公开(公告)号：US20200167219A1

公开(公告)日：2020-05-28

申请号：US16775987

申请日：2020-01-29

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John NORTON ,  James Jeffery SCHULZE ,  Reza M. BACCHUS ,  Robert C. ELLIOTT ,  Troy A. DELLA FIORA ,  Keith SAUER ,  Darrel G. GASTON

IPC: G06F11/07 ,  G06F1/30

Abstract: An apparatus comprising: a drive carrier assembly (DCA) including; an energy storage device having at least a portion thereof encased by a housing; and a printed circuit assembly to detect a power failure of a host computing device, wherein the printed circuit assembly has a first portion coupled to the energy storage device and a second portion coupled to a backplane of the host computing device

公开(公告)号：US20180218763A1

公开(公告)日：2018-08-02

申请号：US15899514

申请日：2018-02-20

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Reza M. BACCHUS ,  Melvin K. BENEDICT ,  Stephen F. CONTRERAS ,  Eric L. POPE ,  Chi K. SIDES ,  Chun-Pin HUANG

IPC: G11C11/4074 ,  G11C5/06 ,  G11C5/10

CPC classification number: G11C11/4074 ,  G11C5/04 ,  G11C5/06 ,  G11C5/10 ,  G11C5/147

Abstract: An example device in accordance with an aspect of the present disclosure includes a memory module having a voltage regulator module (VRM) to receive input power and deliver output power to components of the memory module at a first power plane. A sufficient number of stitching capacitors are to couple the first power plane to a second power plane.

公开(公告)号：US20170243626A1

公开(公告)日：2017-08-24

申请号：US15500070

申请日：2015-02-27

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Reza M. BACCHUS ,  Melvin K. BENEDICT ,  Stephen F. CONTRERAS ,  Eric L. POPE ,  Chi K. SIDES ,  Chun-Pin HUANG

IPC: G11C11/4074

CPC classification number: G11C11/4074 ,  G11C5/04 ,  G11C5/06 ,  G11C5/10 ,  G11C5/14 ,  G11C5/147 ,  G11C11/401

Abstract: An example device in accordance with an aspect of the present disclosure includes a memory module having a voltage regulator module (VRM) to receive input power and deliver output power to components of the memory module at a first power plane. At least one stitching capacitor is to couple the first power plane to a second power plane.