公开(公告)号：US20240369760A1

公开(公告)日：2024-11-07

申请号：US18141753

申请日：2023-05-01

Applicant: GlobalFoundries U.S. Inc.

Inventor： Arpan Dasgupta ,  Zahidur Chowdhury ,  Takako Hirokawa ,  Vaishnavi Karra ,  Norman Robson

IPC: G02B6/12 ,  G02B6/136 ,  H04N5/33

Abstract: Structures including a light source and an edge coupler, and methods of forming and using such structures. The structure comprises a semiconductor substrate and a back-end-of-line stack on the semiconductor substrate. The back-end-of-line stack includes a first dielectric layer, a first plurality of metal features in the first dielectric layer, a second dielectric layer on the first dielectric layer, and a second plurality of metal features in the second dielectric layer. The second plurality of metal features have a non-overlapping relationship with the first plurality of metal features. The structure further comprises an edge coupler adjacent to the first plurality of metal features and the second plurality of metal features.

公开(公告)号：US20240329308A1

公开(公告)日：2024-10-03

申请号：US18127220

申请日：2023-03-28

Applicant: GlobalFoundries U.S. Inc.

Inventor： Arpan Dasgupta ,  Yusheng Bian ,  John M. Safran ,  Norman Robson

IPC: G02B6/122 ,  G02B6/13

CPC classification number: G02B6/1228 ,  G02B6/13

Abstract: Structures including multiple photonics chips and methods of fabricating a structure including multiple photonics chips. The structure comprises a first chip including a first edge and a first plurality of optical couplers disposed at the first edge, and a second chip including a second edge adjacent to the first edge of the first chip and a second plurality of optical couplers. The second plurality of optical couplers are disposed at the second edge adjacent to the first plurality of optical couplers.

公开(公告)号：US20250076575A1

公开(公告)日：2025-03-06

申请号：US18241289

申请日：2023-09-01

Applicant: GlobalFoundries U.S. Inc.

Inventor： Jae Kyu Cho ,  Norman Robson

IPC: G02B6/122 ,  G02B6/13 ,  H01L21/56 ,  H01L23/00 ,  H01L25/16

Abstract: Structures for a co-packaged photonics chip and electronic chip, and associated methods. The structure comprises a layer comprising a molding compound, an electronic chip and a photonics chip affixed in the layer, and a waveguiding structure including a waveguide core adjacent to the photonics chip. The photonics chip includes an optical coupler, the waveguide core includes a portion that overlaps with the optical coupler, and the waveguide core comprises a polymer.