Abstract:
A multi-device semiconductor structure including a p-type logic device, a p-type memory device, a n-type logic device and a n-type memory device are provided on a bulk silicon substrate. Each of these devices includes a dielectric layer and either a n-type or a p-type work function layer disposed over the dielectric layer. Some of the various device types of the multi-device semiconductor structure are protected, and impurities, such as aluminum and/or nitrogen, are added to the exposed work function layers to achieve one or more other desired work functions with different threshold voltages.