公开(公告)号：US20250102746A1

公开(公告)日：2025-03-27

申请号：US18372989

申请日：2023-09-26

Applicant: Google LLC

Inventor： Horia Alexandru Toma ,  Zuowei Shen ,  Ilyas Mohammed ,  Yingying Wang ,  William F. Edwards, Jr.

IPC: G02B6/42 ,  H10B80/00

Abstract: The technology generally relates to high bandwidth memory (HBM) packages and processor packages that have optical connectivity. Disclosed systems and methods herein allow for HBM dies that are interconnected with an optical interface in a manner that allows for compact, high-performance computing. An HBM package can be cooled using a cooling unit that is distinct from the processor package. In addition, the cooling unit can be configured so as to provide thermal contact with a subset of high-power components within the HBM package.

公开(公告)号：US20250140766A1

公开(公告)日：2025-05-01

申请号：US18928505

申请日：2024-10-28

Applicant: Google LLC

Inventor： Ilyas Mohammed

IPC: H01L25/16 ,  G02B6/43

Abstract: A chip package assembly is disclosed that includes an integrated circuit chip and an optical interconnect system. The optical interconnect system has a first optical transmitter having a plurality of first microLEDs and a first optical receiver having a plurality of light sensors. The first optical transmitter and first optical receiver communicate with a respective second external optical receiver and second external optical transmitter of one or more external chip package assemblies. The external optical transmitter transmits an unmodulated optical light signal to the light sensor indicating whether first microLEDs of the external optical transmitter are in the first “on” state or the first “off” state. The light sensors convert the received and second corresponding unmodulated optical light signal to an electrical signal.

公开(公告)号：US20250046516A1

公开(公告)日：2025-02-06

申请号：US18229959

申请日：2023-08-03

Applicant: Google LLC

Inventor： Scott Lee Kirkman ,  Nam Hoon Kim ,  Ilyas Mohammed

IPC: H01G2/06 ,  H01L25/16

Abstract: A microelectronic package assembly is disclosed that implements a capacitor carrier capable of providing package warpage control and that eliminates the need to only bond chip capacitors directly to a surface of the package substrate. The capacitor carrier may be composed of a material that has a high coefficient of thermal expansion and a high Young's modulus. A capacitor carrier with these characteristics can eliminate the need for a traditional stiffener in the chip package.

公开(公告)号：US20250087566A1

公开(公告)日：2025-03-13

申请号：US18806023

申请日：2024-08-15

Applicant: Google LLC

Inventor： Ilyas Mohammed

IPC: H01L23/498 ,  H01L21/304 ,  H01L21/306 ,  H01L23/00 ,  H01L23/15 ,  H01L23/528 ,  H01L23/64 ,  H01L25/16

Abstract: A package substrate for a microelectronic package assembly includes an inorganic core body, such as a ceramic core body, with embedded capacitors and at least one conductive through via extending through the core body. The structure of the inorganic core body allows for at least one redistribution layer to be built-up directly onto the inorganic core body, without the use of an intermediate carrier or interposer.

公开(公告)号：US20250028661A1

公开(公告)日：2025-01-23

申请号：US18223332

申请日：2023-07-18

Applicant: Google LLC

Inventor： Horia Alexandru Toma ,  Zuowei Shen ,  William F. Edwards, JR. ,  Gurushankar Rajamani ,  Hong Liu ,  Ilyas Mohammed

IPC: G06F13/16

Abstract: The disclosure provides for high bandwidth processing through the sharing of memory dies over a plurality of computing dies via an optical interchange. The optical interchange may be configured so as to operate as both an optical switch and optical demultiplexer. The optical switch configuration for the optical interchange allows for data to be written from any computing die to one of a plurality of memory dies via an optical connection. The optical demultiplexer configuration allows for data to be broadcast from a memory die to a plurality of the computing dies.