公开(公告)号：US20230244046A1

公开(公告)日：2023-08-03

申请号：US18131640

申请日：2023-04-06

申请人： Google LLC

发明人： William F. Edwards, JR. ,  Melanie Beauchemin ,  Timothy Conrad Lee ,  Federico Pio Centola ,  Madhusudan K. Iyengar ,  Michael Chi Kin Lau ,  Zuowei Shen ,  Justin Sishung Lee

IPC分类号： G02B6/42

CPC分类号： G02B6/4269 ,  G02B6/428 ,  G02B6/4284

摘要： Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

公开(公告)号：US20210378106A1

公开(公告)日：2021-12-02

申请号：US17333570

申请日：2021-05-28

申请人： Google LLC

发明人： Madhusudan K. Iyengar ,  Christopher Malone ,  Woon-Seong Kwon ,  Emad Samadiani ,  Melanie Beauchemin ,  Padam Jain ,  Teckgyu Kang ,  Yuan Li ,  Connor Burgess ,  Norman Paul Jouppi ,  Nicholas Stevens-Yu ,  Yingying Wang

IPC分类号： H05K3/34 ,  H05K7/20 ,  H01L23/00

摘要： A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material (“TIM”) having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.

公开(公告)号：US20240347414A1

公开(公告)日：2024-10-17

申请号：US18634198

申请日：2024-04-12

申请人： Google LLC

发明人： Madhusudan K. Iyengar ,  Christopher Malone ,  Woon-Seong Kwon ,  Emad Samadiani ,  Melanie Beauchemin ,  Padam Jain ,  Teckgyu Kang ,  Yuan Li ,  Connor Burgess ,  Norman Paul Jouppi ,  Nicholas Stevens-Yu ,  Yingying Wang

IPC分类号： H01L23/373 ,  H01L23/00 ,  H01L25/065 ,  H05K3/34 ,  H05K7/20

CPC分类号： H01L23/3732 ,  H01L23/562 ,  H01L24/32 ,  H01L24/83 ,  H05K3/3436 ,  H05K7/20254 ,  H01L25/0655 ,  H01L2223/58 ,  H01L2224/32 ,  H01L2224/32245 ,  H01L2924/15311 ,  H05K2201/10378 ,  H05K2203/041

摘要： A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material (“TIM”) having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.

公开(公告)号：US20230335928A1

公开(公告)日：2023-10-19

申请号：US17722860

申请日：2022-04-18

申请人： Google LLC

发明人： William F. Edwards, JR. ,  Xu Zuo ,  Ryohei Urata ,  Melanie Beauchemin ,  Woon-Seong Kwon ,  Shinnosuke Yamamoto ,  Houle Gan ,  Yujeong Shim

IPC分类号： H01R12/70 ,  H01R13/66 ,  H01R13/533

CPC分类号： H01R12/7064 ,  H01R13/533 ,  H01R13/6683

摘要： An assembly includes a printed circuit board (“PCB”). An aperture extends through the PCB. The assembly also includes an array of pins and a processor package. The array of pins extends around a perimeter of the aperture, and the processor package extends over the aperture. The processor package is pressed against the array of pins by a compressive force couple.

公开(公告)号：US11650384B2

公开(公告)日：2023-05-16

申请号：US17668062

申请日：2022-02-09

申请人： Google LLC

发明人： William F. Edwards, Jr. ,  Melanie Beauchemin ,  Timothy Conrad Lee ,  Federico Pio Centola ,  Madhusudan K. Iyengar ,  Michael Chi Kin Lau ,  Zuowei Shen ,  Justin Sishung Lee

IPC分类号： H04B10/00 ,  G02B6/42

CPC分类号： G02B6/4269 ,  G02B6/428 ,  G02B6/4284

摘要： Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

公开(公告)号：US11249264B2

公开(公告)日：2022-02-15

申请号：US17122658

申请日：2020-12-15

申请人： Google LLC

发明人： William F. Edwards, Jr. ,  Melanie Beauchemin ,  Timothy Conrad Lee ,  Federico Pio Centola ,  Madhusudan K. Iyengar ,  Michael Chi Kin Lau ,  Zuowei Shen ,  Justin Sishung Lee

IPC分类号： H04B10/00 ,  G02B6/42

摘要： Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

公开(公告)号：US10905038B1

公开(公告)日：2021-01-26

申请号：US16688384

申请日：2019-11-19

申请人： Google LLC

发明人： Federico Pio Centola ,  Zuowei Shen ,  Xu Gao ,  Shawn Emory Bender ,  Melanie Beauchemin ,  Mark Villegas ,  Gregory Sizikov ,  Chee Yee Chung

IPC分类号： H05K9/00

摘要： An electromagnetic interference (“EMI”) sheet attenuator includes a planar conductive layer, a first flexible substrate and a second flexible substrate. The first flexible substrate overlies the metal backing layer and including a conductive pattern on a surface of the first flexible substrate. The second flexible substrate overlies the first flexible substrate and also includes the conductive pattern. The conductive pattern on the second flexible substrate is aligned with the conductive pattern on the first flexible substrate.

公开(公告)号：US20200035583A1

公开(公告)日：2020-01-30

申请号：US16596100

申请日：2019-10-08

申请人： Google LLC

发明人： Melanie Beauchemin ,  Madhusudan Iyengar ,  Christopher Malone ,  Gregory Imwalle

IPC分类号： H01L23/38 ,  H01L25/18 ,  H01L23/053 ,  H01L23/433 ,  H01L25/00 ,  H01L21/52 ,  H01L21/48 ,  F25B21/02

摘要： While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.

公开(公告)号：US20190074237A1

公开(公告)日：2019-03-07

申请号：US15696962

申请日：2017-09-06

申请人： Google LLC

发明人： Melanie Beauchemin ,  Madhusudan Iyengar ,  Christopher Malone ,  Gregory Imwalle

IPC分类号： H01L23/38 ,  H01L25/18 ,  H01L23/053 ,  H01L23/433 ,  H01L25/00 ,  H01L21/52 ,  H01L21/48 ,  F25B21/02

摘要： While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.

公开(公告)号：US11895807B2

公开(公告)日：2024-02-06

申请号：US16885500

申请日：2020-05-28

申请人： Google LLC

发明人： Madhusudan K. Iyengar ,  Melanie Beauchemin ,  Christopher Malone

IPC分类号： G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20 ,  H01M10/613

CPC分类号： H05K7/208 ,  H01M10/613 ,  H05K7/20936

摘要： A data rack system includes a data center rack frame, a shelf positioned within the data center rack frame; and a modular battery unit disposed on the shelf. The modular battery unit further includes a housing having an outer surface, a plurality of strips of phase change material (“PCM”) attached to the outer surface and spaced apart from one another; and air flow channels. The air flow channels are formed in spaces between two adjacent strips of the plurality of strips and defined by a shape and size of the spaces between the two adjacent strips.