Fabricating preassembled optoelectronic interconnect structures
    1.
    发明授权
    Fabricating preassembled optoelectronic interconnect structures 有权
    制造预组装的光电互连结构

    公开(公告)号:US09490897B2

    公开(公告)日:2016-11-08

    申请号:US14538170

    申请日:2014-11-11

    Abstract: Fabricating preassembled optoelectronic interconnect structures is provided, which have an optical waveguide link with first and second optoelectronic circuits attached to first and second ends of the waveguide link. The optoelectronic circuits include active optical componentry which facilitates optical signal communication across the optical waveguide link. Further, first and second pluralities of electrical contacts are associated with the first and second optoelectronic circuits, respectively, to facilitate electrically, operatively connecting the interconnect structure between first and second components of an electronic assembly as, for instance, a single, field-replaceable unit. The first and second components of the electronic assembly may be, for instance, stacked electronic components of the electronic assembly, or laterally offset components of a substantially planar electronic assembly.

    Abstract translation: 提供了制造预组装的光电互连结构,其具有光波导链路,第一和第二光电子电路连接到波导链路的第一和第二端。 光电子电路包括促进光波导链路上的光信号通信的有源光学组件。 此外,第一和第二多个电触头分别与第一和第二光电子电路相关联,以便于电气,电连接结构在电子组件的第一和第二部件之间的电连接,例如,单个现场可更换 单元。 电子组件的第一和第二部件可以是例如电子组件的堆叠的电子部件或基本上平面的电子组件的横向偏移的部件。

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