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公开(公告)号:US11934021B2
公开(公告)日:2024-03-19
申请号:US17649191
申请日:2022-01-27
Applicant: GlobalFoundries U.S. Inc.
Inventor: Hemant Martand Dixit , William J. Taylor, Jr. , Yusheng Bian , Theodore Letavic , Oscar D. Restrepo
CPC classification number: G02B6/4269 , G02B6/122 , G02B6/125 , G02B2006/12135 , G02B2006/12142
Abstract: The disclosed subject matter relates to semiconductor devices for use in optoelectronic/photonic applications and integrated circuit (IC) chips. More particularly, the present disclosure relates to photonic devices having thermally conductive layers for the removal of heat from optoelectronic components in the photonic devices.
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公开(公告)号:US11846804B2
公开(公告)日:2023-12-19
申请号:US17679470
申请日:2022-02-24
Applicant: GlobalFoundries U.S. Inc.
Inventor: Yusheng Bian , Hemant Dixit , Theodore Letavic
CPC classification number: G02B6/122 , G02B6/13 , G02B2006/12061 , G02B2006/12135
Abstract: Structures including an optical component and methods of fabricating a structure including an optical component. The structure includes an optical component having a waveguide core, and multiple features positioned adjacent to the waveguide core. The waveguide core contains a first material having a first thermal conductivity, and the features contain a second material having a second thermal conductivity that is greater than the first thermal conductivity.
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公开(公告)号:US11828984B2
公开(公告)日:2023-11-28
申请号:US17679431
申请日:2022-02-24
Applicant: GlobalFoundries U.S. Inc.
Inventor: Theodore Letavic , Yusheng Bian , Hemant Dixit
CPC classification number: G02B6/1228 , G02B2006/12135
Abstract: Structures including an optical component and methods of fabricating a structure including an optical component. The structure includes a substrate, an optical component including a waveguide core, and a back-end-of-line stack including a heat spreader layer. The optical component is positioned in a vertical direction between the substrate and the back-end-of-line stack. The waveguide core contains a first material having a first thermal conductivity, and the heat spreader layer contains a second material having a second thermal conductivity that is greater than the first thermal conductivity of the first material.
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公开(公告)号:US20230266530A1
公开(公告)日:2023-08-24
申请号:US17679470
申请日:2022-02-24
Applicant: GlobalFoundries U.S. Inc.
Inventor: Yusheng Bian , Hemant Dixit , Theodore Letavic
CPC classification number: G02B6/122 , G02B6/13 , G02B2006/12135
Abstract: Structures including an optical component and methods of fabricating a structure including an optical component. The structure includes an optical component having a waveguide core, and multiple features positioned adjacent to the waveguide core. The waveguide core contains a first material having a first thermal conductivity, and the features contain a second material having a second thermal conductivity that is greater than the first thermal conductivity.
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公开(公告)号:US11536903B1
公开(公告)日:2022-12-27
申请号:US17406773
申请日:2021-08-19
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Theodore Letavic , Yusheng Bian , Kenneth J. Giewont , Karen Nummy
Abstract: Structures for an edge coupler and methods of fabricating a structure for an edge coupler. A first waveguide core has a first section that has a tapered shape and a second section that is adjoined to the first section. Multiple segments are positioned with a spaced arrangement adjacent to an end surface of the second section of the first waveguide core. A slab layer is adjoined to the first section of the first waveguide core. A second waveguide core has a section that overlaps with the first section of the first waveguide core to define a layer stack. The section of the second waveguide core has a tapered shape, and the first and second waveguide cores are comprised of different materials. The first section of the first waveguide core has a first thickness, and the slab layer has a second thickness that is less than the first thickness.
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公开(公告)号:US20250085491A1
公开(公告)日:2025-03-13
申请号:US18243701
申请日:2023-09-08
Applicant: GlobalFoundries U.S. Inc.
Inventor: Yusheng Bian , Theodore Letavic , Kenneth J. Giewont , Kevin Dezfulian , Koushik Ramachandran
Abstract: Photonic structures including multiple input/output optical couplers and methods of forming such photonic structures. The photonic structure comprises a light source and a photonics chip including a semiconductor substrate. The photonic structure further comprises a first mirror disposed at a first height relative to a top surface of the semiconductor substrate and a second mirror disposed at a second height relative to the top surface of the semiconductor substrate. The first mirror is configured to reflect first light from the light source to the photonics chip, and the second mirror is configured to reflect second light from the light source to the photonics chip. The first mirror is disposed between the second mirror and the light source, and the second height is different from the first height.
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公开(公告)号:US12174420B2
公开(公告)日:2024-12-24
申请号:US18384921
申请日:2023-10-30
Applicant: GlobalFoundries U.S. Inc.
Inventor: Yusheng Bian , Hemant Dixit , Theodore Letavic
Abstract: Structures including an optical component and methods of fabricating a structure including an optical component. The structure includes an optical component having a waveguide core, and multiple features positioned adjacent to the waveguide core. The waveguide core contains a first material having a first thermal conductivity, and the features contain a second material having a second thermal conductivity that is greater than the first thermal conductivity.
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公开(公告)号:US20240061173A1
公开(公告)日:2024-02-22
申请号:US18384921
申请日:2023-10-30
Applicant: GlobalFoundries U.S. Inc.
Inventor: Yusheng Bian , Hemant Dixit , Theodore Letavic
CPC classification number: G02B6/122 , G02B6/13 , G02B2006/12061
Abstract: Structures including an optical component and methods of fabricating a structure including an optical component. The structure includes an optical component having a waveguide core, and multiple features positioned adjacent to the waveguide core. The waveguide core contains a first material having a first thermal conductivity, and the features contain a second material having a second thermal conductivity that is greater than the first thermal conductivity.
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公开(公告)号:US11822120B2
公开(公告)日:2023-11-21
申请号:US17679405
申请日:2022-02-24
Applicant: GlobalFoundries U.S. Inc.
Inventor: Hemant Dixit , Yusheng Bian , Theodore Letavic
CPC classification number: G02B6/122 , G02B6/0026 , G02B6/43
Abstract: Structures including an optical component and methods of fabricating a structure including an optical component. The structure includes a waveguide core and a back-end-of-line stack including a first metallization level, a second metallization level, and a heat sink having a metal feature in the second metallization level. The heat sink is positioned adjacent to a section of the waveguide core. The first metallization level including a dielectric layer positioned between the metal feature and the section of the waveguide core.
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公开(公告)号:US20230266533A1
公开(公告)日:2023-08-24
申请号:US17679431
申请日:2022-02-24
Applicant: GlobalFoundries U.S. Inc.
Inventor: Theodore Letavic , Yusheng Bian , Hemant Dixit
IPC: G02B6/122
CPC classification number: G02B6/1228 , G02B2006/12135
Abstract: Structures including an optical component and methods of fabricating a structure including an optical component. The structure includes a substrate, an optical component including a waveguide core, and a back-end-of-line stack including a heat spreader layer. The optical component is positioned in a vertical direction between the substrate and the back-end-of-line stack. The waveguide core contains a first material having a first thermal conductivity, and the heat spreader layer contains a second material having a second thermal conductivity that is greater than the first thermal conductivity of the first material.
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