公开(公告)号：US20240329308A1

公开(公告)日：2024-10-03

申请号：US18127220

申请日：2023-03-28

Applicant: GlobalFoundries U.S. Inc.

Inventor： Arpan Dasgupta ,  Yusheng Bian ,  John M. Safran ,  Norman Robson

IPC: G02B6/122 ,  G02B6/13

CPC classification number: G02B6/1228 ,  G02B6/13

Abstract: Structures including multiple photonics chips and methods of fabricating a structure including multiple photonics chips. The structure comprises a first chip including a first edge and a first plurality of optical couplers disposed at the first edge, and a second chip including a second edge adjacent to the first edge of the first chip and a second plurality of optical couplers. The second plurality of optical couplers are disposed at the second edge adjacent to the first plurality of optical couplers.