公开(公告)号：US20150162180A1

公开(公告)日：2015-06-11

申请号：US14100610

申请日：2013-12-09

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Gero Grau ,  Steffen Kalisch ,  Joerg Weigang ,  William John Fosnight ,  Chinmay Oza ,  Detlef Pabst

IPC: H01L21/02

CPC classification number: H01L21/02 ,  G05B17/02 ,  G05B19/0426 ,  G05B19/41875 ,  G05B2219/23006 ,  H01L21/67727 ,  Y02P90/20 ,  Y02P90/22 ,  Y02P90/86

Abstract: A method includes processing each of a plurality of lots with at least one first equipment and moving some of the plurality of lots to a first storage. For each of a plurality of second equipments, an expected dispatch time of one or more next lots for processing by the second equipment is determined Each of the lots in the first storage is assigned to one of the plurality of second equipments on the basis of at least the determined expected dispatch times and moved to one of a plurality of second storages that is associated with one of the plurality of second equipments to which the respective lot was assigned. For each of the plurality of second equipments, each of the lots in the second storage associated with the second equipment is moved to the second equipment and are processed with the second equipment.

Abstract translation: 一种方法包括利用至少一个第一设备来处理多个批次中的每一个，并且将多个批次中的一些移动到第一存储器。 对于多个第二设备中的每一个，确定由第二设备处理的一个或多个下一批次的预期调度时间被确定基于在第一设备中的第一设备中的一个批次被分配给多个第二设备中的一个 至少所确定的预期分配时间并移动到与分配了相应批次的多个第二设备中的一个相关联的多个第二存储器之一。 对于多个第二设备中的每一个，与第二设备相关联的第二存储器中的批次中的每一个被移动到第二设备并且用第二设备进行处理。

公开(公告)号：US20140277668A1

公开(公告)日：2014-09-18

申请号：US13833932

申请日：2013-03-15

Applicant: GLOBALFOUNDRIES, INC.

Inventor： Chinmay Oza ,  William John Fosnight

IPC: G05B11/01

CPC classification number: G05B19/41865 ,  G05B2219/32325 ,  G05B2219/32328 ,  H01L21/67733 ,  H01L21/67736 ,  H01L21/67769 ,  Y02P80/40 ,  Y02P90/14 ,  Y02P90/20 ,  Y02P90/28

Abstract: Disclosed herein are methods and systems for semiconductor fabrication. In one embodiment, a method of semiconductor fabrication includes performing a process on substrates with an equipment unit to form processed substrates, communicating processing data from the equipment unit to a local scheduler and a universal scheduler, determining a priority of the processed substrates, and scheduling removal of processed substrates from the equipment unit and delivery of unprocessed substrates to the equipment unit by the local scheduler based on the processing data and the priority of the processed substrates.

Abstract translation: 这里公开了用于半导体制造的方法和系统。 在一个实施例中，一种半导体制造方法包括：在具有设备单元的基板上进行处理，以形成处理后的基板，将处理数据从设备单元传送到本地调度器和通用调度器，确定经处理的基板的优先级，以及调度 从设备单元去除已处理的基板，并且基于处理数据和处理的基板的优先级，由本地调度器将未处理的基板输送到设备单元。

公开(公告)号：US09748088B2

公开(公告)日：2017-08-29

申请号：US14100610

申请日：2013-12-09

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Gero Grau ,  Steffen Kalisch ,  Joerg Weigang ,  William John Fosnight ,  Chinmay Oza ,  Detlef Pabst

IPC: H01L21/02 ,  H01L21/677 ,  G05B17/02 ,  G05B19/042 ,  G05B19/418

CPC classification number: H01L21/02 ,  G05B17/02 ,  G05B19/0426 ,  G05B19/41875 ,  G05B2219/23006 ,  H01L21/67727 ,  Y02P90/20 ,  Y02P90/22 ,  Y02P90/86

Abstract: A method includes processing each of a plurality of lots with at least one first equipment and moving some of the plurality of lots to a first storage. For each of a plurality of second equipments, an expected dispatch time of one or more next lots for processing by the second equipment is determined. Each of the lots in the first storage is assigned to one of the plurality of second equipments on the basis of at least the determined expected dispatch times and moved to one of a plurality of second storages that is associated with one of the plurality of second equipments to which the respective lot was assigned. For each of the plurality of second equipments, each of the lots in the second storage associated with the second equipment is moved to the second equipment and are processed with the second equipment.

公开(公告)号：US09632499B2

公开(公告)日：2017-04-25

申请号：US14530947

申请日：2014-11-03

Applicant: GLOBALFOUNDRIES, Inc.

Inventor： Chinmay Oza ,  Gero Grau ,  William Fosnight ,  Detlef Pabst

IPC: H01L21/31 ,  G05B19/418 ,  H01L21/67 ,  H01L21/677

CPC classification number: G05B19/4189 ,  G05B2219/31002 ,  G05B2219/31013 ,  G05B2219/45031 ,  H01L21/67276 ,  H01L21/67727 ,  H01L21/67733 ,  Y02P80/40 ,  Y02P90/20 ,  Y02P90/28 ,  Y02P90/285

Abstract: Disclosed herein are methods and systems for semiconductor fabrication. In one embodiment, a method for fabricating semiconductors utilizing a semiconductor fabrication system includes performing a semiconductor fabrication process on a first lot of unprocessed semiconductor substrates with a semiconductor fabrication equipment unit to form a first lot of processed substrates and communicating processing data regarding the first lot of processed substrates from the semiconductor fabrication equipment unit to a just-in-time (JIT) module of the semiconductor fabrication system. The method further includes determining a processing priority of the first lot of processed substrates and a processing priority of a second lot of unprocessed substrates at the JIT module and scheduling removal of the first lot of processed substrates from the semiconductor fabrication equipment unit and delivery of the second lot of unprocessed substrates to the semiconductor fabrication equipment unit by the JIT module based on the processing data and the priority of one or both of the first lot of processed substrates and the second lot of unprocessed substrates.

公开(公告)号：US20160126120A1

公开(公告)日：2016-05-05

申请号：US14530947

申请日：2014-11-03

Applicant: GLOBALFOUNDRIES, Inc.

Inventor： Chinmay Oza ,  Gero Grau ,  William Fosnight ,  Detlef Pabst

IPC: H01L21/67 ,  G05B19/418 ,  H01L21/677

CPC classification number: G05B19/4189 ,  G05B2219/31002 ,  G05B2219/31013 ,  G05B2219/45031 ,  H01L21/67276 ,  H01L21/67727 ,  H01L21/67733 ,  Y02P80/40 ,  Y02P90/20 ,  Y02P90/28 ,  Y02P90/285

Abstract: Disclosed herein are methods and systems for semiconductor fabrication. In one embodiment, a method for fabricating semiconductors utilizing a semiconductor fabrication system includes performing a semiconductor fabrication process on a first lot of unprocessed semiconductor substrates with a semiconductor fabrication equipment unit to form a first lot of processed substrates and communicating processing data regarding the first lot of processed substrates from the semiconductor fabrication equipment unit to a just-in-time (JIT) module of the semiconductor fabrication system. The method further includes determining a processing priority of the first lot of processed substrates and a processing priority of a second lot of unprocessed substrates at the JIT module and scheduling removal of the first lot of processed substrates from the semiconductor fabrication equipment unit and delivery of the second lot of unprocessed substrates to the semiconductor fabrication equipment unit by the JIT module based on the processing data and the priority of one or both of the first lot of processed substrates and the second lot of unprocessed substrates.

Abstract translation: 这里公开了用于半导体制造的方法和系统。 在一个实施例中，利用半导体制造系统制造半导体的方法包括：利用半导体制造设备单元在第一批未加工的半导体衬底上执行半导体制造工艺，以形成第一批经处理的衬底并与第一批沟通处理数据 从半导体制造设备单元到半导体制造系统的即时（JIT）模块的处理衬底。 该方法还包括确定第一批处理的基板的处理优先级和在JIT模块处的第二批未处理的基板的处理优先级，并且调度从半导体制造设备单元移除第一批经处理的基板，并递送 基于处理数据和第一批处理的基板和第二批未处理的基板中的一个或两个的优先级，由JIT模块将第二批未加工的基板加工到半导体制造设备单元。

公开(公告)号：US09250623B2

公开(公告)日：2016-02-02

申请号：US13833932

申请日：2013-03-15

Applicant: GLOBALFOUNDRIES, Inc.

Inventor： Chinmay Oza ,  William John Fosnight

IPC: G06F19/00 ,  G05B19/418

CPC classification number: G05B19/41865 ,  G05B2219/32325 ,  G05B2219/32328 ,  H01L21/67733 ,  H01L21/67736 ,  H01L21/67769 ,  Y02P80/40 ,  Y02P90/14 ,  Y02P90/20 ,  Y02P90/28

Abstract: Disclosed herein are methods and systems for semiconductor fabrication. In one embodiment, a method of semiconductor fabrication includes performing a process on substrates with an equipment unit to form processed substrates, communicating processing data from the equipment unit to a local scheduler and a universal scheduler, determining a priority of the processed substrates, and scheduling removal of processed substrates from the equipment unit and delivery of unprocessed substrates to the equipment unit by the local scheduler based on the processing data and the priority of the processed substrates.

Abstract translation: 这里公开了用于半导体制造的方法和系统。 在一个实施例中，一种半导体制造方法包括：在具有设备单元的基板上进行处理，以形成处理后的基板，将处理数据从设备单元传送到本地调度器和通用调度器，确定经处理的基板的优先级，以及调度 从设备单元去除已处理的基板，并且基于处理数据和处理的基板的优先级，由本地调度器将未处理的基板输送到设备单元。