Stress memorization techniques for transistor devices
    1.
    发明授权
    Stress memorization techniques for transistor devices 有权
    晶体管器件的应力记忆技术

    公开(公告)号:US09231079B1

    公开(公告)日:2016-01-05

    申请号:US14304017

    申请日:2014-06-13

    Abstract: One illustrative method disclosed herein includes, among other things, performing a source/drain extension ion implantation to form a doped extension implant region in the source/drain regions of the device, performing an ion implantation process on the source/drain regions with a Group VII material (e.g., fluorine), after performing the Group VII material ion implantation process, forming a capping material layer above the source/drain regions, and, with the capping material layer in position, performing an anneal process so as to form stacking faults in the source/drain regions.

    Abstract translation: 本文公开的一种说明性方法包括进行源极/漏极扩展离子注入以在器件的源极/漏极区域中形成掺杂的延伸注入区域,在源极/漏极区域上执行离子注入工艺 VII材料(例如氟),在进行第VII族材料离子注入工艺之后,在源极/漏极区域上方形成覆盖材料层,并且在覆盖材料层就位的情况下,进行退火处理以形成堆垛层错 在源/漏区。

    STRESS MEMORIZATION TECHNIQUES FOR TRANSISTOR DEVICES
    2.
    发明申请
    STRESS MEMORIZATION TECHNIQUES FOR TRANSISTOR DEVICES 有权
    用于晶体管器件的应力记忆技术

    公开(公告)号:US20150364570A1

    公开(公告)日:2015-12-17

    申请号:US14304017

    申请日:2014-06-13

    Abstract: One illustrative method disclosed herein includes, among other things, performing a source/drain extension ion implantation to form a doped extension implant region in the source/drain regions of the device, performing an ion implantation process on the source/drain regions with a Group VII material (e.g., fluorine), after performing the Group VII material ion implantation process, forming a capping material layer above the source/drain regions, and, with the capping material layer in position, performing an anneal process so as to form stacking faults in the source/drain regions.

    Abstract translation: 本文公开的一种说明性方法包括进行源极/漏极扩展离子注入以在器件的源极/漏极区域中形成掺杂的延伸注入区域,在源极/漏极区域上执行离子注入工艺 VII材料(例如氟),在进行第VII族材料离子注入工艺之后,在源极/漏极区域上方形成覆盖材料层,并且在覆盖材料层就位的情况下,进行退火处理以形成堆垛层错 在源/漏区。

Patent Agency Ranking