公开(公告)号：US11378743B1

公开(公告)日：2022-07-05

申请号：US17146864

申请日：2021-01-12

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Yusheng Bian ,  Roderick A. Augur ,  Kenneth J. Giewont ,  Karen Nummy ,  Edward Kiewra ,  Steven M. Shank

IPC: G02B6/122 ,  G02B6/34 ,  G02B6/136 ,  G02B6/12

Abstract: Structures including a grating coupler and methods of fabricating a structure including a grating coupler. The structure includes structure includes a dielectric layer on a substrate, a first waveguide core positioned in a first level over the dielectric layer, and a second waveguide core positioned in a second level over the dielectric layer. The second level differs in elevation above the dielectric layer from the first level. The first waveguide core includes a tapered section. The structure further includes a grating coupler having a plurality of segments positioned in the second level adjacent to the second waveguide core. The segments of the grating coupler and the tapered section of the first waveguide core are positioned in an overlapping arrangement.

公开(公告)号：US20220357530A1

公开(公告)日：2022-11-10

申请号：US17313472

申请日：2021-05-06

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Brett Cucci ,  Yusheng Bian ,  Abdelsalam Aboketaf ,  Edward Kiewra ,  Robert K. Leidy

IPC: G02B6/42

Abstract: Structures for an edge coupler of a photonics chip and methods of forming an edge coupler for a photonics chip. The structure includes a waveguide core on a dielectric layer, as well as an interconnect structure including a interlayer dielectric layer positioned over the dielectric layer and an opening penetrating through the interlayer dielectric layer to the waveguide core. A region of the interlayer dielectric layer is positioned to overlap with a portion of the waveguide core. The region of the interlayer dielectric layer has a surface that is rounded with a curvature.

公开(公告)号：US11774686B2

公开(公告)日：2023-10-03

申请号：US17313472

申请日：2021-05-06

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Brett Cucci ,  Yusheng Bian ,  Abdelsalam Aboketaf ,  Edward Kiewra ,  Robert K. Leidy

IPC: G02B6/42

CPC classification number: G02B6/4206

Abstract: Structures for an edge coupler of a photonics chip and methods of forming an edge coupler for a photonics chip. The structure includes a waveguide core on a dielectric layer, as well as an interconnect structure including a interlayer dielectric layer positioned over the dielectric layer and an opening penetrating through the interlayer dielectric layer to the waveguide core. A region of the interlayer dielectric layer is positioned to overlap with a portion of the waveguide core. The region of the interlayer dielectric layer has a surface that is rounded with a curvature.

公开(公告)号：US11520113B1

公开(公告)日：2022-12-06

申请号：US17356898

申请日：2021-06-24

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Abdelsalam Aboketaf ,  Yusheng Bian ,  Edward Kiewra ,  Brett Cucci

IPC: G02B6/42 ,  H01L31/0232 ,  H01L31/0203 ,  G02B6/136

Abstract: Structures for a photodetector or terminator and methods of fabricating a structure for a photodetector or terminator. The structure includes a waveguide core, a light-absorbing layer having a sidewall, and a taper positioned adjacent to the sidewall of the light-absorbing layer. The taper extends laterally from the sidewall of the light-absorbing layer to overlap with the waveguide core, and the taper has a thickness that varies with position relative to the sidewall of the light-absorbing layer. For example, the thickness of the taper may decrease with increasing distance from the sidewall of the light-absorbing layer.

公开(公告)号：US20220221650A1

公开(公告)日：2022-07-14

申请号：US17146864

申请日：2021-01-12

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Yusheng Bian ,  Roderick A. Augur ,  Kenneth J. Giewont ,  Karen Nummy ,  Edward Kiewra ,  Steven M. Shank

IPC: G02B6/122 ,  G02B6/136 ,  G02B6/34

Abstract: Structures including a grating coupler and methods of fabricating a structure including a grating coupler. The structure includes structure includes a dielectric layer on a substrate, a first waveguide core positioned in a first level over the dielectric layer, and a second waveguide core positioned in a second level over the dielectric layer. The second level differs in elevation above the dielectric layer from the first level. The first waveguide core includes a tapered section. The structure further includes a grating coupler having a plurality of segments positioned in the second level adjacent to the second waveguide core. The segments of the grating coupler and the tapered section of the first waveguide core are positioned in an overlapping arrangement.