-
公开(公告)号:US06958446B2
公开(公告)日:2005-10-25
申请号:US10124166
申请日:2002-04-17
申请人: Giles Humpston , Yoshikatsu Ichimura , Nancy M. Mar , Daniel J. Miller , Michael J. Nystrom , Heidi L. Reynolds , Gary R. Trott
发明人: Giles Humpston , Yoshikatsu Ichimura , Nancy M. Mar , Daniel J. Miller , Michael J. Nystrom , Heidi L. Reynolds , Gary R. Trott
IPC分类号: G02B26/08 , B23K1/00 , B23K35/26 , G02B6/12 , G02B6/35 , G02B6/36 , G02B6/42 , H01J5/00 , H05K5/06
CPC分类号: G02B6/12 , B23K1/0016 , B23K35/26 , B23K2101/40 , B23K2103/18 , B23K2103/52 , B23K2103/54 , B23K2103/56 , G02B6/3512 , G02B6/3582 , G02B6/36 , G02B6/4248 , G02B2006/12104
摘要: A solder joint or seal attaching components having dissimilar coefficients of thermal expansion is made thin (e.g., less than 20 μm and preferably about 5 μm) and of a solder such as an indium-based solder that has a tendency to creep. The solder is toroidal or otherwise shaped to avoid tensile stress in the solder. Axial shearing stress in the solder causes reversible creep without causing failure of the joint or seal. In one embodiment, a toroidal solder seal has a diameter, a footprint, and a thickness in approximate proportions of 5000:200:1.
摘要翻译: 具有不同的热膨胀系数的焊接接头或密封件附接部件被制成薄(例如,小于20μm,优选约5μm)以及具有蠕变趋势的诸如铟基焊料的焊料。 焊料是环形或其他形状,以避免焊料中的拉伸应力。 焊料中的轴向剪切应力引起可逆蠕变,而不会导致接头或密封件的故障。 在一个实施例中,环形焊接密封件的直径,占地面积和厚度约为5000:200:1。