公开(公告)号：US20190103290A1

公开(公告)日：2019-04-04

申请号：US15724251

申请日：2017-10-03

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Ernesto Ferrer Medina ,  Niru Kumari ,  Chih C. Shih ,  Sergio Escobar-Vargas

IPC: H01L21/48 ,  H01L23/367 ,  H05K7/20

Abstract: In some examples, a multiple chip module (MCM) includes a heat sink; a circuit board; a first chip secured to a first location on the circuit board; a first vapor chamber thermally coupled to the first chip to pass heat generated by the first chip to the heat sink; a second chip secured to a second location on the circuit board; and a second vapor chamber thermally coupled to the second chip to pass heat generated by the second chip to the heat sink. In some examples, a portion of the second vapor chamber is positioned between a portion of the first vapor chamber and the heat sink. In some examples, the first vapor chamber is substantially thermally insulated from the second vapor chamber.

公开(公告)号：US11876345B2

公开(公告)日：2024-01-16

申请号：US17015001

申请日：2020-09-08

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Di Liang ,  Chih C. Shih ,  Kevin B. Leigh ,  Geza Kurczveil ,  Marco Fiorentino

IPC: H01S5/024 ,  H01S5/0237 ,  H01S5/0239 ,  H01S5/187 ,  H01S5/40 ,  H01S5/00

CPC classification number: H01S5/02469 ,  H01S5/0237 ,  H01S5/0239 ,  H01S5/02476 ,  H01S5/187 ,  H01S5/0085 ,  H01S5/4025

Abstract: Techniques and systems for a semiconductor laser, namely a grating-coupled surface-emitting (GCSE) comb laser, having thermal management for facilitating dissipation of heat, integrated thereon. The thermal management is structured in manner that prevents deformation or damage to the GCSE laser chips included in the semiconductor laser implementation. The disclosed thermal management elements integrated in the laser can include: heat sinks; support bars; solder joints; thermal interface material (TIM); silicon vias (TSV); and terminal conductive sheets. Support bars, for example, having the GCSE laser chip positioned between the bars and having a height that is higher than a thickness of the GCSE laser chip. Accordingly, the heat sink can be placed on top of the support bars such that heat is dissipated from the GCSE laser chip, and the heat sink is separated from directed contact with the GCSE laser chip due to the height of the support bars.