公开(公告)号：US20230335928A1

公开(公告)日：2023-10-19

申请号：US17722860

申请日：2022-04-18

Applicant: Google LLC

Inventor： William F. Edwards, JR. ,  Xu Zuo ,  Ryohei Urata ,  Melanie Beauchemin ,  Woon-Seong Kwon ,  Shinnosuke Yamamoto ,  Houle Gan ,  Yujeong Shim

IPC: H01R12/70 ,  H01R13/66 ,  H01R13/533

CPC classification number: H01R12/7064 ,  H01R13/533 ,  H01R13/6683

Abstract: An assembly includes a printed circuit board (“PCB”). An aperture extends through the PCB. The assembly also includes an array of pins and a processor package. The array of pins extends around a perimeter of the aperture, and the processor package extends over the aperture. The processor package is pressed against the array of pins by a compressive force couple.

公开(公告)号：US20230244046A1

公开(公告)日：2023-08-03

申请号：US18131640

申请日：2023-04-06

Applicant: Google LLC

Inventor： William F. Edwards, JR. ,  Melanie Beauchemin ,  Timothy Conrad Lee ,  Federico Pio Centola ,  Madhusudan K. Iyengar ,  Michael Chi Kin Lau ,  Zuowei Shen ,  Justin Sishung Lee

IPC: G02B6/42

CPC classification number: G02B6/4269 ,  G02B6/428 ,  G02B6/4284

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

公开(公告)号：US20220269019A1

公开(公告)日：2022-08-25

申请号：US17668062

申请日：2022-02-09

Applicant: Google LLC

Inventor： William F. Edwards, JR. ,  Melanie Beauchemin ,  Timothy Conrad Lee ,  Federico Pio Centola ,  Madhusudan K. Iyengar ,  Michael Chi Kin Lau ,  Zuowei Shen ,  Justin Sishung Lee

IPC: G02B6/42

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

公开(公告)号：US20250028661A1

公开(公告)日：2025-01-23

申请号：US18223332

申请日：2023-07-18

Applicant: Google LLC

Inventor： Horia Alexandru Toma ,  Zuowei Shen ,  William F. Edwards, JR. ,  Gurushankar Rajamani ,  Hong Liu ,  Ilyas Mohammed

IPC: G06F13/16

Abstract: The disclosure provides for high bandwidth processing through the sharing of memory dies over a plurality of computing dies via an optical interchange. The optical interchange may be configured so as to operate as both an optical switch and optical demultiplexer. The optical switch configuration for the optical interchange allows for data to be written from any computing die to one of a plurality of memory dies via an optical connection. The optical demultiplexer configuration allows for data to be broadcast from a memory die to a plurality of the computing dies.

公开(公告)号：US20240290763A1

公开(公告)日：2024-08-29

申请号：US18659676

申请日：2024-05-09

Applicant: Google LLC

Inventor： Houle Gan ,  Richard Stuart Roy ,  Yujeong Shim ,  William F. Edwards, JR. ,  Chenhao Nan

IPC: H01L25/16 ,  H01L23/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01L25/162 ,  H05K1/11 ,  H05K1/183 ,  H01L24/16 ,  H01L2224/16225 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10704 ,  H05K2201/10719

Abstract: A pluggable processor module includes a microprocessor package, a voltage regulator including a capacitor board, and contact pads that each include a first side in contact with the microprocessor package and a second side in contact with the capacitor board.

公开(公告)号：US20230335541A1

公开(公告)日：2023-10-19

申请号：US17719857

申请日：2022-04-13

Applicant: Google LLC

Inventor： Houle Gan ,  Richard Stuart Roy ,  Yujeong Shim ,  William F. Edwards, JR. ,  Chenhao Nan

IPC: H01L25/16 ,  H05K1/18 ,  H05K1/11

CPC classification number: H01L25/162 ,  H05K1/183 ,  H05K1/11 ,  H05K2201/10719 ,  H05K2201/10704 ,  H01L24/16

Abstract: A pluggable processor module includes a microprocessor package, a voltage regulator including a capacitor board, and contact pads that each include a first side in contact with the microprocessor package and a second side in contact with the capacitor board.