公开(公告)号：US20190334266A1

公开(公告)日：2019-10-31

申请号：US15966392

申请日：2018-04-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Victoria Doehring-Patel ,  Kevin Conn

IPC: H01R12/73 ,  H01R25/00 ,  H01R12/70 ,  H01R43/20 ,  H01R43/16 ,  H01R13/04

Abstract: A double stack connector electrically connects a PCB to a first and a second M.2 module. The connector includes a plurality of pins that form a first row of pins and a second row of pins for connection to PCB at one end, and to the first and second M.2 modules at a second end. The PCB is able to concurrently operate the first and second M.2 modules via the first and the second row of pins of the connector.

公开(公告)号：US20210352821A1

公开(公告)日：2021-11-11

申请号：US17277772

申请日：2018-11-08

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Kevin Conn ,  Pinche Tsai ,  Kevin Sauer

IPC: H05K7/20 ,  H05K1/02

Abstract: In some embodiments, an apparatus comprises an integrated circuit module comprising two layers of thermal interface material, a printed circuit assembly disposed between the two layers of thermal interface material and comprising a plurality of integrated circuits disposed on both sides of a circuit board, wherein at least one of the integrated circuits is thermally coupled with one of the layers of thermal interface material, and two heat spreaders adapted to removably retain one another, and when retaining one another to enclose and become thermally coupled with the two layers of thermal interface material; and a printed circuit board having a connector disposed thereon, wherein a connector edge of the printed circuit assembly is disposed within the connector. In other embodiments, a frame is adapted to retain the two heat spreaders.

公开(公告)号：US10514735B2

公开(公告)日：2019-12-24

申请号：US15757973

申请日：2015-09-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Mohammed Fai Qureshi ,  Kevin Conn ,  Victoria Jeanine Doehring

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  G06F1/20 ,  G06F1/18 ,  G05B15/02

Abstract: According to some examples, solutions are provided for setting a cooling system of a computer system chassis by a positionable cover disposed on a computer hardware component receivable by the computer system chassis.

公开(公告)号：US20190267586A1

公开(公告)日：2019-08-29

申请号：US16318133

申请日：2016-07-29

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Kevin Conn ,  Chanh V Hua

IPC: H01M2/10 ,  H01R12/70 ,  H01R12/71 ,  H01R13/502

Abstract: Examples described herein relate to coin cell battery housing. In one example, a device for housing a coin cell battery includes a receptacle to receive the coin cell battery, a connector to couple the device to an electronic board, and a hinge to couple the receptacle to the connector. The hinge is to allow rotation of the receptacle in a horizontal position and a vertical position, where in the horizontal position, a gap is maintained between the receptacle and the board such that a component can be mounted on the board under the receptacle.

公开(公告)号：US11678465B2

公开(公告)日：2023-06-13

申请号：US17277772

申请日：2018-11-08

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Kevin Conn ,  Pinche Tsai ,  Keith Sauer

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/2039 ,  H05K1/0203

Abstract: In some embodiments, an apparatus comprises an integrated circuit module comprising two layers of thermal interface material, a printed circuit assembly disposed between the two layers of thermal interface material and comprising a plurality of integrated circuits disposed on both sides of a circuit board, wherein at least one of the integrated circuits is thermally coupled with one of the layers of thermal interface material, and two heat spreaders adapted to removably retain one another, and when retaining one another to enclose and become thermally coupled with the two layers of thermal interface material; and a printed circuit board having a connector disposed thereon, wherein a connector edge of the printed circuit assembly is disposed within the connector. In other embodiments, a frame is adapted to retain the two heat spreaders.

公开(公告)号：US11248723B2

公开(公告)日：2022-02-15

申请号：US16654420

申请日：2019-10-16

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Daniel W. Tower ,  Kevin Bold ,  Kevin Conn

IPC: F16L3/12 ,  H05K7/14

Abstract: A cable management arm basket clip, comprising: a latch to secure the cable management arm basket clip to a cable management arm basket; a connection to pivotally connect the cable management arm basket clip to the cable management arm basket; and guards disposed on both sides of the cable management arm basket clip to allow for passage of cables and to protect cables.

公开(公告)号：US20180246549A1

公开(公告)日：2018-08-30

申请号：US15757973

申请日：2015-09-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Mohammed Fai Qureshi ,  Kevin Conn ,  Victoria Jeanine Doehring

IPC: G06F1/20 ,  G06F1/18 ,  G05B15/02

CPC classification number: G06F1/20 ,  G05B15/02 ,  G06F1/18 ,  G06F1/181

Abstract: According to some examples, solutions are provided for setting a cooling system of a computer system chassis by a positionable cover disposed on a computer hardware component receivable by the computer system chassis.