Thermal management of an optical component for temperature control

    公开(公告)号:US11828984B2

    公开(公告)日:2023-11-28

    申请号:US17679431

    申请日:2022-02-24

    CPC classification number: G02B6/1228 G02B2006/12135

    Abstract: Structures including an optical component and methods of fabricating a structure including an optical component. The structure includes a substrate, an optical component including a waveguide core, and a back-end-of-line stack including a heat spreader layer. The optical component is positioned in a vertical direction between the substrate and the back-end-of-line stack. The waveguide core contains a first material having a first thermal conductivity, and the heat spreader layer contains a second material having a second thermal conductivity that is greater than the first thermal conductivity of the first material.

    Hybrid edge couplers with stacked inverse tapers

    公开(公告)号:US11536903B1

    公开(公告)日:2022-12-27

    申请号:US17406773

    申请日:2021-08-19

    Abstract: Structures for an edge coupler and methods of fabricating a structure for an edge coupler. A first waveguide core has a first section that has a tapered shape and a second section that is adjoined to the first section. Multiple segments are positioned with a spaced arrangement adjacent to an end surface of the second section of the first waveguide core. A slab layer is adjoined to the first section of the first waveguide core. A second waveguide core has a section that overlaps with the first section of the first waveguide core to define a layer stack. The section of the second waveguide core has a tapered shape, and the first and second waveguide cores are comprised of different materials. The first section of the first waveguide core has a first thickness, and the slab layer has a second thickness that is less than the first thickness.

    PHOTONIC STRUCTURES INCLUDING MULTIPLE INPUT/OUTPUT OPTICAL COUPLERS

    公开(公告)号:US20250085491A1

    公开(公告)日:2025-03-13

    申请号:US18243701

    申请日:2023-09-08

    Abstract: Photonic structures including multiple input/output optical couplers and methods of forming such photonic structures. The photonic structure comprises a light source and a photonics chip including a semiconductor substrate. The photonic structure further comprises a first mirror disposed at a first height relative to a top surface of the semiconductor substrate and a second mirror disposed at a second height relative to the top surface of the semiconductor substrate. The first mirror is configured to reflect first light from the light source to the photonics chip, and the second mirror is configured to reflect second light from the light source to the photonics chip. The first mirror is disposed between the second mirror and the light source, and the second height is different from the first height.

    THERMAL MANAGEMENT OF AN OPTICAL COMPONENT FOR TEMPERATURE CONTROL

    公开(公告)号:US20230266533A1

    公开(公告)日:2023-08-24

    申请号:US17679431

    申请日:2022-02-24

    CPC classification number: G02B6/1228 G02B2006/12135

    Abstract: Structures including an optical component and methods of fabricating a structure including an optical component. The structure includes a substrate, an optical component including a waveguide core, and a back-end-of-line stack including a heat spreader layer. The optical component is positioned in a vertical direction between the substrate and the back-end-of-line stack. The waveguide core contains a first material having a first thermal conductivity, and the heat spreader layer contains a second material having a second thermal conductivity that is greater than the first thermal conductivity of the first material.

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