公开(公告)号：US09240326B2

公开(公告)日：2016-01-19

申请号：US14028022

申请日：2013-09-16

Applicant: GLOBALFOUNDRIES INC.

Inventor： Szu-lin Cheng ,  Jack O. Chu ,  Isaac Lauer ,  Jeng-bang Yau

IPC: H01L29/76 ,  H01L29/40 ,  H01L23/48 ,  H01L21/283 ,  H01L21/768 ,  H01L29/78 ,  H01L29/417 ,  H01L29/66 ,  H01L21/8234

CPC classification number: H01L21/283 ,  H01L21/76877 ,  H01L21/76897 ,  H01L21/823431 ,  H01L21/823475 ,  H01L29/41775 ,  H01L29/41791 ,  H01L29/665 ,  H01L29/66575 ,  H01L29/66795 ,  H01L29/785

Abstract: A photo-patternable dielectric material is provided to a structure which includes a substrate having at least one gate structure. The photo-patternable dielectric material is then patterned forming a plurality of sacrificial contact structures adjacent the at least one gate structure. A planarized middle-of-the-line dielectric material is then provided in which an uppermost surface of each of the sacrificial contact structures is exposed. Each of the exposed sacrificial contact structures is then removed providing contact openings within the planarized middle-of-the-line dielectric material. A conductive metal-containing material is formed within each contact opening.