公开(公告)号：US20220063189A1

公开(公告)日：2022-03-03

申请号：US17288550

申请日：2019-04-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Sterling Chaffins ,  Thomas A. Saksa ,  Kevin P. DeKam ,  Juan Sebastian Ramirez ,  Dale Peterson ,  Jami Ryan Barone

IPC: B29C64/165 ,  B29C64/295 ,  B29C64/268

Abstract: Methods and systems for making three-dimensional printed articles. In one example, a method of making a three-dimensional article can include printing a conductive element including a composite of a conductive material and a polymeric build material; printing an adjacent portion in contact with the conductive element, where the adjacent portion includes a nonconductive polymeric build material; and heating the conductive element by running an electric current through the conductive element, and thereby heating the adjacent portion to a temperature sufficient to change a physical property of the nonconductive polymeric build material of the adjacent portion.

公开(公告)号：US12138860B2

公开(公告)日：2024-11-12

申请号：US17288550

申请日：2019-04-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Sterling Chaffins ,  Thomas A. Saksa ,  Kevin P. DeKam ,  Juan Sebastian Ramirez ,  Dale Peterson ,  Jami Ryan Barone

IPC: B29C64/295 ,  B22F1/054 ,  B22F1/10 ,  B29C64/165 ,  B29C64/268 ,  B33Y70/10 ,  B33Y10/00 ,  B33Y30/00

Abstract: Methods and systems for making three-dimensional printed articles. In one example, a method of making a three-dimensional article can include printing a conductive element including a composite of a conductive material and a polymeric build material; printing an adjacent portion in contact with the conductive element, where the adjacent portion includes a nonconductive polymeric build material; and heating the conductive element by running an electric current through the conductive element, and thereby heating the adjacent portion to a temperature sufficient to change a physical property of the nonconductive polymeric build material of the adjacent portion.

公开(公告)号：US20250058519A1

公开(公告)日：2025-02-20

申请号：US18938212

申请日：2024-11-05

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Sterling Chaffins ,  Thomas A. Saksa ,  Kevin P. DeKam ,  Juan Sebastian Ramirez ,  Dale Peterson ,  Jami Ryan Barone

IPC: B29C64/295 ,  B22F1/054 ,  B22F1/10 ,  B29C64/165 ,  B29C64/268 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/10

Abstract: Methods and systems for making three-dimensional printed articles. In one example, a method of making a three-dimensional article can include printing a conductive element including a composite of a conductive material and a polymeric build material; printing an adjacent portion in contact with the conductive element, where the adjacent portion includes a nonconductive polymeric build material; and heating the conductive element by running an electric current through the conductive element, and thereby heating the adjacent portion to a temperature sufficient to change a physical property of the nonconductive polymeric build material of the adjacent portion.

公开(公告)号：US11738508B2

公开(公告)日：2023-08-29

申请号：US16756364

申请日：2017-11-17

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Sterling Chaffins ,  Kevin P DeKam ,  Kristopher J Erickson ,  Cory J Ruud ,  Jami Ryan Barone ,  Ruhua Cai ,  Anthony J Galvan

IPC: B29C64/165 ,  C08K3/08 ,  C08L77/02 ,  B33Y10/00 ,  B33Y70/00 ,  C08K3/04

CPC classification number: B29C64/165 ,  C08K3/08 ,  C08L77/02 ,  B33Y10/00 ,  B33Y70/00 ,  C08K3/042 ,  C08K2003/0806 ,  C08K2201/001 ,  C08K2201/005

Abstract: In an example, a composition for three-dimensional (3D) printing includes a polymer build material and a non-conductive fusing agent dispensable onto the polymer build material to form a polymer-fusing agent composite portion when heated to a sintering temperature, a conductive agent dispensable onto on the polymer build material to form a polymer-conductive agent composite portion when heated at least to the sintering temperature, the conductive agent comprising: at least one conductive particulate present in an amount of from about 10% to about 60% of a total weight of the conductive agent; at least one co-solvent present in an amount of from about 10% to about 50% of a total weight of the conductive agent; and an additive present in an amount of from about 0% to about 10% of a total weight of the conductive agent.