公开(公告)号：US09966678B2

公开(公告)日：2018-05-08

申请号：US15329474

申请日：2014-07-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Chin-Lung Chiang ,  Jyun-Jie Wang ,  Meng-Chen Wu ,  Raghavan V Venugopal ,  Patrick Raymond ,  Andrew Potter

IPC: H01R12/00 ,  H01R12/72 ,  H01R12/71 ,  H01R13/24

CPC classification number: H01R12/721 ,  H01R12/716 ,  H01R13/2457

Abstract: A Next Generation Form Factor (NGFF) connector apparatus can include a plurality of upper signal pins and an upper ground (GND) pin that is longer than other upper pins. The NGFF connector apparatus can also include a plurality of lower signal pins and a lower power (PWR) pin that is longer than other lower pins.