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Patent Agency Ranking
公开(公告)号：US20190210366A1
公开(公告)日：2019-07-11
申请号：US16301132
申请日：2016-08-03
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Anthony M Fuller , Terry McMahon , Donald W Schulte , Amy Gault
CPC classification number: B41J2/1433 , B41J2/14072 , B41J2/1601 , B41J2/162 , B41J2/1629 , B41J2/1634 , B41J2002/14491 , G01N27/20
Abstract: A conductive wire disposed in a layer is described. An example apparatus includes a die including a silicon layer and a first layer coupled to the silicon layer. The example apparatus a conductive wire disposed in the first layer adjacent a perimeter of a location at which a fluid feed slot is to be formed in the silicon layer. The conductive wire has an electrical characteristic that corresponds to whether the fluid feed slot is defective.
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公开(公告)号：US20200269581A1
公开(公告)日：2020-08-27
申请号：US16305528
申请日：2016-09-19
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Anthony M Fuller , Terry McMahon , Donald W Schulte
Abstract: In one example in accordance with the present disclosure, a fluid ejection device is described. The fluid ejection device includes a substrate and a number of nozzles formed within the substrate to eject fluid. A number of bond pads are disposed on the substrate and are electrically coupled to the number of rows of nozzles. A termination ring is disposed on the substrate and surrounds the rows of nozzles. The termination ring includes a first metallic layer that is an enclosed shape and a second metallic layer that is disposed on top of the first metallic layer. The second metallic layer includes a gap positioned adjacent the number of bond pads.
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公开(公告)号：US11097537B2
公开(公告)日：2021-08-24
申请号：US16485214
申请日：2017-04-24
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Chien-Hua Chen , Michael W Cumbie , Anthony M Fuller
Abstract: A fluid ejection device includes a molded body having a first molded surface and a second molded surface opposite the first molded surface, and a fluid ejection die molded into the molded body, with the fluid ejection die having a first surface substantially coplanar with the first molded surface of the molded body and a second surface substantially coplanar with the second molded surface of the molded body, with the first surface of the fluid ejection die having a plurality of fluid ejection orifices formed therein and the second surface of the fluid ejection die having at least one fluid feed slot formed therein.
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公开(公告)号：US10933634B2
公开(公告)日：2021-03-02
申请号：US16301132
申请日：2016-08-03
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Anthony M Fuller , Terry McMahon , Donald W Schulte , Amy Gault
Abstract: A conductive wire disposed in a layer is described. An example apparatus includes a die including a silicon layer and a first layer coupled to the silicon layer. The example apparatus a conductive wire disposed in the first layer adjacent a perimeter of a location at which a fluid feed slot is to be formed in the silicon layer. The conductive wire has an electrical characteristic that corresponds to whether the fluid feed slot is defective.
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公开(公告)号：US10814629B2
公开(公告)日：2020-10-27
申请号：US16305528
申请日：2016-09-19
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Anthony M Fuller , Terry McMahon , Donald W Schulte
Abstract: In one example in accordance with the present disclosure, a fluid ejection device is described. The fluid ejection device includes a substrate and a number of nozzles formed within the substrate to eject fluid. A number of bond pads are disposed on the substrate and are electrically coupled to the number of rows of nozzles. A termination ring is disposed on the substrate and surrounds the rows of nozzles. The termination ring includes a first metallic layer that is an enclosed shape and a second metallic layer that is disposed on top of the first metallic layer. The second metallic layer includes a gap positioned adjacent the number of bond pads.
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