公开(公告)号：US11860414B2

公开(公告)日：2024-01-02

申请号：US17137549

申请日：2020-12-30

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Tymon Barwicz ,  Robert K. Leidy ,  Thomas Houghton

IPC: G02B6/26 ,  G02B6/42 ,  G02B6/10 ,  G02B6/122 ,  G02B6/13

CPC classification number: G02B6/1228 ,  G02B6/13

Abstract: Structures including an edge coupler and methods of fabricating a structure including an edge coupler. The structure includes a waveguide core region on a first dielectric layer, and a second dielectric layer on the waveguide core region and the first dielectric layer. The waveguide core region has a tapered section with an end surface that terminates adjacent to an edge of the first dielectric layer. The second dielectric layer includes a first trench and a second trench that are each positioned adjacent to the tapered section of the waveguide core region.

公开(公告)号：US11774686B2

公开(公告)日：2023-10-03

申请号：US17313472

申请日：2021-05-06

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Brett Cucci ,  Yusheng Bian ,  Abdelsalam Aboketaf ,  Edward Kiewra ,  Robert K. Leidy

IPC: G02B6/42

CPC classification number: G02B6/4206

Abstract: Structures for an edge coupler of a photonics chip and methods of forming an edge coupler for a photonics chip. The structure includes a waveguide core on a dielectric layer, as well as an interconnect structure including a interlayer dielectric layer positioned over the dielectric layer and an opening penetrating through the interlayer dielectric layer to the waveguide core. A region of the interlayer dielectric layer is positioned to overlap with a portion of the waveguide core. The region of the interlayer dielectric layer has a surface that is rounded with a curvature.

公开(公告)号：US20220206220A1

公开(公告)日：2022-06-30

申请号：US17137549

申请日：2020-12-30

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Tymon Barwicz ,  Robert K. Leidy ,  Thomas Houghton

IPC: G02B6/122 ,  G02B6/13

Abstract: Structures including an edge coupler and methods of fabricating a structure including an edge coupler. The structure includes a waveguide core region on a first dielectric layer, and a second dielectric layer on the waveguide core region and the first dielectric layer. The waveguide core region has a tapered section with an end surface that terminates adjacent to an edge of the first dielectric layer. The second dielectric layer includes a first trench and a second trench that are each positioned adjacent to the tapered section of the waveguide core region.

公开(公告)号：US20220357530A1

公开(公告)日：2022-11-10

申请号：US17313472

申请日：2021-05-06

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Brett Cucci ,  Yusheng Bian ,  Abdelsalam Aboketaf ,  Edward Kiewra ,  Robert K. Leidy

IPC: G02B6/42

Abstract: Structures for an edge coupler of a photonics chip and methods of forming an edge coupler for a photonics chip. The structure includes a waveguide core on a dielectric layer, as well as an interconnect structure including a interlayer dielectric layer positioned over the dielectric layer and an opening penetrating through the interlayer dielectric layer to the waveguide core. A region of the interlayer dielectric layer is positioned to overlap with a portion of the waveguide core. The region of the interlayer dielectric layer has a surface that is rounded with a curvature.