公开(公告)号：US20210359448A1

公开(公告)日：2021-11-18

申请号：US16874194

申请日：2020-05-14

Applicant: Google LLC

Inventor： Sue Yun Teng ,  Shinnosuke Yamamoto

IPC: H01R12/85

Abstract: The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

公开(公告)号：US11756851B2

公开(公告)日：2023-09-12

申请号：US17525275

申请日：2021-11-12

Applicant: Google LLC

Inventor： Sue Yun Teng ,  Shinnosuke Yamamoto

IPC: H01L23/32 ,  H02B1/015 ,  H05K7/10

CPC classification number: H01L23/32 ,  H02B1/015 ,  H05K7/1007

Abstract: The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

公开(公告)号：US20220077020A1

公开(公告)日：2022-03-10

申请号：US17525275

申请日：2021-11-12

Applicant: Google LLC

Inventor： Sue Yun Teng ,  Shinnosuke Yamamoto

IPC: H01L23/32 ,  H02B1/015

Abstract: The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

公开(公告)号：US20230335928A1

公开(公告)日：2023-10-19

申请号：US17722860

申请日：2022-04-18

Applicant: Google LLC

Inventor： William F. Edwards, JR. ,  Xu Zuo ,  Ryohei Urata ,  Melanie Beauchemin ,  Woon-Seong Kwon ,  Shinnosuke Yamamoto ,  Houle Gan ,  Yujeong Shim

IPC: H01R12/70 ,  H01R13/66 ,  H01R13/533

CPC classification number: H01R12/7064 ,  H01R13/533 ,  H01R13/6683

Abstract: An assembly includes a printed circuit board (“PCB”). An aperture extends through the PCB. The assembly also includes an array of pins and a processor package. The array of pins extends around a perimeter of the aperture, and the processor package extends over the aperture. The processor package is pressed against the array of pins by a compressive force couple.

公开(公告)号：US11791231B2

公开(公告)日：2023-10-17

申请号：US17525275

申请日：2021-11-12

Applicant: Google LLC

Inventor： Sue Yun Teng ,  Shinnosuke Yamamoto

IPC: H01L23/32 ,  H02B1/015 ,  H05K7/10

CPC classification number: H01L23/32 ,  H02B1/015 ,  H05K7/1007

Abstract: The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

公开(公告)号：US11183438B1

公开(公告)日：2021-11-23

申请号：US16874194

申请日：2020-05-14

Applicant: Google LLC

Inventor： Sue Yun Teng ,  Shinnosuke Yamamoto

IPC: H01L23/32 ,  H02B1/015

Abstract: The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.