公开(公告)号：US20190227604A1

公开(公告)日：2019-07-25

申请号：US15879850

申请日：2018-01-25

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Richard A. Bargerhuff ,  Eric Todd

IPC: G06F1/18 ,  G06F1/26

Abstract: Example implementations relate to server bezels. For instance, in an example, a server bezel includes an attachment mechanism, a housing to couple via the attachment mechanism to a front face of a server chassis, the housing defining at least a portion of a cavity to receive a backup power source, and power circuitry to couple the backup power source when located in the cavity to corresponding power circuitry in the server.

公开(公告)号：US20180017064A1

公开(公告)日：2018-01-18

申请号：US15210192

申请日：2016-07-14

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Rachel Pollock ,  Sze Hau Loh ,  Richard A. Bargerhuff ,  Giang Tran ,  Kai Zhang

IPC: F04D27/00 ,  F04D29/26 ,  F04D25/06

CPC classification number: F04D27/001 ,  F05D2230/72

Abstract: In various examples, a fan comprises a fan rotor, logic, and a component electrically coupled to the fan rotor to control operation of the fan rotor. The logic may determine that the component has failed. Responsive to determining that the component has failed, the logic to cause a backup component to apply power to the fan rotor, wherein applying the power causes blades of the fan to reduce spinning.

公开(公告)号：US20180018001A1

公开(公告)日：2018-01-18

申请号：US15546070

申请日：2015-01-31

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Thomas R. Bowden ,  Richard A. Bargerhuff ,  Sammy L. Zimmerman ,  Tahir Cader

IPC: G06F1/20 ,  H05K7/20

Abstract: In one implementation, a system for a memory cooling pad includes a first thermal interface material coupled to a second thermal interface material by a liner material configured to position the first thermal interface material on a first side of a memory unit and to position the second thermal interface material on a second side of the memory unit.