公开(公告)号：US20190227606A1

公开(公告)日：2019-07-25

申请号：US16369144

申请日：2019-03-29

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John Franz ,  Tahir Cader ,  Cullen E. Bash ,  Niru Kumari ,  Sarah Anthony ,  Sergio Escobar-Vargas ,  Siamak Tavallaei

IPC: G06F1/20 ,  H05K7/20

Abstract: Apparatuses associated with liquid coolant supply are disclosed. One example apparatus is a computing cartridge which includes a first electronic device and a liquid-cooled cold plate. The computing cartridge also includes a first thermal couple between the first electronic device and the cold plate. The computing cartridge also includes an inlet fluid connector. The inlet fluid connector may supply a liquid coolant to the cold plate. The computing cartridge also includes an outlet fluid connector. The outlet fluid connector may facilitate return of the coolant from the cold plate.

公开(公告)号：US09953897B2

公开(公告)日：2018-04-24

申请号：US15216969

申请日：2016-07-22

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Niru Kumari ,  Sergio Escobar-Vargas

IPC: H01L23/498 ,  H01L23/473

CPC classification number: H01L23/473 ,  H01L23/367 ,  H01L23/3738 ,  H01L23/49894

Abstract: A device comprises a first layer of a die. The first layer comprises a microchannel. The microchannel is partially filled with a liquid and partially filled with air. The die also comprises a second layer. The second layer of the die seals a top of the microchannel of the first layer.

公开(公告)号：US20180090415A1

公开(公告)日：2018-03-29

申请号：US15277185

申请日：2016-09-27

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Sergio Escobar-Vargas ,  Cullen E. Bash ,  Niru Kumari

IPC: H01L23/427 ,  H01L25/065

CPC classification number: H01L23/427 ,  H01L25/0657 ,  H01L2225/06562 ,  H01L2225/06582 ,  H01L2225/06589

Abstract: Examples described herein include heat dissipating apparatuses with phase change material. In some examples, a heat dissipating apparatus comprises a wick structure to carry a cooling fluid to cool an electronic heat source, a vapor region to carry heated cooling fluid away from the wick structure, and a compartmentalized space separate from the vapor region comprising a phase change material to absorb energy from the heated cooling fluid.

公开(公告)号：US20180025964A1

公开(公告)日：2018-01-25

申请号：US15216969

申请日：2016-07-22

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Niru Kumari ,  Sergio Escobar-Vargas

IPC: H01L23/473 ,  H01L23/498

CPC classification number: H01L23/473 ,  H01L23/367 ,  H01L23/3738 ,  H01L23/49894

Abstract: A device comprises a first layer of a die. The first layer comprises a microchannel. The microchannel is partially filled with a liquid and partially filled with air. The die also comprises a second layer. The second layer of the die seals a top of the microchannel of the first layer.

公开(公告)号：US20190103290A1

公开(公告)日：2019-04-04

申请号：US15724251

申请日：2017-10-03

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Ernesto Ferrer Medina ,  Niru Kumari ,  Chih C. Shih ,  Sergio Escobar-Vargas

IPC: H01L21/48 ,  H01L23/367 ,  H05K7/20

Abstract: In some examples, a multiple chip module (MCM) includes a heat sink; a circuit board; a first chip secured to a first location on the circuit board; a first vapor chamber thermally coupled to the first chip to pass heat generated by the first chip to the heat sink; a second chip secured to a second location on the circuit board; and a second vapor chamber thermally coupled to the second chip to pass heat generated by the second chip to the heat sink. In some examples, a portion of the second vapor chamber is positioned between a portion of the first vapor chamber and the heat sink. In some examples, the first vapor chamber is substantially thermally insulated from the second vapor chamber.

公开(公告)号：US09997434B2

公开(公告)日：2018-06-12

申请号：US15311569

申请日：2014-05-19

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Niru Kumari ,  Tahir Cader ,  Sergio Escobar-Vargas ,  Cullen E. Bash

IPC: H05K7/20 ,  H01L23/473 ,  H01L23/427 ,  H01L23/34 ,  H01L25/065 ,  H01L23/02 ,  H01L25/18 ,  H01L23/44 ,  H01L23/467 ,  H01L23/48

CPC classification number: H01L23/427 ,  H01L23/02 ,  H01L23/34 ,  H01L23/44 ,  H01L23/467 ,  H01L23/473 ,  H01L23/4735 ,  H01L23/481 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/18 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An example device in accordance with an aspect of the present disclosure includes a substrate that may be disposed in a housing. The substrate includes a sprayer to spray coolant.

公开(公告)号：US20170084514A1

公开(公告)日：2017-03-23

申请号：US15311569

申请日：2014-05-19

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Niru Kumari ,  Tahir Cader ,  Sergio Escobar-Vargas ,  Cullen E. Bash

IPC: H01L23/427 ,  H01L25/065 ,  H01L25/18 ,  H01L23/473 ,  H01L23/02

CPC classification number: H01L23/427 ,  H01L23/02 ,  H01L23/34 ,  H01L23/44 ,  H01L23/467 ,  H01L23/473 ,  H01L23/4735 ,  H01L23/481 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/18 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An example device in accordance with an aspect of the present disclosure includes a substrate that may be disposed in a housing. The substrate includes a sprayer to spray coolant.