788A1

公开(公告)日：2017-06-22

申请号：US14978353

申请日：2015-12-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hariklia Deligianni ,  William J. Gallagher ,  Eugene J. O'Sullivan ,  Naigang Wang

IPC: H01F27/28 ,  H01F1/147 ,  H01F41/04 ,  H01F27/24

CPC classification number: H01L28/10 ,  C23C14/14 ,  H01F1/147 ,  H01F1/14708 ,  H01F10/3218 ,  H01F10/3254 ,  H01F10/3268 ,  H01F10/3295 ,  H01F17/0006 ,  H01F27/24 ,  H01F27/2804 ,  H01F41/042 ,  H01F41/304 ,  H01F2017/0066 ,  H01F2027/2809 ,  H01L21/0273 ,  H01L21/32051 ,  H01L21/32139

Abstract: Disclosed are magnetic structures, including on-chip inductors comprising laminated layers comprising, in order, a barrier and/or adhesion layer, a antiferromagnetic layer, a magnetic growth layer, a soft magnetic layer, an insulating non-magnetic spacer, a soft magnetic layer, a magnetic growth later, an antiferromagnetic layer. Also disclosed are methods of making such structures.

公开(公告)号：US09671028B2

公开(公告)日：2017-06-06

申请号：US14587996

申请日：2014-12-31

Applicant: METSO AUTOMATION USA INC.

Inventor： Ross Kunz

IPC: F16K31/06 ,  F16K11/044 ,  F16K27/02 ,  H01F7/16

CPC classification number: F16K31/0679 ,  F16K11/044 ,  F16K11/0712 ,  F16K27/0263 ,  F16K27/029 ,  F16K27/041 ,  F16K31/0675 ,  F16K31/0682 ,  H01F1/14708 ,  H01F7/064 ,  H01F7/16 ,  H01F7/1638 ,  Y10T137/86614 ,  Y10T137/86622 ,  Y10T137/87885

Abstract: A solenoid valve has a housing defining a first axis and second axis, a solenoid which produces a magnetic field along the first axis, a valve shaft movable between open and closed positions along the second axis, and a manifold mounted to the housing. The shaft is biased toward the closed position by a spring and mechanical forces sufficient to overcome the force of the spring are transferred from the solenoid to the shaft by a lever to displace the shaft and then hold a first poppet valve open. The first poppet valve, which interacts with a portion of the housing to close the first valve, and a second poppet valve, which interacts with portions of the manifold to route fluid to the desired port, are mounted to the shaft. An electronic circuit controls delivery of current to the solenoid to shift and hold the shaft in the open position.

公开(公告)号：US09613897B2

公开(公告)日：2017-04-04

申请号：US14537942

申请日：2014-11-11

Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.

Inventor： Mahesh Bhatkar ,  Lulu Peng ,  Wanbing Yi ,  Juan Boon Tan ,  Luke England

IPC: H01F5/00 ,  H01F27/28 ,  H01L23/522 ,  H01F27/24 ,  H01F1/147 ,  H01F1/14 ,  H01L49/02

CPC classification number: H01L23/5227 ,  H01F1/14 ,  H01F1/14708 ,  H01F1/14766 ,  H01F17/0013 ,  H01F27/24 ,  H01F27/2804 ,  H01F41/046 ,  H01F2017/0066 ,  H01F2027/2809 ,  H01L28/10 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Magnetic core inductors implemented on integrated circuits and methods for fabricating such magnetic core inductors are disclosed. An exemplary magnetic core inductor includes a bottom magnetic plate that includes a center portion and first, second, third, and fourth extension portions extending from the center portion. The exemplary magnetic core inductor includes an interlayer dielectric layer disposed over the bottom magnetic plate, and within the interlayer dielectric layer, first, second, third, and fourth via trenches extending above a respective one of the first, second, third, and fourth extension portions, and a fifth via trench extending above the center portion. The magnetic core inductor further includes a stacked-ring inductor coil including a plurality of inductor rings surrounding the fifth via trench and a top magnetic plate including a center portion and first, second, third, and fourth extension portions extending from the center portion.

公开(公告)号：US20160260708A1

公开(公告)日：2016-09-08

申请号：US15156576

申请日：2016-05-17

Applicant: International Business Machines Corporation

Inventor： Philipp Herget ,  Eugene J. O'Sullivan ,  Lubomyr T. Romankiw ,  Naigang Wang ,  Bucknell C. Webb

IPC: H01L27/06 ,  H01L49/02

CPC classification number: H01L27/22 ,  G11B5/3163 ,  H01F1/14708 ,  H01F7/021 ,  H01F10/14 ,  H01F27/24 ,  H01F27/2804 ,  H01F2027/2809 ,  H01L27/0641 ,  H01L27/224 ,  H01L28/10 ,  H01L43/02 ,  H01L43/10 ,  H01L43/12

Abstract: A mechanism is provided for an integrated laminated magnetic device. A substrate and a multilayer stack structure form the device. The multilayer stack structure includes alternating magnetic layers and diode structures formed on the substrate. Each magnetic layer in the multilayer stack structure is separated from another magnetic layer in the multilayer stack structure by a diode structure.

公开(公告)号：US20160186882A1

公开(公告)日：2016-06-30

申请号：US14587996

申请日：2014-12-31

Applicant: METSO AUTOMATION USA INC.

Inventor： Ross Kunz

IPC: F16K31/06 ,  F16K27/04 ,  F16K11/065

CPC classification number: F16K31/0679 ,  F16K11/044 ,  F16K11/0712 ,  F16K27/0263 ,  F16K27/029 ,  F16K27/041 ,  F16K31/0675 ,  F16K31/0682 ,  H01F1/14708 ,  H01F7/064 ,  H01F7/16 ,  H01F7/1638 ,  Y10T137/86614 ,  Y10T137/86622 ,  Y10T137/87885

Abstract: A solenoid valve has a housing defining a first axis and second axis, a solenoid which produces a magnetic field along the first axis, a valve shaft movable between open and closed positions along the second axis, and a manifold mounted to the housing. The axis is biased toward the closed position by a spring and mechanical forces sufficient to overcome the force of the spring are transferred from the solenoid to the shaft by a lever to open the valve and then hold the valve open. A poppet seal, which interacts with a portion of the housing to close the valve, and a spool seal, which interacts with portions of the manifold to route fluid to the desired port, are mounted to the shaft. An electronic circuit controls delivery of current to the solenoid to shift and hold the shaft in the open position.

Abstract translation: 电磁阀具有限定第一轴线和第二轴线的壳体，沿着第一轴线产生磁场的螺线管，沿着第二轴线在打开和关闭位置之间运动的阀杆以及安装到壳体的歧管。 轴通过弹簧偏压到关闭位置，并且足以克服弹簧的力的机械力通过杠杆从螺线管传递到轴，以打开阀，然后将阀保持打开。 与壳体的一部分相互作用以关闭阀的提升阀密封件和与歧管的部分相互作用以将流体引导到期望的端口的阀芯密封件安装到轴上。 电子电路控制向电磁线圈输送电流以将轴移动并保持在打开位置。

公开(公告)号：US20160163443A1

公开(公告)日：2016-06-09

申请号：US14743623

申请日：2015-06-18

Applicant: QUALCOMM Incorporated

Inventor： Mete ERTURK ,  Ravindra Vaman SHENOY ,  Kwan-yu LAI ,  Jitae KIM ,  Donald William KIDWELL JR. ,  Jon Bradley LASITER ,  James Thomas DOYLE ,  Omar James BCHIR

IPC: H01F27/28 ,  H01F41/14 ,  H05K1/18 ,  H01F41/02 ,  H05K1/11 ,  H01F27/24 ,  H01F1/147

CPC classification number: H01F27/2804 ,  H01F1/14708 ,  H01F5/00 ,  H01F17/0033 ,  H01F27/24 ,  H01F41/02 ,  H01F41/046 ,  H01F41/14 ,  H01F2017/002 ,  H01F2017/0066 ,  H01F2027/2809 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/645 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K1/111 ,  H05K1/165 ,  H05K1/182 ,  H05K2201/10166 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An inductor can include a first substrate, a magnetic piece, and a conductor. The first substrate can be formed within a second substrate. The magnetic piece can be connected to a first side of the first substrate. The conductor can be formed within the second substrate, on the second substrate, or both. The conductor can have an input and an output. The conductor can be configured to surround the first substrate without being in contact with the first substrate and without being in contact with the magnetic piece.

Abstract translation: 电感器可以包括第一衬底，磁片和导体。 第一基板可以形成在第二基板内。 磁片可以连接到第一衬底的第一侧。 导体可以形成在第二基板内，第二基板上，或两者上。 导体可以具有输入和输出。 导体可以被配置为围绕第一基板而不与第一基板接触并且不与磁片接触。